DB3 DIAC 36V 0.05mA 2-Pin DO-35[video]: Datasheet, Features, and Applications
STMICROELECTRONICS - DB3 - DIAC / SIDAC, 28 V, 36 V, 100 µA, DO-35, 2 Pins - DIAC / SIDAC, 28 V, 36 V, 100 µA, DO-35, 2 Pins









STMICROELECTRONICS - DB3 - DIAC / SIDAC, 28 V, 36 V, 100 µA, DO-35, 2 Pins - DIAC / SIDAC, 28 V, 36 V, 100 µA, DO-35, 2 Pins
DB3 is a semiconductor product. This article is going to introduce pinout, applications, features, and more details about DB3.

what is DB3 or what is diac
Overview of DB3
The DB3 can be used in conjunction with triacs for simplified gate control circuits or as a beginning element in fluorescent bulb ballasts since it functions as a trigger diode with a fixed voltage reference. Compact, SMD-based designs for automated production are possible with the surface mount SOT23-3L package.
DB3 Features
• VBO: 32 V and 40 V
• Low breakover current
• Breakover voltage symmetry: 3V
• ECOPACK®2 compliant
DB3 3D Model

DB3 Symbol

DB3 Footprint

DB3 3D Model
Specifications
- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 8 months ago) - Factory Lead Time11 Weeks
- Contact Plating
Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.
Tin - Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Through Hole - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
DO-204AH, DO-35, Axial - Number of Pins2
- Weight137.013245mg
- Breakdown Voltage / V32V
- Number of Elements1
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~125°C TJ - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Number of Terminations2
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8541.30.00.80 - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
WIRE - Current Rating
Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.
2A - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
DB3 - Max Output Current
The maximum current that can be supplied to the load.
2A - Configuration
The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.
SINGLE - Case Connection
Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.
ISOLATED - Trigger Device Type
Trigger Device Type is a parameter in electronic components that refers to the type of device or mechanism used to initiate a specific action or function within the component. This parameter specifies the specific trigger device, such as a sensor, switch, or signal input, that is required to activate or control the operation of the component. Understanding the trigger device type is crucial for proper integration and operation of the electronic component within a larger system or circuit. By specifying the appropriate trigger device type, engineers and designers can ensure that the component functions correctly and responds to the intended input signals or conditions.
DIAC - Voltage - Breakover
Voltage - Breakover is a parameter that refers to the voltage level at which a specific electronic component, such as a thyristor or a gas discharge tube, transitions from a high-resistance state to a low-resistance state. This transition is known as the breakover voltage, and it is a critical characteristic in determining the operating conditions and performance of the component. When the breakover voltage is reached, the component essentially "breaks over" and allows a significant current to flow through it. Understanding the breakover voltage is essential for designing and using electronic circuits effectively, as it helps ensure proper functionality and protection against voltage surges or overloads.
28V~36V - Current - Breakover
The parameter "Current - Breakover" is typically associated with thyristors, which are semiconductor devices used for switching and controlling electrical power in various applications. Breakover current refers to the minimum current required to trigger the thyristor into the conducting state, allowing it to switch from its non-conducting state to a conducting state. This parameter is crucial for determining the reliability and performance of the thyristor in a circuit.In simpler terms, the breakover current is the threshold current level that must be exceeded to turn on the thyristor and allow current to flow through it. It is an important specification to consider when designing circuits that involve thyristors, as it ensures proper operation and prevents accidental triggering. Manufacturers provide this parameter in the datasheet of the thyristor to help engineers select the appropriate component for their specific application requirements.
50μA - Height2mm
- Length4.5mm
- Width2mm
- REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
No SVHC - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
DB3 Electrical characteristics
| Symbol | Parameter | Test conditions | SMDB3 | DB3 | DB4 | Unit | |
| VBO | Breakover voltage | C = 10 nF | Min. | 28 | 28 | 35 | V |
| Typ. | 32 | 32 | 40 | ||||
| Max. | 36 | 36 | 45 | ||||
| I VBO1 - VBO2 I | Breakover voltage symmetry | C = 10 nF | Max. | 3 | 3 | 3 | V |
| Δ V | Dynamic breakover voltage | VBO and VF at 10 mA | Min. | 10 | 5 | 5 | V |
| VO | Output voltage | See Figure 2. Test circuit, (R = 20 Ω | Min. | 10 | 5 | 5 | V |
| IBO | Breakover current | C = 10 nF | Max. | 10 | 50 | 50 | µA |
| tr | Rise time | See Figure 3. Rise time measurement | Max. | 0.5 | 2 | 2 | µs |
| IR | Leakage current | VR = 0.5 x VBO max | Max. | 1 | 10 | 10 | µA |
| IP | Peak current | See Figure 2. Test circuit | Min. | 1 | 0.3 | 0.3 | A |

Figure 2. Test circuit

Figure 3. Rise time measurement
DB3 Applications
Triac or SCR based motor / light dimmer triggering mechanism
Oscillator circuit trigger device (32 V)
For CFL, TL, or LED bulbs, turn on the triggering in the lighting ballast.
Power Management
Consumer Electronics
Portable Devices
Industrial
DB3 Package information

DB3 Package information
| Ref. | Dimensions | |||
| Millimeters | Inches (for reference only) | |||
| Min. | Max. | Min. | Max. | |
| A | 3.05 | 4.5 | 0.12 | 0.177 |
| B | 1.53 | 2 | 0.06 | 0.079 |
| C | 28 | 31 | 1.102 | 1.22 |
| D | 0.46 | 0.55 | 0.018 | 0.022 |
DB3 Manufacturer
STMicroelectronics is a leading global independent semiconductor firm that develops and delivers semiconductor solutions for a wide range of microelectronics applications. The Company is at the forefront of System-on-Chip (SoC) technology, and its products play a major role in supporting today's convergence trends, thanks to an unparalleled mix of silicon and system expertise, manufacturing capabilities, Intellectual Property (IP) portfolio, and strategic partners.
Datasheet PDF
- Datasheets :
Popularity by Region
How many pins of DB3?
3 pins.
What’s the operating temperature of DB3?
-40°C~125°C TJ.
What’s the packaging way of DB3?
Tape & Reel (TR).
What’s the Max Output Current of DB3?
2A.
What’s the Breakdown Voltage of DB3?
32V.
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