MCF532x ColdFire® Microprocessor Datasheet Overview

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Published: 29 February 2024 | Last Updated: 29 February 2024

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MCF53281CVM240J

MCF53281CVM240J

Rochester Electronics, LLC

ROMless Coldfire V3 32-Bit Microcontroller MCF532x Series 256-LBGA

Purchase Guide

ROMless Coldfire V3 32-Bit Microcontroller MCF532x Series 256-LBGA

This technical article provides a comprehensive overview of the MCF532x ColdFire® Microprocessor, focusing on its features, technical specifications, hardware considerations, and electrical characteristics. It aims to deliver detailed insights into the capabilities and functionalities of this microprocessor.

Product Introduction

Description
The MCF532x ColdFire® microprocessor features the Version 3 ColdFire variable-length RISC processor core, offering system debug support, JTAG support, and a range of on-chip memories. It includes specialized functionalities such as power management, LCD and VoIP solutions, SDR/DDR SDRAM controller, USB host and OTG controller, FEC, and various communication interfaces including UARTs, I2C, QSPI, and FlexCAN. The microprocessor is also equipped with timers, a real-time clock, interrupt controllers, DMA, and a FlexBus for external interface.

Features
The features of the MCF532x microprocessor include a versatile suite of functionalities such as hardware accelerators, communication interfaces, timers, watchdog timers, interrupt controllers, and power management capabilities. It also incorporates a FlexBus for external interfaces, a reset controller, and a comprehensive general-purpose I/O interface.

Applications
The MCF532x microprocessor is well-suited for a wide range of embedded applications including consumer electronics, industrial control, communications, networking, and automotive systems. Its diverse features and robust processing capabilities make it an ideal choice for demanding and versatile embedded applications.

FAQs
1. Q:What are the key features of the MCF532x ColdFire® microprocessor?
  A:The microprocessor offers a wide range of features including communication interfaces, timers, DMA, power management, and a comprehensive general-purpose I/O interface.

2. Q:What applications is the MCF532x ColdFire® microprocessor suitable for?
  A:The microprocessor is suitable for consumer electronics, industrial control, communications, networking, and automotive systems.

3. Q:Are there reference designs available for the MCF532x ColdFire® microprocessor?
  A:The datasheet may include reference designs and application notes that provide insights into utilizing the microprocessor for specific applications.

This comprehensive overview of the MCF532x ColdFire® microprocessor provides engineers and developers with insights into its capabilities, enabling them to make informed decisions regarding its use in their projects.

Specifications

Rochester Electronics, LLC MCF53281CVM240J technical specifications, attributes, parameters and parts with similar specifications to Rochester Electronics, LLC MCF53281CVM240J.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    256-LBGA
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    256-MAPBGA (17x17)
  • Number of I/Os
    94
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    MCF532x
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    External
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    240MHz
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    32K x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    1.4V~3.6V
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    Coldfire V3
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    DMA, LCD, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    ROMless
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    32-Bit
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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MCF53281CVM240J

Rochester Electronics, LLC

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