TPS1H200AQDGNRQ1 High-Side Switch: Diagram, Pinout, and Datasheet

The TPS1H200AQDGNRQ1 is a single-channel high-side power switch with an inbuilt 200-m  NMOS  power FET that is fully shielded.

By restricting the inrush or overload current, an adjustable current limit increases system reliability. The current limit's excellent accuracy increases overload protection while simplifying the front-stage power architecture. Aside from the current limit, configurable features allow design freedom in terms of functionality, cost, and thermal dissipation.

With the digital status output, the gadget offers complete diagnostics. In both the ON and OFF settings, open-load detection is provided. The gadget can be used with or without an MCU. Isolated systems can use the device in stand-alone mode.

The TPS1H200AQDGNRQ1 Pinout is shown as follows.

Pinout

The following figure is TPS1H200AQDGNRQ1 CAD Model.

Symbol

Footprint

3D Model

• Qualified for automotive applications

• AEC-Q100 qualified with the following results:

– Device temperature grade 1: –40°C to +125°C  ambient operating temperature range 

– Device HBM ESD Classification Level H2

– Device CDM ESD Classification Level C4B

• Functional Safety-Capable

– Documentation available to aid functional safety system design 

• Single-channel 200-mω smart high-side switch

• Wide operating voltage: 3.4 V to 40 V

• Ultra-low standby current, < 500 nA

• Adjustable current limit with external resistor

– ±15% when ≥ 500 mA

– ±10% when ≥ 1.5 A

• Configurable behavior after current limit

– Holding mode

– Latch-off mode with adjustable delay time

– Auto-retry mode

• Supports stand-alone operation without an MCU

• Protection:

– Short-to-GND and overload protection

– Thermal shutdown and thermal swing

– Negative voltage clamp for inductive loads

– Loss of GND and loss of battery protection 

• Diagnostics:

– Overload and short-to-GND detection

– Open-load and short-to-battery detection in ON or OFF state

– Thermal shutdown and thermal swing

The TPS1H200AQDGNRQ1 Typical Block Diagram is shown as follows.

Typical Block Diagram

The TPS1H200AQDGNRQ1 Functional Block Diagram is shown as follows.

Functional Block Diagram

The following figure shows an example of how to design the external circuitry parameters.

Typical Application Circuitry

TJ must be less than 175°C to avoid a thermal shutdown. The power dissipation can be significant if the output current is high. The PCB layout, on the other hand, is critical. A good PCB design improves heat transfer, which is critical for the device's long-term durability.

• Increase the heat conductivity of the board by increasing the copper covering on the PCB. The copper on the PCB is the primary heat-flow channel from the package to the ambient. When no heat sinks are mounted to the PCB on the opposite side of the board from the package, maximum copper is critical.

• To improve the board's thermal conductivity, place as many thermal vias as feasible directly beneath the package ground pad.

• To prevent solder voids, all thermal vias must be plated shut or plugged and sealed on both sides of the board. Solder coverage must be at least 85% to assure reliability and performance.

Layout

• Body Lighting

• Infotainment System

• Advanced Driver Assistance Systems (ADAS)

• Single-channel High-side Switch for Submodules

• General Resistive, Inductive, and Capacitive Loads

The following shows TPS1H200AQDGNRQ1 Package.

Package

Texas Instruments Incorporated (TI) is an American technology corporation based in Dallas, Texas, that creates and manufactures semiconductors and integrated circuits for electronic designers and manufacturers around the world. Based on sales volume, it is one among the top ten semiconductor businesses in the world. Analog chips and embedded processors, which account for more than 80% of the company's revenue, are the company's main focus. TI also makes calculators, microcontrollers, and multi-core processors, as well as TI digital light processing technologies and education technology.