STM32F411RET6 Microcontrollers: Pinout, Features and Application

Sophie

Published: 13 July 2021 | Last Updated: 13 July 2021

5440

STM32F411RET6TR

STM32F411RET6TR

STMicroelectronics

512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller STM32F4 Series STM32F411 3.3V 64-LQFP

Purchase Guide

512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller STM32F4 Series STM32F411 3.3V 64-LQFP

The STM32F411RET6 devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. This article mainly introduces its pinout, features and more information about STM32F411RET6。

This video is about STM32F411RET6TR

STM32F411RET6TR

STM32F411RET6 Description

The STM32F411RET6 devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. The Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types.The STM32F411xC/xE belongs to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.


STM32F411RET6 Pinout

STM32F411RET6TR Pinout.jpg

STM32F411RET6 CAD Model

Symbol 

STM32F411RET6TR Symbol.jpg

Footprint

STM32F411RET6TR Footprint.jpg

3D Model

STM32F411RET6TR 3D Model.jpg

STM32F411RET6 Features

• Dynamic Efficiency Line with BAM (Batch Acquisition Mode)

– 1.7 V to 3.6 V power supply

– - 40°C to 85/105/125 °C temperature range 

• Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions

• Memories

– Up to 512 Kbytes of Flash memory 

– 128 Kbytes of SRAM 

• Clock, reset and supply management 

– 1.7 V to 3.6 V application supply and I/Os 

– POR, PDR, PVD and BOR 

– 4-to-26 MHz crystal oscillator 

– Internal 16 MHz factory-trimmed RC 

– 32 kHz oscillator for RTC with calibration 

– Internal 32 kHz RC with calibration 

• Power consumption 

– Run: 100 µA/MHz (peripheral off) 

– Stop (Flash in Stop mode, fast wakeup time): 42 µA Typ @ 25C; 65 µA max @25 °C 

– Stop (Flash in Deep power down mode, slow wakeup time): down to 9 µA @ 25 °C; 28 µA max @25 °C 

– Standby: 1.8 µA @25 °C / 1.7 V without RTC; 11 µA @85 °C @1.7 V

– VBAT supply for RTC: 1 µA @25 °C 

• 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels 

• General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support 

• Up to 11 timers: up to six 16-bit, two 32-bit timers up to 100 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer

•Debug mode 

– Serial wire debug (SWD) & JTAG interfaces 

– Cortex®-M4 Embedded Trace Macrocell™

• Up to 81 I/O ports with interrupt capability 

– Up to 78 fast I/Os up to 100 MHz 

– Up to 77 5 V-tolerant I/Os • Up to 13 communication interfaces 

– Up to 3 x I2C interfaces (SMBus/PMBus) 

– Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control) 

– Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), SPI2 and SPI3 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock 

– SDIO interface (SD/MMC/eMMC) 

– Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with on-chip PHY 

• CRC calculation unit 

• 96-bit unique ID 

• RTC: subsecond accuracy, hardware calendar 

• All packages (WLCSP49, LQFP64/100, UFQFPN48, UFBGA100) are ECOPACK®2

Specifications

STMicroelectronics STM32F411RET6TR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics STM32F411RET6TR.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 7 months ago)
  • Factory Lead Time
    12 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    64-LQFP
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Data Converters
    A/D 16x12b
  • Number of I/Os
    50
  • ROM(word)
    524288
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    STM32F4
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    64
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A991.A.2
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3.3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    STM32F411
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PQFP-G64
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    3.6V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    1.7V
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    100MHz
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    128K x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    1.7V~3.6V
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROCONTROLLER, RISC
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    ARM® Cortex®-M4
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    26MHz
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    32-Bit
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    512KB 512K x 8
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    I2C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Supply Current-Max

    Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.

    34.5mA
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    32
  • Has ADC

    Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.

    YES
  • DMA Channels

    DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.

    YES
  • PWM Channels

    PWM Channels, or Pulse Width Modulation Channels, refer to the number of independent PWM outputs available in an electronic component, such as a microcontroller or a motor driver. PWM is a technique used to generate analog-like signals by varying the duty cycle of a square wave signal. Each PWM channel can control the output of a specific device or component by adjusting the pulse width of the signal. Having multiple PWM channels allows for precise control of multiple devices simultaneously, making it a valuable feature in applications such as motor control, LED dimming, and audio signal generation. The number of PWM channels available in a component determines the flexibility and complexity of the system it can control.

    YES
  • DAC Channels

    DAC Channels refer to the number of independent analog output channels available in a digital-to-analog converter (DAC) electronic component. Each channel can convert a digital input signal into an analog output voltage or current. The number of DAC channels determines how many separate analog signals can be generated simultaneously by the DAC. For example, a DAC with two channels can output two different analog signals at the same time, while a DAC with only one channel can only output a single analog signal. The number of DAC channels is an important specification to consider when selecting a DAC for applications requiring multiple analog outputs.

    NO
  • On Chip Program ROM Width

    The parameter "On Chip Program ROM Width" refers to the data width of the read-only memory (ROM) implemented on a semiconductor chip. It indicates the number of bits that can be accessed simultaneously in each ROM read operation. A wider ROM width allows for faster data retrieval and processing, as more information can be transferred at once. This parameter is crucial in determining the overall performance and efficiency of electronic devices that utilize programmable ROM for storing firmware or application logic.

    8
  • CPU Family

    CPU Family refers to a classification of microprocessors that share a common architecture and design traits. It signifies a group of processors that are typically produced by the same manufacturer and have similar functionality and features. The CPU Family can encompass various models that may differ in performance, power consumption, and specific capabilities but retain a unified core design, allowing for compatibility with software and hardware. This classification helps users and developers to understand the performance characteristics and upgrade pathways of different CPU models within the same family.

    CORTEX-M4
  • Boundary Scan

    Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.

    YES
  • Low Power Mode

    Low Power Mode is a feature found in electronic components, such as microcontrollers, processors, and devices, that allows them to operate at reduced power consumption levels. When activated, the component typically reduces its clock speed, voltage, or disables certain functions to conserve energy. This mode is often used to extend battery life in portable devices or reduce overall power consumption in energy-efficient systems. Low Power Mode can be triggered automatically based on certain conditions, such as low battery levels, or manually by the user or software. It is a crucial feature in modern electronics to balance performance with energy efficiency.

    YES
  • Format

    In electronic components, the parameter "Format" typically refers to the physical size, shape, and configuration of the component. It describes the overall dimensions and layout of the component, including factors such as package type, lead spacing, and mounting options. The format of an electronic component is important for determining how it can be installed, connected, and integrated into a circuit or system. Different formats are designed to meet specific requirements for space constraints, heat dissipation, electrical performance, and compatibility with other components. Manufacturers often provide detailed specifications for the format of their components to ensure proper selection and usage in electronic designs.

    FLOATING-POINT
  • Integrated Cache

    Integrated Cache refers to a type of memory storage that is built directly into a microprocessor or other electronic component. It is used to temporarily store frequently accessed data and instructions to speed up processing and reduce latency. The integrated cache is designed to provide quick access to data that the processor needs to perform its tasks efficiently. By storing data closer to the processor, the integrated cache helps improve overall system performance by reducing the time it takes to retrieve information from the main memory. The size and speed of the integrated cache can have a significant impact on the performance of the electronic component, making it an important parameter to consider when evaluating the capabilities of a device.

    NO
  • RAM (words)

    RAM (words) is a parameter used to describe the memory capacity of a random access memory (RAM) module in terms of the number of words it can store. In the context of electronic components, a word typically refers to the amount of data that can be processed or stored by the RAM module in a single operation. The RAM (words) specification indicates the total number of words that can be stored in the RAM module, with each word typically consisting of a fixed number of bits. This parameter is important for determining the overall memory capacity and performance of the RAM module in electronic devices.

    128000
  • Number of External Interrupts
    16
  • On Chip Data RAM Width

    The "On Chip Data RAM Width" parameter in electronic components refers to the number of bits that can be processed simultaneously by the on-chip data random access memory (RAM) within the component. This parameter determines the amount of data that can be accessed and manipulated in a single operation, affecting the speed and efficiency of data processing. A wider RAM width allows for faster data transfer and processing, as more bits can be handled at once. It is an important specification to consider when evaluating the performance capabilities of electronic components, especially in applications where high-speed data processing is critical.

    8
  • Length
    10mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    1.6mm
  • Width
    10mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
0 Similar Products Remaining

STM32F411RET6 Application

• Motor drive and application control

• Medical equipment

• Industrial applications: PLC, inverters, circuit breakers

• Printers, and scanners

• Alarm systems, video intercom, and HVAC

• Home audio appliances

• Mobile phone sensor hub


STM32F411RET6 Application Diagram

USB OTG Full Speed (FS) interface solutions-1.jpg

USB OTG Full Speed (FS) interface solutions-2.jpg

USB OTG Full Speed (FS) interface solutions-3.jpg

Sensor Hub application example.jpg

STM32F411RET6 Package

STM32F411RET6TR Package.jpg

STM32F411RET6 Manufacturer

STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence trends.


Datasheet PDF

Download datasheets and manufacturer documentation for STMicroelectronics STM32F411RET6TR.

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Frequently Asked Questions

What is STM32F411RET6TR?

The STM32F411XC/XE devices are based on the high-performance Arm® Cortex® -M4 32-
bit RISC core operating at a frequency of up to 100 MHz.

How about STM32F411RET6TR?

The STM32F411RET6 32-bit RISC core, ARM microcontroller-MCU, operating frequency up to 100 MHz, Cortex®-M4 core with floating point unit (FPU) single precision, supporting all Arm single precision data processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU), thereby enhancing the security of the application.

Which is preferred: Arduino or STM32?

Depends on the task at hand. Applications that don’t require the use of advanced libraries can be efficiently implemented using an Arduino board. However, applications that do require a series of advanced manipulations will generally require something a bit more sophisticated i.e. an ARM-based platform like the STM32. Obviously, the sophisticated STM32 equipment costs more than an Arduino and is thus more versatile. However, for fairly simplistic projects, it’s a bit of an overkill.

With all that said, when it comes to making a purchase decision, I would recommend any beginner to purchase the STM32, as it can be reused for more complex projects in the future. I personally think that beginners should start with an 8051 or PIC microcontroller and build their own boards (soldering individual components and stuff) instead of starting off with a commercial one. That first LED-blinking experience should be on a crude, hand-made board programmed using low-level assembly or C. Using an Arduino or any such platform only isolates the users from the hardware and isn’t fruitful academically. For advanced projects, however, building your own board isn’t really feasible, and thus an STM32 board is a better choice there.

What temperature does STM32F411xC/xE operate in?

The STM32F411xC/xE operate in the - 40 to + 125 °C temperature range from a 1.7 (PDR
OFF) to 3.6 V power supply.
STM32F411RET6TR

STMicroelectronics

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