STM32F407ZGT6 Microcontroller: Feature, Pinout and Datasheet

Sophie

Published: 21 October 2021 | Last Updated: 21 October 2021

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STM32F407ZGT6

STM32F407ZGT6

STMicroelectronics

1MB 1M x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller STM32F4 Series STM32F407 144 Pin 168MHz 3.3V 144-LQFP

Purchase Guide

1MB 1M x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller STM32F4 Series STM32F407 144 Pin 168MHz 3.3V 144-LQFP

This article mainly covers mechanical device characteristics of the STM32F407ZGT6 line of microcontroller. Furthermore, Huge range of Semiconductors, Capacitors, Resistors and IcS in stock. Welcome RFQ.

STM32F407ZGT6 Pinout

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Pinout


STM32F407ZGT6 CAD Model

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Symbol


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Footprint


3D Model.png

3D Model


STM32F407ZGT6 Overview

The STM32F407ZGT6 is based on the high-performance ARM® Cortex®-M4 32-bit RISC core operating at a frequency of up to 168 MHz. The Cortex-M4 core features a Floating point unit (FPU) single precision which supports all ARM singleprecision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32F407ZGT6 incorporates high-speed embedded memories (Flash memory up to 1 Mbyte, up to 192 Kbytes of SRAM), up to 4 Kbytes of backup SRAM, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix. In the following articles, we will have a more detailed understanding of STM32F407ZGT6 model.


STM32F407ZGT6 Features

• Core: ARM® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions

• Memories

• Up to 1 Mbyte of Flash memory

• Up to 192+4 Kbytes of SRAM including 64-Kbyte of CCM (core coupled memory) data RAM

• Flexible static memory controller supporting Compact Flash, SRAM, PSRAM, NOR and NAND memories

• LCD parallel interface, 8080/6800 modes

• Clock, reset and supply management

– 1.8 V to 3.6 V application supply and I/Os

– POR, PDR, PVD and BOR

– 4-to-26 MHz crystal oscillator

– Internal 16 MHz factory-trimmed RC (1% accuracy)

– 32 kHz oscillator for RTC with calibration

– Internal 32 kHz RC with calibration

• Low-power operation

– Sleep, Stop and Standby modes

– VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM

• 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode

• 2×12-bit D/A converters

• General-purpose DMA: 16-stream DMA controller with FIFOs and burst support

• Up to 17 timers: up to twelve 16-bit and two 32-bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input

• Debug mode

– Serial wire debug (SWD) & JTAG interfaces

– Cortex-M4 Embedded Trace Macrocell™

• Up to 140 I/O ports with interrupt capability

– Up to 136 fast I/Os up to 84 MHz

– Up to 138 5 V-tolerant I/Os

• Up to 15 communication interfaces

– Up to 3 × I2C interfaces (SMBus/PMBus)

– Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control)

– Up to 3 SPIs (42 Mbits/s), 2 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock

– 2 × CAN interfaces (2.0B Active)

– SDIO interface

• Advanced connectivity

– USB 2.0 full-speed device/host/OTG controller with on-chip PHY

– USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI

– 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII

• 8- to 14-bit parallel camera interface up to 54 Mbytes/s

• True random number generator

• CRC calculation unit

• 96-bit unique ID

• RTC: subsecond accuracy, hardware calendar


STM32F407ZGT6 Advantage

The STM32F407ZGT6 is part of the STM32F4 family. They are fully pinto-pin, software and feature compatible with the STM32F2xx devices, allowing the user to try different memory densities, peripherals, and performances (FPU, higher frequency) for a greater degree of freedom during the development cycle.

The STM32F407ZGT6 operates in the –40 to +105 ℃ temperature range from a 1.8 to 3.6 V power supply. The supply voltage can drop to 1.7 V when the device operates in the 0 to 70 ℃ temperature range using an external power supply supervisor: refer to Section: Internal reset OFF. A comprehensive set of power-saving mode allows the design of low-power applications.

The STM32F407ZGT6 device maintains a close compatibility with the whole STM32F10xxx family. All functional pins are pin-to-pin compatible. The STM32F407ZGT6, however, are not drop-in replacements for the STM32F10xxx devices: the two families do not have the same power scheme, and so their power pins are different. Nonetheless, transition from the STM32F10xxx to the STM32F40xxx family remains simple as only a few pins are impacted.


Specifications

STMicroelectronics STM32F407ZGT6 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics STM32F407ZGT6.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 7 months ago)
  • Factory Lead Time
    12 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    144-LQFP
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    144
  • Data Converters
    A/D 24x12b; D/A 2x12b
  • Number of I/Os
    114
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    STM32F4
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    144
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3.3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    168MHz
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    STM32F407
  • Pin Count

    a count of all of the component leads (or pins)

    144
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    CAN, EBI/EMI, Ethernet, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    1MB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    192K x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    1.8V~3.6V
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROCONTROLLER, RISC
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    ARM® Cortex®-M4
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    32-Bit
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    1MB 1M x 8
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    CANbus, DCMI, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    32
  • Has ADC

    Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.

    YES
  • DMA Channels

    DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.

    YES
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    32b
  • Number of Timers/Counters
    14
  • Core Architecture

    In electronic components, the term "Core Architecture" refers to the fundamental design and structure of the component's internal circuitry. It encompasses the arrangement of key components, such as processors, memory units, and input/output interfaces, within the device. The core architecture plays a crucial role in determining the component's performance, power efficiency, and overall capabilities. Different core architectures are optimized for specific applications and requirements, such as high-speed processing, low power consumption, or specialized functions. Understanding the core architecture of electronic components is essential for engineers and designers to select the most suitable components for their projects.

    ARM
  • CPU Family

    CPU Family refers to a classification of microprocessors that share a common architecture and design traits. It signifies a group of processors that are typically produced by the same manufacturer and have similar functionality and features. The CPU Family can encompass various models that may differ in performance, power consumption, and specific capabilities but retain a unified core design, allowing for compatibility with software and hardware. This classification helps users and developers to understand the performance characteristics and upgrade pathways of different CPU models within the same family.

    CORTEX-M4
  • Number of ADC Channels
    24
  • Number of PWM Channels
    2
  • Number of I2C Channels
    3
  • Number of Ethernet Channels
    1
  • Height
    1.45mm
  • Length
    20.2mm
  • Width
    20.2mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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STM32F407ZGT6 Functional Block Diagram

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Block Diagram


Power supply scheme.png

Power supply scheme


STM32F407ZGT6 Thermal Characteristics

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

• TA max is the maximum ambient temperature in ℃,

• ΘJA is the package junction-to-ambient thermal resistance, in ℃/W,

• PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

• PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application.

Package thermal characteristics.png

Package thermal characteristics


STM32F407ZGT6 Equivalent

         Model number            Manufacturer                                                 Description
STM32F205RGT7TR     STMicroelectronics32-BIT, FLASH, 120MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, ROHS COMPLIANT, LQFP-64
STM32F205RGT6W     STMicroelectronicsHigh-performance Arm Cortex-M3 MCU with 1 Mbyte of Flash memory, 120 MHz CPU, ART Accelerator
STM32F205RGT6TR     STMicroelectronicsHigh-performance Arm Cortex-M3 MCU with 1 Mbyte of Flash memory, 120 MHz CPU, ART Accelerator
STM32F407ZGT6XXX     STMicroelectronics32-BIT, FLASH, 168MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, 0.50  MM PITCH, ROHS COMPLIANT, LQFP-144
STM32F205RGT6XXX     STMicroelectronics32-BIT, FLASH, 120MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, ROHS COMPLIANT, LQFP-64
STM32F205RGT6     STMicroelectronicsHigh-performance Arm Cortex-M3 MCU with 1 Mbyte of Flash memory, 120 MHz CPU, ART Accelerator
STM32F205RGT7     STMicroelectronicsHigh-performance Arm Cortex-M3 MCU with 1 Mbyte of Flash memory, 120 MHz CPU, ART Accelerator
STM32F407ZGT7     STMicroelectronicsHigh-performance foundation line, Arm Cortex-M4 core with DSP and FPU, 1 Mbyte of Flash memory, 168 MHz CPU, ART Accelerator, Ethernet, FSMC
STM32F205RGT7XXX     STMicroelectronics32-BIT, FLASH, 120MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, ROHS COMPLIANT, LQFP-64
STM32F407ZGT7TR     STMicroelectronics32-BIT, FLASH, 168MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-144


Parts with Similar Specs

The three parts on the right have similar specifications to STMicroelectronics & STM32F407ZGT6.

STM32F407ZGT6 Application

• Motor drive and application control

• Medical equipment

• Industrial applications: PLC, inverters, circuit breakers

• Printers, and scanners

• Alarm systems, video intercom, and HVAC

• Home audio appliances


STM32F407ZGT6 Package

LQFP144 package outline.png

LQFP144 package outline


LQFP144 marking example (package top view).png

LQFP144 marking example (package top view)


LQFP144 package recommended footprint.png

LQFP144 package recommended footprint


LQFP144  package mechanical data.png

LQFP144  package mechanical data


STM32F407ZGT6 Manufacturer

STMicroelectronics is a globally recognized semiconductor company. They are dedicated to developing semiconductor solutions for various microelectronics applications. STMicroelectronics enjoys unrivaled silicon and system expertise, strong manufacturing strength, IP portfolio,and solid relationships with their strategic partners. Based on these advantages, STMicroelectronics has become a pioneer in System-on-Chip (SoC) technology and its products has a positive effect in realizing today's convergence trends.


Datasheet PDF

Download datasheets and manufacturer documentation for STMicroelectronics STM32F407ZGT6.

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Frequently Asked Questions

What three low-power modes does the STM32F407ZGT6 support to achieve the best compromise between low-power consumption, short startup time and available wakeup sources?

Sleep mode, Stop mode and Standby mode.

How many timers does STM32F407ZGT6 device contain?

The STM32F407ZGT6 includes two advanced-control timers, eight general-purpose timers, two basic timers and two watchdog timers.

In the STM32F407ZGT6 device, how many synchronizable general-purpose timers are there?

There are ten synchronizable general-purpose timers embedded in the STM32F407ZGT6 device. 

What effect does the Memory Protection Unit (MPU) have on STM32F407ZGT6?

The Memory Protection Unit (MPU) is used to manage the CPU accesses to memory to prevent one task to accidentally corrupt the memory or resources used by any other active task. The MPU is especially helpful for applications where some critical or certified code has to be protected against the misbehavior of other tasks. 
STM32F407ZGT6

STMicroelectronics

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U.S. Virgin Islands

Uganda

Ukraine

Uruguay

Uzbekistan

Vanuatu

Vatican City

Venezuela

Wallis & Futuna

Yemen

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