7M48072002:Footprint, package, and features

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

the variation of output frequency of a crystal oscillator due to external conditions like temperature variation, voltage variation, output load variation, and frequency aging.

The parameter "Physical Dimension" in electronic components refers to the measurable size and shape characteristics of a component. This includes dimensions such as length, width, height, and diameter, which are critical for ensuring proper fit and integration into electronic circuits and systems. Physical dimensions also influence the component's performance, thermal management, and overall reliability in application environments. Understanding these dimensions is essential for designers to maintain compatibility with circuit boards and reduce issues related to space constraints.

Operating frequency is the frequency at which the communications are being made with the total bandwidth occupied by the carrier signal with modulation. Usually bandwidth of the antenna will be wider than the bandwidth of the signal so that more than one center frequency the antenna can be put in to effective use.

the amount of capacitance measured or computed across the crystal terminals on the PCB. Frequency Tolerance. Frequency tolerance refers to the allowable deviation from nominal, in parts per million (PPM), at a specific temperature, usually +25°C.

the maximum allowable deviation from the nominal crystal frequency at a specified temperature, usually 25℃. The recommended frequency tolerance of the crystal over the manufacturing process is ±50 ppm.

Drive Level in electronic components refers to the amount of power or current required to properly operate a specific component, such as a transistor or an amplifier. It is a crucial parameter that determines the input signal strength needed to achieve the desired output performance. The drive level is typically specified in terms of voltage, current, or power, and it helps ensure that the component operates within its specified range for optimal performance and reliability. Understanding the drive level requirement is essential for designing circuits and systems that can effectively drive the electronic component without causing damage or distortion.

Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.