2N5109 NPN Transistor: Datasheet, 2N5109 RF Amplifier, Replacement

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Published: 10 December 2021 | Last Updated: 10 December 2021

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2N5109

2N5109

Microsemi Corporation

Trans GP BJT NPN 20V 0.4A 3-Pin TO-39

Purchase Guide

Trans GP BJT NPN 20V 0.4A 3-Pin TO-39

The 2N5109 is an RF & Microwave discrete low power transistor. This post will unlock more details about 2N5109. There is a huge range of Semiconductors, Capacitors, Resistors and ICs in stock. Welcome RFQ!

The "classic 2N5109" low noise RX pre-amp is modified to work with the 75 Ohm 9 circle RX array.

2N5109 Pre-amp for 9 circle RX array

2N5109 Pinout

2N5109 Pinout.jpg

2N5109 Pinout

2N5109 CAD Model

2N5109 Symbol.jpg

2N5109 Symbol

2N5109 Footprint.jpg

2N5109 Footprint

2N5109 Description

The 2N5109 is a silicon NPN transistor in a TO39 type package designed specifically for broadband applications requiring good linearity. Usable as a high-frequency current mode switch to 200mA.

2N5109 Feature

  • Silicon NPN, To-39 packaged VHF/UHF Transistor 

  • 1.2 GHz Current-Gain Bandwidth Product @ 50mA 

  • Maximum Unilateral Gain = 12dB (typ) @ 200 MHz

2N5109 Absolute Maximum Ratings

  • Collector-Emitter Voltage, VCEO: 20V 

  • Collector-Base Voltage, VCBO: 40V 

  • Emitter-Base Voltage, VEBO: 3V 

  • Continuous Collector Current, IC: 400mA 

  • Continuous Base Current, IB:  400mA 

  • Total Device Dissipation (TC = +75°C, Note 1), PD: 2.5W 

  • Derate above +25°C: 20mW/°C 

  • Storage Temperature Range, Tstg: -65° to +200°C

2N5109 Replacement

The replacement for 2N5109:

  • 2N4428

  • BFW16

  • 2N5943

Specifications

Microsemi Corporation 2N5109 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation 2N5109.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Through Hole
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    TO-205AD, TO-39-3 Metal Can
  • Number of Pins
    3
  • Collector-Emitter Breakdown Voltage
    20V
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Published
    2004
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    no
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    200°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -65°C
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8541.29.00.75
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    2.5W
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • Transistor Type

    Transistor type refers to the classification of transistors based on their operation and construction. The two primary types are bipolar junction transistors (BJTs) and field-effect transistors (FETs). BJTs use current to control the flow of current, while FETs utilize voltage to control current flow. Each type has its own subtypes, such as NPN and PNP for BJTs, and MOSFETs and JFETs for FETs, impacting their applications and characteristics in electronic circuits.

    NPN
  • Collector Emitter Voltage (VCEO)

    Collector-Emitter Voltage (VCEO) is a key parameter in electronic components, particularly in transistors. It refers to the maximum voltage that can be applied between the collector and emitter terminals of a transistor while the base terminal is open or not conducting. Exceeding this voltage limit can lead to breakdown and potential damage to the transistor. VCEO is crucial for ensuring the safe and reliable operation of the transistor within its specified limits. Designers must carefully consider VCEO when selecting transistors for a circuit to prevent overvoltage conditions that could compromise the performance and longevity of the component.

    20V
  • Max Collector Current

    Max Collector Current is a parameter used to specify the maximum amount of current that can safely flow through the collector terminal of a transistor or other electronic component without causing damage. It is typically expressed in units of amperes (A) and is an important consideration when designing circuits to ensure that the component operates within its safe operating limits. Exceeding the specified max collector current can lead to overheating, degradation of performance, or even permanent damage to the component. Designers must carefully consider this parameter when selecting components and designing circuits to ensure reliable and safe operation.

    400mA
  • DC Current Gain (hFE) (Min) @ Ic, Vce

    The parameter "DC Current Gain (hFE) (Min) @ Ic, Vce" in electronic components refers to the minimum value of the DC current gain, denoted as hFE, under specific operating conditions of collector current (Ic) and collector-emitter voltage (Vce). The DC current gain hFE represents the ratio of the collector current to the base current in a bipolar junction transistor (BJT), indicating the amplification capability of the transistor. The minimum hFE value at a given Ic and Vce helps determine the transistor's performance and efficiency in amplifying signals within a circuit. Designers use this parameter to ensure proper transistor selection and performance in various electronic applications.

    40 @ 50mA 15V
  • Gain

    In electronic components, "Gain" refers to the ratio of the output signal amplitude to the input signal amplitude. It is a measure of the amplification provided by the component, such as a transistor or operational amplifier. Gain is typically expressed in decibels (dB) or as a numerical value, indicating how much the signal is amplified by the component.A higher gain value indicates a greater amplification of the input signal, while a lower gain value indicates less amplification. Gain is an important parameter in designing and analyzing electronic circuits, as it determines the overall performance and functionality of the system. Different components have different gain characteristics, and understanding the gain of a component is crucial for achieving the desired signal processing or amplification in electronic systems.

    12dB
  • Frequency - Transition

    The parameter "Frequency - Transition" in electronic components refers to the maximum frequency at which a signal transition can occur within the component. It is a crucial specification for digital circuits as it determines the speed at which data can be processed and transmitted. A higher frequency transition allows for faster operation and better performance of the electronic component. It is typically measured in hertz (Hz) or megahertz (MHz) and is specified by the manufacturer to ensure proper functioning of the component within a given frequency range.

    1.2GHz
  • Collector Base Voltage (VCBO)

    Collector Base Voltage (VCBO) is the maximum allowable voltage that can be applied between the collector and base terminals of a bipolar junction transistor when the emitter is open. It is a critical parameter that determines the voltage rating of the transistor and helps prevent breakdown in the collector-base junction. Exceeding this voltage can lead to permanent damage or failure of the component.

    40V
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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Parts with Similar Specs

2N5109 Package

2N5109 Package.jpg

2N5109 Package

2N5109 Manufacturer

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defence, communications, data centre and industrial markets. Products include high-performance and radiation-hardened analogue mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

Datasheet PDF

Download datasheets and manufacturer documentation for Microsemi Corporation 2N5109.

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