Adesto Technologies RM25C64DS-LTAI-B Memory: A Comprehensive Technical Overview
Mavriq™ Memory IC Mavriq™ Series
This article provides a detailed technical analysis of the Adesto Technologies RM25C64DS-LTAI-B memory, highlighting its features, applications, reference designs, alternative parts, and FAQs.
Product Introduction
Description:
The Adesto Technologies RM25C64DS-LTAI-B is a non-volatile memory device with a memory size of 64kb and a 32B page size. It operates at a voltage supply range of 1.65V to 3.6V and features a clock frequency of 20MHz. The memory format is CBRAM®, and it interfaces using SPI communication protocol. The device comes in a 8-TSSOP package and is suitable for surface mount applications.
Features:
1. Non-volatile memory: Retains data even when power is turned off.
2. High-speed operation: Clock frequency of 20MHz for fast data transfer.
3. Low power consumption: Operating voltage range of 1.65V to 3.6V.
4. Small form factor: 8-TSSOP package for space-constrained designs.
5. SPI interface: Easy integration with microcontrollers and other devices.
Applications:
Primary applications:
1. IoT devices: Used for storing configuration data, firmware updates, and sensor data.
2. Consumer electronics: Integrated into smart home devices, wearables, and portable gadgets.
3. Industrial automation: Employed in control systems, data loggers, and monitoring devices.
Secondary applications:
1. Automotive: Utilized in infotainment systems, telematics, and automotive diagnostics.
2. Medical devices: Embedded in patient monitoring equipment, diagnostic tools, and wearable health trackers.
3. Networking: Integrated into routers, switches, and network appliances.
Applicable specific modules:
1. Microcontrollers: Compatible with various microcontroller platforms for data storage.
2. Sensor interfaces: Used in conjunction with sensor modules for data logging and processing.
3. Communication modules: Paired with wireless communication modules for IoT applications.
Reference designs:
1. IoT data logger: A reference design showcasing the use of the RM25C64DS-LTAI-B for storing sensor data in IoT applications.
2. Smart home hub: Demonstrates how the memory device is used in a smart home hub for storing user preferences and device configurations.
3. Industrial control system: Reference design highlighting the integration of the memory in an industrial automation setup for storing control parameters.
Alternative parts:
1. RM25C32DS-LTAI-B: A 32kb version of the memory device for applications requiring lower storage capacity.
2. RM25C128DS-LTAI-B: A 128kb version of the memory device for applications needing higher storage capacity.
3. RM25C256DS-LTAI-B: A 256kb version of the memory device for applications demanding even higher storage capacity.
FAQs:
Q1: What is the maximum clock frequency supported by the RM25C64DS-LTAI-B memory?
A1: The memory device supports a clock frequency of up to 20MHz for high-speed data transfer.
Q2: Can the RM25C64DS-LTAI-B be used in automotive applications?
A2: Yes, the memory device is suitable for automotive applications such as infotainment systems and automotive diagnostics.
Q3: Does the RM25C64DS-LTAI-B support low-power operation?
A3: Yes, the memory device operates within a voltage range of 1.65V to 3.6V, making it suitable for low-power applications.
In conclusion, the Adesto Technologies RM25C64DS-LTAI-B memory device offers a versatile solution for various applications requiring non-volatile memory storage. Its high-speed operation, low power consumption, and small form factor make it a suitable choice for IoT, consumer electronics, and industrial automation applications. With a range of alternative parts available and reference designs showcasing its capabilities, the RM25C64DS-LTAI-B is a reliable choice for memory storage requirements.
Specifications
- TypeParameter
- Factory Lead Time26 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
8-TSSOP (0.173, 4.40mm Width) - Supplier Device Package
The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.
8-TSSOP - Memory TypesNon-Volatile
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C TA - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tube - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
Mavriq™ - Published2013
- Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Not For New Designs - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
1.65V~3.6V - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
64kb 32B Page Size - Clock Frequency
Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.
20MHz - Memory Format
Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.
CBRAM® - Memory Interface
An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.
SPI - Write Cycle Time - Word, Page
Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.
100μs, 2.5ms - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant
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