STM32F407ZET6 Microcontroller: Features, Applications and Datasheet

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Published: 24 November 2023 | Last Updated: 24 November 2023

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STM32F407ZET6

STM32F407ZET6

STMicroelectronics

512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller STM32F4 Series STM32F407 144 Pin 168MHz 3.3V 144-LQFP

Purchase Guide

512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller STM32F4 Series STM32F407 144 Pin 168MHz 3.3V 144-LQFP

A 32-bit microcontroller with 512 KB of flash memory and a frequency of 168 MHz is called the STM32F407ZET6. This article will introduce its features, applications and datasheet.

STM32F407ZET6 Description

A 32-bit microcontroller with 512 KB of flash memory and a frequency of 168 MHz is called the STM32F407ZET6. It belongs to the STM32F4 series of high-performance MCUs based on the Arm Cortex-M4 core and has a minimum operating temperature of -40 °C and a 144-pin LQFP packaging. Its instruction set architecture is DSP as well.


STM32F407ZET6 Features

  • A 32-bit RISC core operating at a frequency of up to 168 MHz, with a floating point unit (FPU) that supports all Arm single-precision data-processing instructions and data types, as well as a full set of DSP instructions and a memory protection unit (MPU) that enhances application security.

  • Up to 1 Mbyte of Flash memory and up to 192+4 Kbytes of SRAM, including 64-Kbyte of core coupled memory (CCM) data RAM and 4 Kbytes of backup SRAM.

  • A flexible static memory controller that supports Compact Flash, SRAM, PSRAM, NOR and NAND memories, and a LCD parallel interface with 8080/6800 modes.

  • A clock, reset and supply management unit that supports 1.8 V to 3.6 V application supply and I/Os, with a 4-to-26 MHz crystal oscillator, an internal 16 MHz factory-trimmed RC oscillator, a 32 kHz oscillator for RTC with calibration, and a low-power operation mode with sleep, stop and standby modes.

  • A 12-bit analog-to-digital converter (ADC) with up to 24 channels and 2.4 MSPS sampling rate, a 12-bit digital-to-analog converter (DAC) with 2 channels, and a low-power real-time clock (RTC) with a backup battery supply and 20×32 bit backup registers.

  • A general-purpose DMA controller with 16-streams and FIFOs and burst support, and up to 17 timers, including 12 16-bit and 2 32-bit timers with up to 4 input capture/output compare/pulse width modulation (IC/OC/PWM) channels or pulse counter and quadrature encoder inputs, and 2 PWM timers for motor control.

  • A serial wire debug (SWD) and JTAG interface, and a Cortex-M4 embedded trace macrocell for debugging and tracing.

  • Up to 140 I/O ports with interrupt capability, including up to 136 fast I/Os up to 84 MHz and up to 138 5 V-tolerant I/Os.

  • Up to 15 communication interfaces, including 3 I2C interfaces with SMBus/PMBus support, 4 USARTs/2 UARTs with ISO 7816, LIN, IrDA and modem control support, 3 SPIs with I2S support, 2 CANs, an SDIO interface, and an Ethernet MAC with MII or RMII interface.

  • A true random number generator (RNG) and a cryptographic acceleration unit that supports AES 128, 192, 256, Triple DES, HASH (MD5, SHA-1), and HMAC.


Specifications

STMicroelectronics STM32F407ZET6 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics STM32F407ZET6.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 7 months ago)
  • Factory Lead Time
    12 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    144-LQFP
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    144
  • Data Converters
    A/D 24x12b; D/A 2x12b
  • Number of I/Os
    114
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    STM32F4
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    144
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3.3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    168MHz
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    STM32F407
  • Pin Count

    a count of all of the component leads (or pins)

    144
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    CAN, EBI/EMI, Ethernet, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    512kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    192K x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    1.8V~3.6V
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROCONTROLLER, RISC
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    ARM® Cortex®-M4
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    32-Bit
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    512KB 512K x 8
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    CANbus, DCMI, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    32
  • Has ADC

    Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.

    YES
  • DMA Channels

    DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.

    YES
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    32b
  • PWM Channels

    PWM Channels, or Pulse Width Modulation Channels, refer to the number of independent PWM outputs available in an electronic component, such as a microcontroller or a motor driver. PWM is a technique used to generate analog-like signals by varying the duty cycle of a square wave signal. Each PWM channel can control the output of a specific device or component by adjusting the pulse width of the signal. Having multiple PWM channels allows for precise control of multiple devices simultaneously, making it a valuable feature in applications such as motor control, LED dimming, and audio signal generation. The number of PWM channels available in a component determines the flexibility and complexity of the system it can control.

    YES
  • Number of Timers/Counters
    14
  • Core Architecture

    In electronic components, the term "Core Architecture" refers to the fundamental design and structure of the component's internal circuitry. It encompasses the arrangement of key components, such as processors, memory units, and input/output interfaces, within the device. The core architecture plays a crucial role in determining the component's performance, power efficiency, and overall capabilities. Different core architectures are optimized for specific applications and requirements, such as high-speed processing, low power consumption, or specialized functions. Understanding the core architecture of electronic components is essential for engineers and designers to select the most suitable components for their projects.

    ARM
  • CPU Family

    CPU Family refers to a classification of microprocessors that share a common architecture and design traits. It signifies a group of processors that are typically produced by the same manufacturer and have similar functionality and features. The CPU Family can encompass various models that may differ in performance, power consumption, and specific capabilities but retain a unified core design, allowing for compatibility with software and hardware. This classification helps users and developers to understand the performance characteristics and upgrade pathways of different CPU models within the same family.

    CORTEX-M4
  • Number of UART Channels
    2
  • Number of ADC Channels
    24
  • Number of I2C Channels
    3
  • Number of Ethernet Channels
    1
  • Height
    1.45mm
  • Length
    20.2mm
  • Width
    20.2mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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STM32F407ZET6 Applications

  • Motor Drive & Control: The STM32F407ZET6 can control different types of motors, such as DC, BLDC, PMSM, ACIM, etc., using its advanced timers, PWM outputs, ADC inputs, and communication interfaces. It can also implement various motor control algorithms, such as field-oriented control (FOC), sensorless FOC, six-step control, etc., using its DSP and FPU capabilities.

  • Medical: The STM32F407ZET6 can be used for medical devices that need to process and display complex data, such as electrocardiograms (ECGs), blood pressure monitors, glucose meters, etc. It can also communicate with other devices or networks using its Ethernet, USB, CAN, or wireless interfaces.

  • Consumer Electronics: The STM32F407ZET6 can be used for consumer electronics that need to offer rich user interfaces, such as smart phones, tablets, cameras, gaming consoles, etc. It can also support multimedia applications, such as audio and video playback, recording, streaming, etc., using its I2S, SPI, SDIO, and LCD interfaces.

  • Computers & Computer Peripherals: The STM32F407ZET6 can be used for computers and computer peripherals that need to perform high-speed data transfers, such as printers, scanners, keyboards, mice, etc. It can also support various protocols, such as USB, Ethernet, HDMI, etc., using its flexible memory controller and DMA.

  • Communications & Networking: The STM32F407ZET6 can be used for communications and networking devices that need to handle large amounts of data, such as routers, switches, modems, gateways, etc. It can also support various standards, such as TCP/IP, Wi-Fi, Bluetooth, ZigBee, etc., using its Ethernet MAC, USART, UART, and SPI interfaces.

  • Industrial: The STM32F407ZET6 can be used for industrial applications that need to control and monitor complex systems, such as automation, robotics, CNC, etc. It can also implement various safety and security features, such as watchdog, CRC, RNG, and cryptographic acceleration.

  • Security: The STM32F407ZET6 can be used for security applications that need to protect sensitive data, such as access control, smart cards, biometrics, etc. It can also encrypt and decrypt data using its AES, Triple DES, HASH, and HMAC functions.

  • Imaging, Video & Vision: The STM32F407ZET6 can be used for imaging, video and vision applications that need to capture and process high-resolution images, such as cameras, scanners, face recognition, etc. It can also display images on various screens, such as LCD, OLED, etc., using its LCD parallel interface.

  • HVAC: The STM32F407ZET6 can be used for heating, ventilation, and air conditioning (HVAC) applications that need to regulate temperature, humidity, air quality, etc., such as thermostats, humidifiers, dehumidifiers, etc. It can also measure and control various parameters, such as temperature, pressure, flow, etc., using its ADC, DAC, and PWM outputs.


STM32F407ZET6 Manufacturer

STMicroelectronics is a global leader in creating products and solutions for smart mobility, extreme versatility, power and energy, and IoT and connectivity. It was founded in 1987 by the merger of two European semiconductor companies, SGS Microelettronica of Italy and Thomson Semiconducteurs of France. It has its headquarters in Geneva, Switzerland, and its legal domicile in Amsterdam, Netherlands. It has operations in 35 countries and employs more than 46,000 people.

STMicroelectronics offers one of the industry’s broadest technology portfolios, covering analog, digital, mixed-signal, and power products. It serves customers across various markets, such as automotive, industrial, consumer, personal electronics, communications, computing, medical, and aerospace. Some of its flagship products include STM32 microcontrollers, STSPIN motor drivers, ST25 NFC tags and readers, STSAFE secure elements, and STPOWER MOSFETs and IGBTs


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Datasheet PDF

Download datasheets and manufacturer documentation for STMicroelectronics STM32F407ZET6.
Frequently Asked Questions

What is the fault of the STM32F407ZET6 that causes no output signal and no SPI control?

According to a post on the STMicroelectronics Community, the fault may be caused by a wrong configuration of the boot mode pins or a corrupted firmware. The possible solutions are to check the boot mode pins and the power supply, and to reprogram the MCU using a debugger or a bootloader.

What is the difference between the STM32F407ZET6 and the STM32F407ZGT6?

The main difference between the STM32F407ZET6 and the STM32F407ZGT6 is the amount of flash memory. The STM32F407ZET6 has 512 Kbytes of flash memory, while the STM32F407ZGT6 has 1 Mbyte of flash memory. The other features and specifications are the same for both MCUs.

How can I program the STM32F407ZET6 and what tools do I need?

You can program the STM32F407ZET6 using various software tools, such as STM32CubeIDE6, Keil MDK-ARM, IAR Embedded Workbench, etc. You also need a hardware tool, such as a ST-LINK/V2, a J-Link, a ULINK, etc., to connect the MCU to your computer and debug your code.
STM32F407ZET6

STMicroelectronics

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