LIS2DW12TR Motion Sensor: Datasheet, Pinout, Application Hint

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Published: 07 April 2022 | Last Updated: 07 April 2022

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LIS2DW12TR

LIS2DW12TR

STMicroelectronics

ACCEL 2-16G I2C/SPI 12LGA

Unit Price: $0.824095

Ext Price: $0.82

Purchase Guide

ACCEL 2-16G I2C/SPI 12LGA

The LIS2DW12TR is an ultra-low-power high-performance three-axis linear accelerometer. This article will unlock its datasheet, pinout, application hint, feature and more detailed information about LIS2DW12TR.

This article will talk about LIS2DW12

Tilt Detection using LIS2DW12

LIS2DW12TR Pinout

LIS2DW12TR Pinout.jpg

LIS2DW12TR Pinout

LIS2DW12TR CAD Model

Symbol

LIS2DW12TR Symbol.jpg

LIS2DW12TR Symbol

Footprint

LIS2DW12TR Footprint.jpg

LIS2DW12TR Footprint

3D Model

LIS2DW12TR 3D Model.jpg

LIS2DW12TR 3D Model

LIS2DW12TR Description

The LIS2DW12TR  is an ultra-low-power high-performance three-axis linear accelerometer belonging to the “femto” family which leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers. The LIS2DW12TR  has user-selectable full scales of ±2g/±4g/±8g/±16g and is capable of measuring accelerations with output data rates from 1.6 Hz to 1600 Hz.
The LIS2DW12TR  has an integrated 32-level first-in, first-out (FIFO) buffer allowing the user to store data in order to limit intervention by the host processor.
The embedded self-test capability allows the user to check the functioning of the sensor in the final application.
The LIS2DW12TR  has a dedicated internal engine to process motion and acceleration detection including free-fall, wakeup, highly configurable single/double-tap recognition, activity/inactivity, stationary/motion detection, portrait/landscape detection and 6D/4D orientation.
The LIS2DW12TR  is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40°C to +85°C.

LIS2DW12TR Feature

• Ultra-low power consumption: 50 nA in power-down mode, below 1 µA in active low-power mode
• Very low noise: down to 1.3 mg RMS in low-power mode
• Multiple operating modes with multiple bandwidths
•  Android  stationary detection, motion detection
• Supply voltage, 1.62 V to 3.6 V
• Independent IO supply
• ±2g/±4g/±8g/±16g full scale
• High-speed I²C/SPI digital output interface
• Single data conversion on demand
16-bit data output
• Embedded temperature sensor
• Self-test
32-level FIFO
• 10000 g high shock survivability
• ECOPACK,  RoHS  and “Green” compliant

LIS2DW12TR Application

• Motion detection for wearables 

• Gesture recognition and gaming 

• Motion-activated functions and user interfaces 

• Display orientation 

• Tap/double-tap recognition 

• Free-fall detection 

• Smart power saving for handheld devices 

• Hearing aids 

• Portable healthcare devices 

• Wireless sensor nodes 

• Motion-enabled metering devices

LIS2DW12TR Block Diagram

The following figure shows the block diagram of LIS2DW12TR

LIS2DW12TR Block Diagram.jpg

LIS2DW12TR Block Diagram


LIS2DW12TR Application Hint

The Vdd line provides power to the device core, while the Vdd IO line provides power to the I/O pads. Decoupling capacitors for the power supply (100 nF ceramic, 10 fF aluminium) should be put as close to pin 9 of the device as practicable (common design practice).

To ensure optimal IC behaviour, all voltage and ground supplies must be present at the same time (see the LIS2DW12TR electrical connections (top view) diagram below). Without stopping the communication bus, it is feasible to delete Vdd while keeping Vdd IO; in this case, the measurement chain is turned off.

LIS2DW12 electrical connections (top view).jpg

LIS2DW12 electrical connections (top view)

The device's functionality as well as the measured acceleration data can be selected and accessed via the I2C or SPI interfaces. CS must be tied high (i.e. attached to Vdd IO) while utilizing I2C.

The user can entirely configure the functions, threshold, and timing of the two interrupt pins (INT1 and INT2) using the I2C/SPI interface.




LIS2DW12TR Package

LIS2DW12TR Package.jpg

LIS2DW12TR Package

LIS2DW12TR Manufacturer

STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of  System-on-Chip  (SoC) technology and its products play a key role in enabling today's convergence trends.


The related articles:

LIS2DH12  Accelerometer: Pinout, Datasheet, and  Functional Block Diagram

LIS2DHTR Motion Sensor: 3-Axis, Application Hint, Datasheet PDF

LIS2DE12TR Motion Sensor: Three-Axis Accelerometer, Datasheet, Application Hint and etc.


Specifications

STMicroelectronics LIS2DW12TR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics LIS2DW12TR.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 7 months ago)
  • Factory Lead Time
    16 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    12-WFLGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Usage Level
    Industrial grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    12
  • Type
    Digital
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.62V~3.6V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BUTT
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.8V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    LIS2D
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-XBGA-B12
  • Output Type

    The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.

    I2C, SPI
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    3.6V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    1.62V
  • Axis

    In electronic components, the parameter "Axis" typically refers to the orientation or direction along which a specific characteristic or measurement is being considered. For example, in a sensor or accelerometer, the axis may indicate the direction in which the device is measuring acceleration. In a motor or actuator, the axis may refer to the direction of movement or rotation.Understanding the axis of a component is crucial for proper installation, calibration, and operation. It helps in determining how the component will interact with other parts of a system and how its performance can be optimized. Different components may have multiple axes to consider, especially in complex systems where movement or measurements occur in multiple directions.Overall, the axis parameter provides important information about the spatial orientation or directionality of an electronic component, guiding engineers and technicians in effectively utilizing the component within a larger system.

    X, Y, Z
  • Acceleration Range

    The "Acceleration Range" parameter in electronic components refers to the range of acceleration levels that the component can withstand without experiencing damage or malfunction. This parameter is particularly important for components that are used in applications where they may be subjected to varying levels of acceleration, such as in automotive or aerospace systems. The acceleration range is typically specified in units of gravity (g) and indicates the maximum and minimum levels of acceleration that the component can tolerate while still operating within its specified performance limits. It is crucial to consider the acceleration range when selecting components for applications where acceleration levels may vary significantly to ensure reliable and safe operation.

    ±2g, 4g, 8g, 16g
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    Selectable Scale
  • Sensitivity (LSB/g)

    The parameter "Sensitivity (LSB/g)" in electronic components refers to the sensitivity of a sensor or device in terms of the number of least significant bits (LSBs) of output change per unit of acceleration (g). LSB is the smallest change in the digital output of a sensor. This parameter helps to quantify the resolution and accuracy of the sensor in detecting changes in acceleration. A higher sensitivity value indicates that the sensor can detect smaller changes in acceleration, while a lower sensitivity value means that larger changes in acceleration are needed to produce a noticeable output change. It is an important specification to consider when selecting a sensor for applications that require precise measurement of acceleration.

    4098 (±2g) ~ 512 (±16g)
  • Height
    700μm
  • Length
    2mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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Datasheet PDF

Download datasheets and manufacturer documentation for STMicroelectronics LIS2DW12TR.
Frequently Asked Questions

What is LIS2DW12TR?

The ultra-low-power high-performance three-axis linear accelerometer.

What is the output data rate of the LIS2DW12TR?

1.6 Hz to 1600 Hz.

What does the LIS2DW12TR have to process motion and acceleration detection?

A dedicated internal engine.

What is the temperature range of the LIS2DW12TR?

-40°C to +85°C.