Intel EP4CE115F29C7: High-Performance, Cost-Effective FPGA Solution
2.4mm mm FPGAs Cyclone® IV E Series 780-BGA 1mm mm 780
The EP4CE115F29C7 FPGA excels with 114,480 logic elements, 208 I/O pins, and low power consumption, making it ideal for high-performance, versatile designs.
Product Introduction
The EP4CE115F29C7, a member of Intel's Cyclone IV family, has set itself apart as a remarkable FPGA chip. Its technical specifications make it a preferred choice for engineers across various industries. With 115,200 logic elements, 208 I/O pins, and a maximum operating speed of 300 MHz, this chip delivers exceptional performance. You can find it powering applications in defense, medical, telecom, automotive, and control systems.
What makes the EP4CE115F29C7 even more impressive is its ability to balance high performance with cost-effectiveness. For example, its use in energy-efficient counter designs significantly reduces dynamic power consumption, making it ideal for power-sensitive projects. Whether you need precise signal generation or flexible waveform creation, this versatile FPGA ensures reliable operation without additional expenses.
High Performance of the EP4CE115F29C7
The EP4CE115F29C7 stands out in the Cyclone IV FPGA family due to its exceptional performance characteristics. Whether you're designing complex systems or optimizing existing ones, this FPGA delivers the speed, efficiency, and reliability you need.
Logic Elements and Embedded Memory
The EP4CE115F29C7 offers an impressive 114,480 logic elements, making it a powerhouse for handling intricate designs. These logic elements allow you to implement advanced algorithms and processes with ease. Additionally, the chip includes 3.8 Mbits of embedded block RAM (EBR), providing ample memory for data storage and processing. This combination of logic and memory ensures seamless operation, even in demanding applications.
| Parameter | Value |
|---|---|
| Number of Logic Elements | 114,480 LE |
| Embedded Block RAM - EBR | 3.8 Mbit |
The high density of logic elements and embedded memory makes this Cyclone IV FPGA ideal for applications requiring high computational power, such as signal processing and data encryption.
Low Power, High-Speed Performance
One of the most remarkable characteristics of the EP4CE115F29C7 is its ability to balance low power consumption with high-speed operation. The chip's pipelined implementation of multipliers enhances its speed by 31.7%, while requiring only a minimal increase in resource utilization—just three additional logic elements. This efficiency makes it a preferred choice for energy-sensitive projects.
The pipelined multiplier implementation increases operational frequency by 31.7%.
Resource utilization rises by only 9.7%, ensuring efficient use of logic elements.
When compared to other FPGA families, the EP4CE115F29C7 demonstrates competitive performance metrics. The table below highlights its maximum frequency and core dynamic thermal power dissipation:
| FPGA Family | EP4CE115F29C7 | Arria 10 | Stratix V | Cyclone V |
|---|---|---|---|---|
| Maximum Frequency | 454.13 MHz | 834.03 MHz | 815.00 MHz | 522.47 MHz |
| Core Dynamic Thermal Power Dissipation | 65.71 mW | 61.62 mW | 55.13 mW | 19.97 mW |
This balance of speed and power efficiency ensures that your designs run smoothly without compromising energy consumption.
Advanced Clock Management with PLLs
The EP4CE115F29C7 features advanced clock management capabilities, thanks to its integrated phase-locked loops (PLLs). These PLLs allow you to generate precise clock signals, ensuring synchronization across your design. Whether you're working on high-speed data transfer or timing-critical applications, the chip's clock management system provides the stability and accuracy you need.
With its ability to support multiple clock domains, the EP4CE115F29C7 simplifies the implementation of complex designs. This flexibility makes it a versatile choice for a wide range of applications, from telecommunications to industrial automation.
Versatility in FPGA Applications
The EP4CE115F29C7 FPGA excels in versatility, making it a reliable choice for a wide range of applications. Its adaptability allows you to tackle complex designs and optimize performance across various industries.
Extensive I/O Pin Support
The EP4CE115F29C7 offers 208 I/O pins, providing you with the flexibility to connect multiple peripherals and external devices. These pins support a variety of voltage standards, ensuring compatibility with different hardware components. Whether you're working on a communication system or an industrial control unit, the extensive I/O pin support simplifies your design process.
You can use these pins to implement high-speed data transfer protocols, such as SPI, I2C, or UART. This capability ensures seamless integration with other devices in your system. The large number of I/O pins also enables you to create designs with multiple input and output channels, enhancing the overall functionality of your FPGA-based projects.
Compatibility with Industry Tools
The EP4CE115F29C7 is compatible with a wide range of industry-standard tools, making it easier for you to develop and test your designs. Intel's Quartus Prime software provides a user-friendly interface for programming and debugging the FPGA. This tool allows you to simulate your designs, identify potential issues, and optimize performance before deployment.
You can also integrate the EP4CE115F29C7 with third-party tools, such as ModelSim and MATLAB, to enhance your design workflow. These tools enable you to perform advanced simulations and analyze the performance of your FPGA in real-world scenarios. The compatibility with industry tools ensures that you can achieve your design goals efficiently and effectively.
Flexible Configuration and Scalability
The EP4CE115F29C7 offers flexible configuration options, allowing you to tailor the FPGA to meet your specific requirements. You can reconfigure the logic elements and embedded memory to adapt to changing project needs. This reconfigurability ensures that your FPGA remains relevant, even as your design evolves.
Scalability is another key feature of the EP4CE115F29C7. You can use it to create designs ranging from simple prototypes to complex systems. For example, the FPGA has been used to synthesize custom CPU architectures with switchable cache systems. This approach allows you to dedicate cache cores to different threads, improving performance in terms of clock cycle count. The ability to scale your designs ensures that the EP4CE115F29C7 can handle diverse applications, from telecommunications to automotive systems.
Tip: The reconfigurability of the EP4CE115F29C7 makes it an excellent choice for projects requiring frequent updates or modifications. You can save time and resources by reusing the same FPGA for different applications.
Cost-Effective Technical Specifications
The EP4CE115F29C7 offers a unique combination of advanced features and affordability. Its technical specifications make it an excellent choice for projects where cost and performance are equally important.
Affordable Pricing for Advanced Features
You don’t have to break the bank to access high-quality FPGA solutions. The EP4CE115F29C7 provides advanced features like 114,480 logic elements and 3.8 Mbits of embedded memory at a competitive price. This affordability allows you to allocate your budget to other critical aspects of your project. Whether you’re working on a prototype or a large-scale deployment, this FPGA ensures you get the most value for your investment.
Note: The EP4CE115F29C7 is part of the Cyclone IV family, known for delivering high performance at a fraction of the cost of other FPGA families.
Energy Efficiency and Operational Savings
Energy efficiency is a key factor in reducing operational costs. The EP4CE115F29C7 consumes minimal power while maintaining high-speed performance. Its low dynamic power dissipation ensures that your designs run efficiently without overheating. This energy-saving capability not only lowers electricity bills but also extends the lifespan of your hardware.
For example, the chip’s pipelined multiplier implementation enhances speed by over 30% while keeping power consumption low. This balance makes it ideal for applications requiring continuous operation, such as industrial automation and telecommunications.
Long-Term Reliability and Support
When you choose the EP4CE115F29C7, you invest in long-term reliability. Its robust design ensures consistent performance even under demanding conditions. Additionally, Intel provides extensive support for this FPGA, including software tools like Quartus Prime and detailed documentation. These resources help you troubleshoot issues and optimize your designs effectively.
The Cyclone IV family’s proven track record in various industries further reinforces its reliability. You can count on the EP4CE115F29C7 to deliver dependable performance for years, making it a cost-effective choice for long-term projects.
Tip: Leveraging Intel’s support ecosystem can save you time and resources during the development process.
The EP4CE115F29C7 stands out for three key reasons:
High performance with its robust logic elements and advanced clock management.
Versatility that adapts to diverse applications and industry-standard tools.
Cost-effectiveness through affordable pricing and energy efficiency.
This FPGA offers a reliable and efficient solution for engineers and developers. Its features make it ideal for tackling complex designs or optimizing existing systems.
Explore the EP4CE115F29C7 today and unlock its potential for your next project.
FAQ
What makes the EP4CE115F29C7 suitable for FPGA prototyping?
The EP4CE115F29C7 offers high performance, extensive I/O pin support, and compatibility with industry tools. These features make it ideal for creating and testing designs during the development phase. Its scalability ensures you can adapt it to various applications, from simple prototypes to complex systems.
Can the EP4CE115F29C7 be used with an affordable DE2-115 evaluation board?
Yes, the EP4CE115F29C7 is compatible with the DE2-115 evaluation board. This board provides a cost-effective platform for testing and implementing FPGA designs. It includes peripherals and interfaces that simplify the development process, making it a great choice for beginners and professionals.
How does the EP4CE115F29C7 compare to other field programmable gate arrays?
The EP4CE115F29C7 balances performance, versatility, and cost-effectiveness. It offers advanced features like embedded memory and low power consumption at an affordable price. While other field programmable gate arrays may excel in specific areas, this chip provides a well-rounded solution for most applications.
Is the EP4CE115F29C7 energy-efficient?
Yes, the EP4CE115F29C7 is designed for energy efficiency. Its low dynamic power dissipation ensures minimal energy consumption without compromising performance. This makes it suitable for applications requiring continuous operation, such as industrial automation and telecommunications.
What industries benefit from using the EP4CE115F29C7?
The EP4CE115F29C7 is used in industries like telecommunications, automotive, medical, and industrial automation. Its versatility and scalability allow engineers to implement it in various applications, from signal processing to control systems. Its affordability also makes it accessible for smaller projects.
Specifications
- TypeParameter
- Factory Lead Time8 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
780-BGA - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of I/Os528
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
0°C~85°C TJ - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
Cyclone® IV E - Published2016
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e0 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Number of Terminations780
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
3A001.A.7.A - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
TIN LEAD - HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8542.39.00.01 - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
1.15V~1.25V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
BOTTOM - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
BALL - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
220 - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
1.2V - Terminal Pitch
The center distance from one pole to the next.
1mm - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
30 - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
EP4CE115 - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
S-PBGA-B780 - Number of Outputs531
- Qualification Status
An indicator of formal certification of qualifications.
Not Qualified - Power Supplies
an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?
1.21.2/3.32.5V - Clock Frequency
Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.
472.5MHz - Number of Inputs531
- Programmable Logic Type
Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).
FIELD PROGRAMMABLE GATE ARRAY - Number of Logic Elements/Cells114480
- Total RAM Bits
Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.
3981312 - Number of LABs/CLBs7155
- Length29mm
- Height Seated (Max)
Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.
2.4mm - Width29mm
- RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
Non-RoHS Compliant
Datasheet PDF
- Datasheets :
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