PGA2311 Volume Control: Alternative, Package and Pinout

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Published: 19 August 2021 | Last Updated: 19 August 2021

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PGA2311UA/1K

PGA2311UA/1K

Texas Instruments

+-5V -40°C~85°C TA Multi-Functional Gate PGA2311 16 Pin 16-SOIC (0.295, 7.50mm Width)

Purchase Guide

+-5V -40°C~85°C TA Multi-Functional Gate PGA2311 16 Pin 16-SOIC (0.295, 7.50mm Width)

Hello guys, welcome to today's post. I am Rose. Today we will introduce PGA2311 Stereo Audio Volume Control. This article mainly introduce alternatives, package, pinout and other detailed information about Texas Instruments PGA2311.

This video will show you how to test PGA2311.

Arduino PGA2311 Bourns - PREAMPuino - debug tests

PGA2311 Description

The PGA2311 device is a high-performance, stereo audio volume control designed for professional and high-end consumer audio systems. 


The PGA2311 uses an internal high-performance operational amplifier to yield low noise and distortion. The PGA2311 also provides the capability to drive 660-Ω loads directly without buffering. 


The 3-wire serial control interface allows for connection to a wide variety of host controllers, in addition to support for daisy-chaining of multiple PGA2311 devices. 


The heart of the PGA2311 is a resistor network, an analog switch array, and a high-performance op amp stage. The switches are used to select taps in the resistor network that, in turn, determine the gain of the amplifier stage. 


Switch selections are programmed using a serial control port. The PGA2311 includes a zero crossing detection function that can provide for noise-free level transitions. 


The concept is to change gain settings on a zero crossing of the input signal, thus minimizing audible glitches .The zero crossing detection takes effect with a change in gain setting for a corresponding channel. 


The new gain setting will not be implemented until either positive slope zero crossing is detected or a time-out period of 16ms has elapsed. In the case of a time-out, the new gain setting takes effect with no attempt to minimize audible artifacts. This board features a fully independent signal and power ground .


PGA2311 Pinout

PGA2311 Pinout.jpg

Pinout2.png

PGA2311 CAD Model

Symbol

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Footprint

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3D Model

PGA2311 3D Model.jpg

PGA2311 Features

• Digitally-Controlled Analog Volume Control:

– Two Independent Audio Channels

– Serial Control Interface

– Zero Crossing Detection

– Mute Function

• Wide Gain and Attenuation Range:

+31.5 dB to −95.5 dB with 0.5-dB Steps

Low Noise and Distortion:

– 120-dB Dynamic Range

– 0.0004% THD+N at 1 kHz (U-Grade)

– 0.0002% THD+N at 1 kHz (A-Grade)

• Noise-Free Level Transitions

• Low Interchannel Crosstalk: −130 dBFS

• Power Supplies: ±5-V Analog, +5-V Digital

• Available in PDIP-16 and SOIC-16 Packages

• Pin- and Software-Compatible With the Crystal CS3310


Specifications

Texas Instruments PGA2311UA/1K technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments PGA2311UA/1K.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 3 days ago)
  • Factory Lead Time
    6 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Gold
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    16-SOIC (0.295, 7.50mm Width)
  • Number of Pins
    16
  • Weight
    420.395078mg
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    2 (1 Year)
  • Number of Terminations
    16
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Applications

    The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

    Automotive Audio, Musical Instruments, Professional Audio
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    ±4.75V~5.25V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    PGA2311
  • Function

    The parameter "Function" in electronic components refers to the specific role or purpose that the component serves within an electronic circuit. It defines how the component interacts with other elements, influences the flow of electrical signals, and contributes to the overall behavior of the system. Functions can include amplification, signal processing, switching, filtering, and energy storage, among others. Understanding the function of each component is essential for designing effective and efficient electronic systems.

    Volume Control
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    +-5V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    4.75V
  • Number of Channels
    2
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    SPI
  • Specifications

    a measure of a material's ability to?conduct heat.?

    31.5dB ~ -95.5dB
  • Number of Bands
    1
  • Channel Separation

    Channel separation is a measure of how well a stereo audio system can reproduce sound from one channel without any interference from the other channel. It indicates the degree to which the left and right channels remain distinct and isolated from each other during playback. Higher channel separation values indicate better performance, as it means that the audio signals in each channel are less likely to bleed into or affect the other channel. This parameter is important for achieving accurate stereo imaging and a more immersive listening experience.

    130 dB
  • Height
    2.65mm
  • Length
    10.3mm
  • Width
    7.5mm
  • Thickness

    Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

    2.35mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
0 Similar Products Remaining

PGA2311 Alternatives

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PGA2311 Functional Block Diagram

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PGA2311 Layout Example

Layout Example.png

PGA2311 Applications

• Used in Audio Amplifiers

• Used in Mixing Consoles

• Used in Multi-Track Recorders

• Used in Broadcast Studio Equipment

• Used in Musical Instruments

• Used in Effects Processors

• Used in A/V Receivers

• Used in Car Audio Systems


PGA2311 Package

Package.png

PGA2311 Manufacturer

Texas Instruments (TI) is an American technology company headquartered in Dallas, Texas, which designs and manufactures semiconductors and various integrated circuits, and sells them to electronic designers and manufacturers worldwide. It is one of the top 10 semiconductor companies in global sales. The company focuses on the development of analog chips and embedded processors, which account for more than 80% of its revenue. TI also produces TI digital light processing technology and educational technology products, including calculators, microcontrollers and multi-core processors. As of 2016, the company has 45,000 patents worldwide.


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Download datasheets and manufacturer documentation for Texas Instruments PGA2311UA/1K.
PGA2311UA/1K

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