3 Semiconductor Stocks to Watch in 2024
Semiconductor stocks have been gaining attention in the market due to their potential for explosive growth. With their presence in the expanding artificial intelligence market and the growing demand from electric vehicle companies, communication and data processing centers, and automotive needs, semiconductor companies offer investors high-risk, high-reward opportunities. Three semiconductor stocks that should be on investors' radar in 2024 are Qualcomm Inc. (QCOM), United Microelectronics Corporation (UMC), and Navitas Semiconductor (NVTS). Qualcomm, Inc. (QCOM) is a leading manufacturer of products that contribute to the development of technologies like 5G. The company's deal with Apple to supply its Snapdragon 5G Modem‑RF Systems for smartphone launches in the coming years positions it at the forefront of the industry. With expected double-digit earnings growth and an undervalued stock, Qualcomm is a promising investment. United Microelectronics Corporation (UMC) is a global leader in the semiconductor foundry business. Its relatively strong valuation and innovative strategy to grow off of trends such as electrification and connectivity make it an attractive pick. With the global semiconductor foundry market expected to reach $137 billion by 2022, UMC is well-positioned for growth. Navitas Semiconductor (NVTS) is a pioneering force in next-gen semiconductors. Its integrated gallium nitride and silicon carbide semiconductors have the potential to drive breakthroughs and growth in the artificial intelligence market. With impressive revenue growth and a strong balance sheet, Navitas Semiconductor is a solid choice for investors looking to capitalize on the next-generation semiconductor trend. Overall, these three semiconductor stocks offer investors the opportunity to tap into the potential of the growing tech industry and capitalize on the demand for advanced technologies in various sectors.
The 2026 Memory Super-Cycle: Navigating the 500% Surge in DRAM and NAND Flash PricesUTMEL17 June 20268561Driven by massive AI capital expenditures, the 2026 semiconductor market is experiencing a historic memory super-cycle, sending DRAM and NAND Flash prices soaring. With manufacturers prioritizing high-margin AI memory like HBM, severe shortages have spilled over to mature nodes, impacting automotive and IoT sectors. To navigate this volatility, procurement teams must secure long-term agreements, diversify suppliers, and optimize designs to mitigate rising BOM costs.
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HBM4 and the Shift to Customized AI Memory: The Advanced Packaging BottleneckUTMEL22 June 20261495The JEDEC HBM4 standard transitions high-bandwidth memory to a customized architecture featuring a 2048-bit interface and logic base dies. While delivering extreme bandwidth for AI accelerators, its resource-intensive production triggers a global DRAM supply squeeze. Procurement teams must navigate rising prices, advanced packaging bottlenecks, and extended lead times by adopting strategic supply chain planning.
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AI Computing Power Gap: How Token Consumption is Reshaping Server Component SourcingUTMEL23 June 2026476As global token consumption drives the transition to high-density 100kW+ AI data centers, power delivery networks require advanced Wide-Bandgap semiconductors (SiC/GaN) and high-capacitance MLCCs. This shift has triggered a component procurement crisis with lead times exceeding 24 weeks. To bypass shortages, hardware buyers must abandon just-in-time manufacturing and leverage independent global distributor networks to secure critical power and passive components.
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Power Semiconductor Procurement After the Nexperia Shake-Up—NXP for Stability, ON for Technology, or Nexperia for Value?UTMEL04 November 20254586The recent supply chain turmoil surrounding Netherlands-based Nexperia has sent shockwaves through the global semiconductor industry, forcing procurement professionals to re-evaluate their sourcing strategies.
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The BSPDN Revolution: Overcoming IR Drop in Sub-2nm GAAFET Nodes with Backside Power DeliveryUTMEL25 June 2026357As semiconductor manufacturing enters the sub-2nm era, Backside Power Delivery Networks (BSPDN) are replacing traditional front-side routing to overcome critical IR drop bottlenecks. By separating power and signal delivery, chipmakers like Intel and TSMC drastically improve performance and density in GAAFET designs. However, this radical shift introduces manufacturing complexities, thermal challenges, and demands advanced packaging and power management solutions.
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