PIC18F4520 Microcontroller: Features, Pinout, and Datasheet [Video&FAQ]

Sophie

Published: 29 November 2021 | Last Updated: 29 November 2021

10523

PIC18F4520-I/PT

PIC18F4520-I/PT

Microchip Technology

32KB 16K x 16 FLASH PIC 8-Bit Microcontroller PIC® 18F Series PIC18F4520 44 Pin 40MHz 5V 44-TQFP

Purchase Guide

32KB 16K x 16 FLASH PIC 8-Bit Microcontroller PIC® 18F Series PIC18F4520 44 Pin 40MHz 5V 44-TQFP

PIC18F4520 is a Microchip PIC microcontroller that is mostly utilized in automation and embedded systems. It is available in three packages: PDIP, QFN, and TQFP. The first is a 40-pin package (which is the most common), while the other two have a 44-pin interface. This article mainly introduces features, pinout, datasheet and other information about Microchip Technology PIC18F4520.

This video will show you the proteus simulation of interfacing of LCD with PIC18F4520 microcontroller and its program explanation.

LCD interfacing with PIC18F4520

PIC18F4520 Description

PIC18F4520 is a Microchip PIC microcontroller that is mostly utilized in automation and embedded systems. It is available in three packages:  PDIP ,  QFN , and  TQFP . The first is a 40-pin package (which is the most common), while the other two have a 44-pin interface. 

 

This microcontroller version has a CPU, timers, a 10-bit ADC, and other peripherals for developing connections with external devices. This PIC version, like others in the PIC community, includes everything needed to build an embedded system and automate processes.

 

The PIC18F4520 has 32K of program memory, 256 bytes of EEPROM data memory, 1536 bytes of RAM, and 256 bytes of EEPROM data memory,  It also has two comparators, a 10-bit A/D converter with 13 channels, and decent memory endurance of roughly 1,000,000 for EEPROM  and 100,000 for program memory,  EUSART (Enhanced Universal Asynchronous Receiver Transmitter  ) is a feature that can be used to develop serial connections with other devices.

 

The chip includes an asynchronous serial port that can be connected in either direction, using either the 3-wire Serial Peripheral Interface  (SPI™) or the 2-wire Inter-Integrated Circuit (I²C™) Bus.


PIC18F4520 Pinout

The following figure is PIC18F4520 Pinout.

pinout.jpg

Pinout

Pin NumberPin NameDescription
18MCLR/VPP/RE3
MCLR
VPP
RE3
Master Clear (input) or programming voltage (input).
Master Clear (Reset) input. This pin is an active-low
Reset to the device.
Programming voltage input.
Digital input.
30OSC1/CLKI/RA7
OSC1
CLKI
RA7
Oscillator crystal or external clock input.
Oscillator crystal input or external clock source input.
ST buffer when configured in RC mode;
analog otherwise.
External clock source input. Always associated with
pin function, OSC1. (See related OSC1/CLKI,
OSC2/CLKO pins.)
General purpose I/O pin.
31OSC2/CLKO/RA6
OSC2
CLKO
RA6
Oscillator crystal or clock output.
Oscillator crystal output. Connects to crystal
or resonator in Crystal Oscillator mode.
In RC mode, OSC2 pin outputs CLKO which
has 1/4 the frequency of OSC1 and denotes
the instruction cycle rate.
General purpose I/O pin.


PORTA is a bidirectional I/O port.
19RA0/AN0
RA0
AN0
Digital I/O.
Analog input 0.
20RA1/AN1
RA1
AN1
Digital I/O.
Analog input 1.
21RA2/AN2/VREF-/CVREF
RA2
AN2
VREF-
CVREF
Digital I/O.
Analog input 2.
A/D reference voltage (low) input.
Comparator reference voltage output.
22RA3/AN3/VREF+
RA3
AN3
VREF+
Digital I/O.
Analog input 3.
A/D reference voltage (high) input.
23RA4/T0CKI/C1OUT
RA4
T0CKI
C1OUT
Digital I/O.
Timer0 external clock input.
Comparator 1 output.
24RA5/AN4/SS/HLVDIN/C2OUT
RA5
AN4
SS
HLVDIN
C2OUT
Digital I/O.
Analog input 4.
SPI slave select input.
High/Low-Voltage Detect input.
Comparator 2 output.

RA6See the OSC2/CLKO/RA6 pin.

RA7See the OSC1/CLKI/RA7 pin.


PORTB is a bidirectional I/O port. PORTB can be
software programmed for internal weak pull-ups on all
inputs.
8RB0/INT0/FLT0/AN12
RB0
INT0
FLT0
AN12
Digital I/O.
External interrupt 0.
PWM Fault input for Enhanced CCP1.
Analog input 12.
9RB1/INT1/AN10
RB1
INT1
AN10
Digital I/O.
External interrupt 1.
Analog input 10.
10RB2/INT2/AN8
RB2
INT2
AN8
Digital I/O.
External interrupt 2.
Analog input 8.
11RB3/AN9/CCP2
RB3
AN9
CCP2(1)
Digital I/O.
Analog input 9.
Capture 2 input/Compare 2 output/PWM2 output.
14RB4/KBI0/AN11
RB4
KBI0
AN11
Digital I/O.
Interrupt-on-change pin.
Analog input 11.
15RB5/KBI1/PGM
RB5
KBI1
PGM
Digital I/O.
Interrupt-on-change pin.
Low-Voltage ICSP™ Programming enable pin.
16RB6/KBI2/PGC
RB6
KBI2
PGC
Digital I/O.
Interrupt-on-change pin.
In-Circuit Debugger and ICSP programming
clock pin.
17RB7/KBI3/PGD
RB7
KBI3
PGD
Digital I/O.
Interrupt-on-change pin.
In-Circuit Debugger and ICSP programming
data pin.


PORTC is a bidirectional I/O port.
32RC0/T1OSO/T13CKI
RC0
T1OSO
T13CKI
Digital I/O.
Timer1 oscillator output.
Timer1/Timer3 external clock input.
35RC1/T1OSI/CCP2
RC1
T1OSI
CCP2(2)
Digital I/O.
Timer1 oscillator input.
Capture 2 input/Compare 2 output/PWM2 output.
36RC2/CCP1/P1A
RC2
CCP1
P1A
Digital I/O.
Capture 1 input/Compare 1 output/PWM1 output.
Enhanced CCP1 output.
37RC3/SCK/SCL
RC3
SCK
SCL
Digital I/O.
Synchronous serial clock input/output for
SPI mode.
Synchronous serial clock input/output for I²C™ mode.
42RC4/SDI/SDA
RC4
SDI
SDA
Digital I/O.
SPI data in.
I²C data I/O.
43RC5/SDO
RC5
SDO
Digital I/O.
SPI data out.
44RC6/TX/CK
RC6
TX
CK
Digital I/O.
EUSART asynchronous transmit.
EUSART synchronous clock (see related RX/DT).
1RC7/RX/DT
RC7
RX
DT
Digital I/O.
EUSART asynchronous receive.
EUSART synchronous data (see related TX/CK).


PORTD is a bidirectional I/O port or a Parallel Slave
Port (PSP) for interfacing to a microprocessor port.
These pins have TTL input buffers when PSP module
is enabled.
38RD0/PSP0
RD0
PSP0
Digital I/O.
Parallel Slave Port data.
39RD1/PSP1
RD1
PSP1
Digital I/O.
Parallel Slave Port data.
40RD2/PSP2
RD2
PSP2
Digital I/O.
Parallel Slave Port data.
41RD3/PSP3
RD3
PSP3
Digital I/O.
Parallel Slave Port data.
2RD4/PSP4
RD4
PSP4
Digital I/O.
Parallel Slave Port data.
3RD5/PSP5/P1B
RD5
PSP5
P1B
Digital I/O.
Parallel Slave Port data.
Enhanced CCP1 output.
4RD6/PSP6/P1C
RD6
PSP6
P1C
Digital I/O.
Parallel Slave Port data.
Enhanced CCP1 output.
5RD7/PSP7/P1D
RD7
PSP7
P1D
Digital I/O.
Parallel Slave Port data.
Enhanced CCP1 output.


PORTE is a bidirectional I/O port.
25RE0/RD/AN5
RE0
RD
AN5
Digital I/O.
Read control for Parallel Slave Port
(see also WR and CS pins).
Analog input 5.
26RE1/WR/AN6
RE1
WR
AN6
Digital I/O.
Write control for Parallel Slave Port
(see CS and RD pins).
Analog input 6.
27RE2/CS/AN7
RE2
CS
AN7
Digital I/O.
Chip Select control for Parallel Slave Port
(see related RD and WR).
Analog input 7.

RE3See MCLR/VPP/RE3 pin.
6, 29VSSGround reference for logic and I/O pins.
7, 28VDDPositive supply for logic and I/O pins.
12, 13, 33, 34NCNo Connect.


PIC18F4520 CAD Model

The PIC18F4520 Symbol, Footprint and 3D Model are shown as follows.

symbol.png

Symbol

footprint.png

Footprint

3D Model.jpg

3D Model


PIC18F4520 Features

(1) Power Management Features 

• Run: CPU on, Peripherals on

• Idle: CPU off, Peripherals on

• Sleep: CPU off, Peripherals off

• Ultra Low 50nA Input Leakage

• Run mode Currents Down to 11 μA Typical

• Idle mode Currents Down to 2.5 μA Typical

• Sleep mode Current Down to 100 nA Typical

• Timer1 Oscillator: 900 nA, 32 kHz, 2V

• Watchdog Timer: 1.4 μA, 2V Typical

• Two-Speed Oscillator Start-up

(2) Flexible Oscillator Structure 

• Four Crystal modes, up to 40 MHz

• 4x Phase Lock Loop (PLL) – Available for Crystal and Internal Oscillators

• Two External RC modes, up to 4 MHz

• Two External Clock modes, up to 40 MHz

• Internal Oscillator Block:

- Fast wake from Sleep and Idle, 1 μs typical

- 8 use-selectable frequencies, from 31 kHz to 8 MHz

- Provides a complete range of clock speeds from 31 kHz to 32 MHz when used with PLL

- User-tunable to compensate for frequency drift

• Secondary Oscillator using Timer1 @ 32 kHz

• Fail-Safe Clock Monitor:

- Allows for safe shutdown if peripheral clock stops

(3) Peripheral Highlights

• High-Current Sink/Source 25 mA/25 mA

• Three Programmable External Interrupts

• Four Input Change Interrupts

• Up to 2 Capture/Compare/PWM (CCP) modules, one with Auto-Shutdown (28-pin devices)

• Enhanced Capture/Compare/PWM (ECCP) module (40/44-pin devices only):

- One, two or four PWM outputs 

- Selectable polarity

- Programmable dead time

- Auto-shutdown and auto-restart Peripheral Highlights (Continued):

• Master Synchronous Serial Port (MSSP) module Supporting 3-Wire  SPI  (all 4 modes) and I2C™ Master and Slave modes

• Enhanced Addressable USART module:

- Supports RS-485,  RS-232  and LIN/J2602

- RS-232 operation using internal oscillator block  (no external crystal required)

- Auto-wake-up on Start bit

- Auto-Baud Detect

• 10-Bit, up to 13-Channel Analog-to-Digital (A/D) Converter module:

- Auto-acquisition capability

- Conversion available during Sleep

• Dual Analog Comparators with Input Multiplexing

• Programmable 16-Level High/Low-Voltage Detection (HLVD) module:

- Supports interrupt on High/Low-Voltage Detection

(4) Special Microcontroller Features 

• C Compiler Optimized Architecture

- Optional extended instruction set designed to optimize re-entrant code

• 100,000 Erase/Write Cycle Enhanced Flash Program Memory Typical

• 1,000,000 Erase/Write Cycle Data EEPROM Memory Typical

• Flash/Data EEPROM Retention: 100 Years Typical

• Self-Programmable under Software Control

• Priority Levels for Interrupts

• 8 x 8 Single-Cycle Hardware Multiplier

• Extended Watchdog Timer (WDT)

- Programmable period from 4 ms to 131s

• Single-Supply 5V In-Circuit Serial Programming™ (ICSP™) via Two Pins

• In-Circuit Debug (ICD) via Two Pins

• Wide Operating Voltage Range: 2.0V to 5.5V

• Programmable Brown-out Reset (BOR) with Software Enable Option


Specifications

Microchip Technology PIC18F4520-I/PT technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology PIC18F4520-I/PT.
  • Type
    Parameter
  • Factory Lead Time
    7 Weeks
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    44-TQFP
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Number of Pins
    44
  • Watchdog Timers
    Yes
  • Number of I/Os
    36
  • Data Converters
    A/D 13x10b
  • Published
    2016
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    PIC® 18F
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    44
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn)
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    1W
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    40MHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    PIC18F4520
  • Pin Count

    a count of all of the component leads (or pins)

    44
  • Lead Pitch

    Lead pitch in electronic components refers to the distance between the center of one lead (or pin) of a component to the center of the adjacent lead. It is an important parameter to consider when designing and assembling electronic circuits, as it determines the spacing required on a circuit board for proper placement and soldering of the component. Lead pitch is typically specified in millimeters or inches and can vary depending on the type of component, such as integrated circuits, resistors, capacitors, and connectors. Choosing the correct lead pitch ensures proper alignment and connection of components on a circuit board, ultimately affecting the functionality and reliability of the electronic device.

    500μm
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    I2C, SPI, UART, USART
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    32kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Nominal Supply Current

    Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.

    1.1mA
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    1.5K x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    4.2V~5.5V
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROCONTROLLER, RISC
  • Number of Bits
    8
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    PIC
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    Brown-out Detect/Reset, HLVD, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    8-Bit
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    32KB 16K x 16
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    I2C, SPI, UART/USART
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    8
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    40 μs
  • Has ADC

    Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.

    YES
  • DMA Channels

    DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.

    NO
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    10 Mbps
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    8b
  • Number of Timers/Counters
    4
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    8b
  • Density

    In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.

    256 kb
  • EEPROM Size

    EEPROM Size refers to the amount of memory capacity available in an Electrically Erasable Programmable Read-Only Memory (EEPROM) chip. This parameter indicates the total storage space in bytes or bits that can be used to store data in a non-volatile manner. The EEPROM size determines the maximum amount of information that can be written, read, and erased from the memory chip. It is an important specification to consider when selecting an EEPROM for a particular application, as it directly impacts the amount of data that can be stored and accessed by the electronic component.

    256 x 8
  • CPU Family

    CPU Family refers to a classification of microprocessors that share a common architecture and design traits. It signifies a group of processors that are typically produced by the same manufacturer and have similar functionality and features. The CPU Family can encompass various models that may differ in performance, power consumption, and specific capabilities but retain a unified core design, allowing for compatibility with software and hardware. This classification helps users and developers to understand the performance characteristics and upgrade pathways of different CPU models within the same family.

    PIC
  • Number of A/D Converters
    1
  • Number of ADC Channels
    13
  • Number of PWM Channels
    5
  • Width
    10mm
  • Length
    10mm
  • Height
    1.05mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
0 Similar Products Remaining

Parts with Similar Specs

The three parts on the right have similar specifications to Microchip Technology & PIC18F4520-I/PT.

PIC18F4520 Functional Block Diagram

The following figure is PIC18F4520 Functional Block Diagram.

   block diagram1.png

block diagram2.png

Functional Block Diagram


PIC18F4520 Alternatives

Part NumberDescriptionManufacturer
PIC18F4520T-E/MLMICROCONTROLLERS AND PROCESSORS8-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PQCC44, 8 X 8 MM, PLASTIC, QFN-44Microchip Technology Inc
PIC18F4520-E/PTMICROCONTROLLERS AND PROCESSORS8-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PQFP44, 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-44Microchip Technology Inc


PIC18F4520 Applications

PIC18F4520 is widely used in home and industrial automation

• Student projects for motor controlling and sensor interfacing

• GPS and security systems

• Gas sensor projects

• Production of temperature data logger

• Serial Communication

• Central heating projects

• Embedded system


PIC18F4520 Package

The PIC18F4520 Package is shown as follows.

package.png

Package


PIC18F4520 Manufacturer

Microchip Technology Incorporated is a leading manufacturer of smart, networked, and secure embedded control solutions. Customers may create optimal designs using the company's simple development tools and broad product choices, which reduce risk while lowering overall system costs and time to market. The company's technologies are used by over 120,000 clients in the industrial, automotive, consumer, aerospace and defense, communications, and computing sectors. Microchip, based in Chandler, Arizona, offers outstanding technical support as well as dependable delivery and quality.


Trend Analysis

Frequently Asked Questions

1.What is the difference between MCU PIC18F452 and PIC18F4520?

(1)The difference between the single-chip microcomputer PIC18F452 and PIC18F4520 is that one has a USB, the other does not.
(2) Microcontrollers are a kind of integrated circuit chip, which uses VLSI technology to integrate the central processing unit CPU with data processing capabilities, random access memory RAM, read-only memory ROM, various I/O ports and interrupt systems, timer/counter and other functions (may also include display drive circuit, pulse width modulation circuit, analog multiplexer, A/D converter and other circuits) are integrated on a silicon chip to form a small and complete microcomputer system, It is widely used in the field of industrial control. From the 1980s, from the then 4-bit and 8-bit single-chip microcomputers to the current 300M high-speed single-chip microcomputer.

2.How does the PIC18F4520 microcontroller adjust the PWM speed of the DC brushless motor?

The output PWM signal of the single-chip microcomputer can not be directly added to the switch tube, and the turn-on and the cut-off voltage value of the tube must be achieved through signal amplification. The single-chip microcomputer controls the switching tube to turn on and off after amplifying the PWM signal output by the program, thereby obtaining a large voltage and high current PWM signal formed by the switching tube. The sine signal can be simulated into sine wave signals of different frequencies to control the motor speed.

3.What is the difference between PIC18F4550 and PIC18F4520?

One with USB, the other does not.
PIC18F4520-I/PT

Microchip Technology

In Stock: 60000

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