MAX3237EAI Transceiver: Circuits, Pinout, and Datasheet

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Published: 11 March 2022 | Last Updated: 17 April 2025

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MAX3237EAI

MAX3237EAI

Maxim Integrated

28 Terminations 28 Pin MAX3237 Receivers 5/3 Drivers/Receivers 3 Functions

Purchase Guide

28 Terminations 28 Pin MAX3237 Receivers 5/3 Drivers/Receivers 3 Functions

The MAX3237EAI transceiver offers a patented low-dropout transmitter output stage that enables genuine RS-232 performance from a 3.0V to 5.5V supply. This article mainly introduces Circuits, Pinout, Datasheet and other detailed information about Maxim Integrated MAX3237EAI.

This video will show you the TRANSCEIVER meaning, definition & explanation.

What is TRANSCEIVER? What does TRANSCEIVER mean? TRANSCEIVER meaning, definition & explanation

MAX3237EAI Description

With a twin charge pump, the MAX3237EAI transceiver offers a patented low-dropout transmitter output stage that enables genuine RS-232  performance from a 3.0V to 5.5V supply. Only four modest 0.1F external charge-pump capacitors are required for the devices. The MAX3237EAI ensures that data speeds of 120kbps are maintained while preserving RS-232 output levels. In normal working mode, the MAX3237EAI is guaranteed to run at 250kbps, and in MegaBaudTM mode, it is guaranteed to run at 1Mbps.

Three receivers and five drivers are included in the MAX3237EAI.  In addition to the usual outputs, receiver R1 (MAX3237EAI) features additional outputs. These additional outputs are constantly active, allowing external devices to be monitored without forward biasing protection diodes in circuits with no VCC.


MAX3237EAI Pinout

The following figure is MAX3237EAI Pinout.

pinout.jpg

Pinout

Pin NumberPin NameDescription
13ENReceiver Enable. Active low.
28C1+Positive Terminal of Voltage-Doubler Charge-Pump Capacitor
27V++5.5V Generated by the Charge Pump
25C1-Negative Terminal of Voltage-Doubler Charge-Pump
Capacitor
1C2+Positive Terminal of Inverting Charge-Pump Capacitor
3C2-Negative Terminal of Inverting Charge-Pump Capacitor
4V--5.5V Generated by the Charge Pump
5, 6, 7, 10, 12T_OUTRS-232 Transmitter Outputs
8, 9, 11R_INRS-232 Receiver Inputs
18, 20, 21R_OUTTTL/CMOS Receiver Outputs
17, 19, 22, 23, 24T_INTTL/CMOS Transmitter Inputs
2GNDGround
26VCC+3.0V to +5.5V Supply Voltage
14SHDNShutdown Control. Active low.
15MBAUDMegaBaud Control Input. Connect to GND for normal operation; connect to VCC for 1Mbps transmission rates.
16R_OUTBNoninverting Complementary Receiver Outputs. Always active.


MAX3237EAI CAD Model

The followings are MAX3237EAI Symbol, Footprint and 3D Model.

symbol.png

Symbol

footprint.png

Footprint

3d model.jpg

3D Model


MAX3237EAI Features

• Integrated Features Saves Board Space and Simplifies Design

-Charge Pump Circuitry Eliminates the Need for a Bipolar ±12V Supply

-Wide Single-Supply Operation From +3V to +5.5V Supply

-Always-On Extra Outputs Enable Monitoring of External Devices

• Power Saving Extends Battery Life

-1µA Supply Current in Shutdown Mode While Receiver is Active


Specifications

Maxim Integrated MAX3237EAI technical specifications, attributes, parameters and parts with similar specifications to Maxim Integrated MAX3237EAI .
  • Type
    Parameter
  • Factory Lead Time
    6 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    28-SSOP (0.209, 5.30mm Width)
  • Number of Pins
    28
  • Number of I/Os
    16
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Published
    2007
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    28
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Type
    Transceiver
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn)
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    3V~5.5V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    3
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3.3V
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    MAX3237
  • Pin Count

    a count of all of the component leads (or pins)

    28
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    RS-232
  • Nominal Supply Current

    Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.

    2mA
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    150 ns
  • Logic Function

    In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.

    Receiver, Transceiver
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    250kbps
  • Differential Output

    a differential output voltage in electronics is the difference between the values of two AC voltages, 180° out of phase, present at the output terminals of an amplifier when you apply a differential input voltage to the input terminals of an amplifier.

    NO
  • Output Polarity

    Output polarity in electronic components refers to the orientation of the output signal in relation to the ground or reference voltage. It indicates whether the output voltage is positive or negative with respect to the ground. Positive output polarity means the signal is higher than the ground potential, while negative output polarity signifies that the signal is lower than the ground. This characteristic is crucial for determining compatibility with other components in a circuit and ensuring proper signal processing.

    INVERTED
  • Protocol

    In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.

    RS232
  • Input Characteristics

    In electronic components, "Input Characteristics" refer to the set of specifications that describe how the component behaves in response to signals or inputs applied to it. These characteristics typically include parameters such as input voltage, input current, input impedance, input capacitance, and input frequency range. Understanding the input characteristics of a component is crucial for designing circuits and systems, as it helps ensure compatibility and proper functioning. By analyzing these parameters, engineers can determine how the component will interact with the signals it receives and make informed decisions about its use in a particular application.

    SCHMITT TRIGGER
  • Number of Drivers/Receivers
    5/3
  • Duplex

    In the context of electronic components, "Duplex" refers to a type of communication system that allows for bidirectional data flow. It enables two devices to communicate with each other simultaneously, allowing for both sending and receiving of data at the same time. Duplex communication can be further categorized into two types: half-duplex, where data can be transmitted in both directions but not at the same time, and full-duplex, where data can be sent and received simultaneously. This parameter is crucial in networking and telecommunications systems to ensure efficient and effective data transmission between devices.

    Full
  • Receiver Hysteresis

    Receiver hysteresis is?commonly used to ensure glitch-free reception even when differential noise is present. This application report compares the noise immunity of the SN65HVD37 to similar devices available from competitors. Contents.

    300mV
  • Number of Drivers
    5
  • Number of Transceivers
    1
  • Number of Receivers
    3
  • Height
    1.78mm
  • Length
    10.33mm
  • Width
    5.38mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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MAX3237EAI Test Circuits

The MAX3237EAI Test Circuits are shown as follows.

MINIMUM SLEW-RATE TEST CIRCUIT.png

Minimum Slew-rate Test Circuit

MAXIMUM SLEW-RATE TEST CIRCUIT.png

Maximum Slew-rate Test Circuit

Loopback Test Circuit.png

Loopback Test Circuit


MAX3237EAI Typical Operating Circuit

The following figure is MAX3237EAI Typical Operating Circuit.

Typical Operating Circuits.png

Typical Operating Circuit

MAX3237EAI Alternatives

Part NumberDescriptionManufacturer
TRSF3238CDWG4DRIVERS AND INTERFACES5 LINE TRANSCEIVER, PDSO28, GREEN, PLASTIC, SOIC-28Texas Instruments
ICL3217CADRIVERS AND INTERFACESTRIPLE LINE TRANSCEIVER, PDSO24, PLASTIC, MO-150AG, SSOP-24Intersil Corporation
TRS3238ECDBRG4DRIVERS AND INTERFACES3-V to 5.5-V Multichannel RS-232 Line Driver/Receiver With +/-15-kV ESD (HBM) Protection 28-SSOP 0 to 70Texas Instruments
SP3238EA-L/TRDRIVERS AND INTERFACESLine Transceiver, 3 Func, 5 Driver, 3 Rcvr, PDSO28, LEAD FREE, PLASTIC, SSOP-28Sipex Corporation
ISL83239EIVDRIVERS AND INTERFACESLine TransceiverRenesas Electronics Corporation
MAX3218EWPDRIVERS AND INTERFACESLINE TRANSCEIVER, PDSO20, 0.300 INCH, SO-20Rochester Electronics LLC
SP3239EEA/TRDRIVERS AND INTERFACESLine Transceiver, 3 Func, 5 Driver, 3 Rcvr, CMOS, PDSO28, MO-150AH, SSOP-28Sipex Corporation
MAX3238EIDWRG4DRIVERS AND INTERFACESTRIPLE LINE TRANSCEIVER, PDSO28, GREEN, PLASTIC, SOIC-28Texas Instruments
SP3249ECY-L/TRDRIVERS AND INTERFACESLine Transceiver, 3 Func, 5 Driver, 3 Rcvr, CMOS, PDSO24, LEAD FREE, MO-153AD, TSSOP-24Sipex Corporation
MAX3218CWP+DRIVERS AND INTERFACESLine Transceiver, 1 Func, 2 Driver, 2 Rcvr, CMOS, PDSO20, 0.300 INCH, SO-20Maxim Integrated Products


MAX3237EAI Applications

● Battery-Powered Equipment

● Hand-Held Equipment

● Peripherals

● Datacom Equipment


MAX3237EAI Package

The following figure shows MAX3237EAI Package.

package.png

Package


MAX3237EAI Manufacturer

Analog Devices' Maxim Integrated designs, manufactures and sells analog and mixed-signal integrated circuits for automotive, industrial, communications, consumer, and computing applications. Power and battery management ICs, sensors, analog ICs, interface ICs, communications solutions, digital ICs, embedded security, and microcontrollers are all part of Maxim's product line. The company includes design centers, manufacturing facilities, and sales offices all around the world, with its headquarters in San Jose, California.


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Datasheet PDF

Download datasheets and manufacturer documentation for Maxim Integrated MAX3237EAI .
Frequently Asked Questions

What is a transceiver used for?

The transceiver is an important part of a fiber optics network and is used to convert electrical signals to optical (light) signals and optical signals to electrical signals. It can be plugged into or embedded into another device within a data network that can send and receive a signal.

What does the MAX3237EAI transceiver offer?

Low-dropout transmitter output stage.

How many external charge-pump capacitors are required for the MAX3237EAI?

Four.

What is the data speed of the MAX3237EAI?

120kbps.

What is the MAX3237EAI guaranteed to run in normal working mode?

250kbps.

How many receivers are included in the MAX3237EAI?

Three.

What is the name of the receiver that features additional outputs?

R1 (MAX3237EAI).

What does the MAX3237EAI allow external devices to be monitored without in circuits with no VCC?

Forward biasing protection diodes.
MAX3237EAI

Maxim Integrated

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