KSZ8081MNXCA 10BASE-T/100BASE-TX Physical Layer Transceiver[FAQ]: Datasheet, Features, and Pinout

UTMEL

Published: 22 March 2022 | Last Updated: 22 March 2022

329

KSZ8081MNXCA

KSZ8081MNXCA

Microchip Technology

KSZ8081 Receivers 1/1 Drivers/Receivers

Purchase Guide

KSZ8081 Receivers 1/1 Drivers/Receivers

KSZ8081MNXCA is a single-supply 10BASE-T/100BASE-TX Ethernet physical-layer transceiver for the transmission and reception of data. This article is going to introduce pinout, applications, features, and more details about KSZ8081MNXCA.

Overview of KSZ8081MNXCA

The KSZ8081MNXCA is a single-supply 10BASE-T/100BASE-TX Ethernet physical-layer transceiver for transmission and reception of data over standard CAT-5 unshielded twisted pair (UTP) cable.

The KSZ8081MNXCA is a highly-integrated PHY solution. It reduces board cost and simplifies board layout by using on-chip termination resistors for the differential pairs and by integrating a low-noise regulator to supply the 1.2V core.

The KSZ8081MNXCA offers the Media Independent Interface (MII) and the theKSZ8081MNXCA offers the Reduced Media Independent Interface (RMII) for direct connection with MII/RMII-compliant Ethernet MAC processors and switches. A 25 MHz crystal is used to generate all required clocks, including the 50 MHz RMII reference clock output for the KSZ8081MNXCA.


KSZ8081MNXCA Features

• Back-to-back mode support for a 100 Mbps copper repeater

MDC/MDIO management interface for PHY register configuration

• Programmable interrupt output

• LED outputs for link, activity, and speed status indication

• On-chip termination resistors for the differential pairs

• Baseline wander correction

• HP Auto MDI/MDI-X to reliably detect and correct straight-through and crossover cable connections with disabling and enabling the option

• Auto-negotiation to automatically select the highest link-up speed (10/100 Mbps) and duplex (half/full)

• Power-down and power-saving modes

• LinkMD TDR-based cable diagnostics to identify faulty copper cabling

• Parametric NAND Tree support for fault detection between chip I/Os and the board

• HBM ESD rating (6 kV)

• Loopback modes for diagnostics

• Single 3.3V power supply with VDD I/O options for 1.8V, 2.5V, or 3.3V

• Built-in 1.2V regulator for core

• Available in 32-pin (5 mm × 5 mm) QFN package


KSZ8081MNXCA Pinout

KSZ8081MNXCA Pinout.png

KSZ8081MNXCA Pinout


KSZ8081MNXCA Block Diagram

KSZ8081MNXCA Block Diagram.jpg

KSZ8081MNXCA Block Diagram


KSZ8081MNXCA CAD Model

KSZ8081MNXCA Symbol.jpg

KSZ8081MNXCA Symbol

KSZ8081MNXCA Footprint.jpg

KSZ8081MNXCA Footprint

Specifications

Microchip Technology KSZ8081MNXCA technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology KSZ8081MNXCA.
  • Type
    Parameter
  • Factory Lead Time
    1 Weeks
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    32-VFQFN Exposed Pad
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    32-QFN (5x5)
  • Usage Level
    Automotive grade
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    2A (4 Weeks)
  • Type
    Transceiver
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    70°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    0°C
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.8V 2.5V 3.3V
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    KSZ8081
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    100 Mbps
  • Protocol

    In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.

    MII
  • Number of Drivers/Receivers
    1/1
  • Duplex

    In the context of electronic components, "Duplex" refers to a type of communication system that allows for bidirectional data flow. It enables two devices to communicate with each other simultaneously, allowing for both sending and receiving of data at the same time. Duplex communication can be further categorized into two types: half-duplex, where data can be transmitted in both directions but not at the same time, and full-duplex, where data can be sent and received simultaneously. This parameter is crucial in networking and telecommunications systems to ensure efficient and effective data transmission between devices.

    Full
  • Simplex/Duplex

    In electronic components, the parameter "Simplex/Duplex" refers to the type of communication or data transmission mode supported by the component. Simplex communication is a one-way communication mode where data flows only in one direction, from the sender to the receiver. This means that the sender can only transmit data, and the receiver can only receive data. On the other hand, duplex communication is a two-way communication mode where data can flow in both directions, allowing for simultaneous transmission and reception of data between two devices. Understanding whether a component supports simplex or duplex communication is important for determining how data will be exchanged between devices and ensuring compatibility in a given system.

    Full Duplex
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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KSZ8081MNXCA Applications

• Game console

• IP phone

• IP set-top box

• IP TV

• LOM

• Printer


KSZ8081MNXCA Manufacturer

Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost, and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.


Datasheet PDF

Popularity by Region

Frequently Asked Questions

How many pins of KSZ8081MNXCA?

32 pins.

What’s the operating temperature of KSZ8081MNXCA?

0°C~70°C.

What’s the packaging way of KSZ8081MNXCA?

Tube.

What’s the Data Rate of KSZ8081MNXCA?

100 Mbps.
KSZ8081MNXCA

Microchip Technology

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