Discovering the Microchip PIC32MX230F128HVMR Microcontroller: Architecture, Modules, and Guidelines
128KB 128K x 8 FLASH MIPS32® M4K™ 32-Bit Microcontroller Automotive, AEC-Q100, PIC® 32MX Series PIC32MX230F128H 40MHz 3.3V 64-VFQFN Exposed Pad









128KB 128K x 8 FLASH MIPS32® M4K™ 32-Bit Microcontroller Automotive, AEC-Q100, PIC® 32MX Series PIC32MX230F128H 40MHz 3.3V 64-VFQFN Exposed Pad
This technical article provides a detailed examination of the Microchip PIC32MX230F128HVMR microcontroller, focusing on its CPU architecture, memory organization, interrupt controller, flash program memory, resets, oscillator configuration, direct memory access (DMA) controller, and USB on-the-go (OTG) features. Additionally, it includes guidelines for getting started with 32-bit MCUs and typical application connection examples.
Product Introduction
Description
The Microchip PIC32MX230F128HVMR microcontroller is a high-performance 32-bit CPU-based microcontroller designed for a wide range of embedded applications. With a comprehensive set of features, specialized modules, and USB on-the-go capabilities, the PIC32MX230F128HVMR offers a reliable solution for diverse embedded system requirements.
Features
The key features of the PIC32MX230F128HVMR microcontroller include:
- MIPS32® M4K® Processor Core
- Power Management
- EJTAG Debug Support
- Flash Program Memory
- Resets
- Oscillator Configuration
- Direct Memory Access (DMA) Controller
- USB On-The-Go (OTG)
Applications
The PIC32MX230F128HVMR microcontroller finds primary applications in:
1. Consumer electronics
2. Industrial automation
3. Smart home devices
4. IoT applications
5. Sensor nodes
The specific modules of this product applicable to these primary applications include USB on-the-go for versatile connectivity and direct memory access for efficient data transfer.
Reference Designs
The microcontroller is utilized in various reference designs, including:
1. Smart Home Automation Controller
2. IoT Sensor Node
3. Industrial Process Control Unit
4. Consumer Electronics Interface Board
5. Sensor Data Logger
Alternative Parts
For applications requiring different specifications or specialized features, alternative microcontroller parts that can be considered include:
1. PIC32MX250F128HVMR: Offering similar features with variations in memory organization and peripheral configurations
2. PIC32MX270F256DVMR: Featuring extended memory and additional peripheral modules for enhanced functionality
3. Other microcontrollers from the Microchip PIC32 family with different performance levels and memory configurations
FAQs
1. What are the primary features of the MIPS32® M4K® Processor Core?
- The MIPS32® M4K® processor core provides efficient processing capabilities and a versatile instruction set for a wide range of embedded applications.
2. Can the PIC32MX230F128HVMR support USB on-the-go (OTG) functionality?
- Yes, the microcontroller incorporates USB OTG support, enabling versatile connectivity and communication capabilities.
3. Under what primary applications can the PIC32MX230F128HVMR be used?
- The microcontroller is commonly used in consumer electronics, industrial automation, IoT devices, and sensor nodes due to its versatile features and USB connectivity.
4. Does the PIC32MX230F128HVMR feature a DMA controller for efficient data transfer?
- Yes, the microcontroller includes a direct memory access (DMA) controller for efficient and high-speed data transfers within the system.
5. Are there alternative parts available within the PIC32MX230F128HVMR series with different memory configurations?
- Yes, the PIC32MX230F128HVMR series offers a range of alternative parts with variations in memory sizes and peripheral configurations to cater to different application requirements.
This comprehensive overview provides in-depth insights into the Microchip PIC32MX230F128HVMR microcontroller, highlighting its features, applications, reference designs, alternative parts, and frequently asked questions. With a focus on performance, connectivity, and integration capabilities, the PIC32MX230F128HVMR serves as a compelling solution for a wide range of embedded systems.
Specifications
- TypeParameter
- Factory Lead Time6 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
64-VFQFN Exposed Pad - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Weight206.29948mg
- Data ConvertersA/D 28x10b
- Number of I/Os49
- ROM(word)131072
- Watchdog TimersYes
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~105°C TA - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tube - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
Automotive, AEC-Q100, PIC® 32MX - Published2009
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Number of Terminations64
- Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Matte Tin (Sn) - annealed - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
QUAD - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
3.3V - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
40MHz - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
PIC32MX230F128H - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
S-PQCC-N64 - Operating Supply Voltage
The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.
3.6V - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
I2C, I2S, IrDA, LIN, SPI, UART, USART, USB - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
128kB - Oscillator Type
Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.
Internal - RAM Size
RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.
16K x 8 - Voltage - Supply (Vcc/Vdd)
Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.
2.3V~3.6V - uPs/uCs/Peripheral ICs Type
The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.
MICROCONTROLLER, RISC - Core Processor
The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.
MIPS32® M4K™ - Peripherals
In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT - Program Memory Type
Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.
FLASH - Core Size
Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.
32-Bit - Program Memory Size
Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.
128KB 128K x 8 - Connectivity
In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.
I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG - Bit Size
In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.
32 - Has ADC
Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.
YES - DMA Channels
DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.
YES - Data Bus Width
The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.
32b - PWM Channels
PWM Channels, or Pulse Width Modulation Channels, refer to the number of independent PWM outputs available in an electronic component, such as a microcontroller or a motor driver. PWM is a technique used to generate analog-like signals by varying the duty cycle of a square wave signal. Each PWM channel can control the output of a specific device or component by adjusting the pulse width of the signal. Having multiple PWM channels allows for precise control of multiple devices simultaneously, making it a valuable feature in applications such as motor control, LED dimming, and audio signal generation. The number of PWM channels available in a component determines the flexibility and complexity of the system it can control.
YES - DAC Channels
DAC Channels refer to the number of independent analog output channels available in a digital-to-analog converter (DAC) electronic component. Each channel can convert a digital input signal into an analog output voltage or current. The number of DAC channels determines how many separate analog signals can be generated simultaneously by the DAC. For example, a DAC with two channels can output two different analog signals at the same time, while a DAC with only one channel can only output a single analog signal. The number of DAC channels is an important specification to consider when selecting a DAC for applications requiring multiple analog outputs.
NO - Number of Timers/Counters5
- Address Bus Width
A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.
16 - Core Architecture
In electronic components, the term "Core Architecture" refers to the fundamental design and structure of the component's internal circuitry. It encompasses the arrangement of key components, such as processors, memory units, and input/output interfaces, within the device. The core architecture plays a crucial role in determining the component's performance, power efficiency, and overall capabilities. Different core architectures are optimized for specific applications and requirements, such as high-speed processing, low power consumption, or specialized functions. Understanding the core architecture of electronic components is essential for engineers and designers to select the most suitable components for their projects.
PIC - On Chip Program ROM Width
The parameter "On Chip Program ROM Width" refers to the data width of the read-only memory (ROM) implemented on a semiconductor chip. It indicates the number of bits that can be accessed simultaneously in each ROM read operation. A wider ROM width allows for faster data retrieval and processing, as more information can be transferred at once. This parameter is crucial in determining the overall performance and efficiency of electronic devices that utilize programmable ROM for storing firmware or application logic.
8 - Length9mm
- Height Seated (Max)
Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.
1mm - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant
Parts with Similar Specs
- ImagePart NumberManufacturerPackage / CaseCore ArchitectureData Bus WidthNumber of I/OInterfaceMemory SizePeripheralsMoisture Sensitivity Level (MSL)View Compare
PIC32MX230F128H-V/MR
64-VFQFN Exposed Pad
PIC
32 b
49
I2C, I2S, IrDA, LIN, SPI, UART, USART, USB
128 kB
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
3 (168 Hours)
64-VFQFN Exposed Pad
PIC
32 b
49
CAN, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB
512 kB
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
3 (168 Hours)
64-VFQFN Exposed Pad
PIC
32 b
53
I2C, I2S, IrDA, LIN, SPI, UART, USART
128 kB
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
3 (168 Hours)
64-VFQFN Exposed Pad
PIC
32 b
49
CAN, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB
128 kB
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
3 (168 Hours)
Datasheet PDF
- Datasheets :
- PCN Assembly/Origin :
- PCN Design/Specification :
- PCN Packaging :
- ConflictMineralStatement :
- TDA7498E Audio Amplifier: Block Diagram, Datasheet, and Test Circuit
13 July 202114759
- TPS61161ADRVR LED Driver: Circuit, Pinout, and Datasheet
20 January 20221179
- STM32F302R6T6 Microcontroller: 72MHz, 64 KB Flash and 64-Pin LQFP
13 January 2022290
- ST1S06PUR DC-DC converter: Pinout, Features and Datasheet
14 August 2024388
- ADXL345 Accelerometer: Datasheet, Pinout and Alternatives
09 September 20215357
- 1N5818 Schottky Diode: Pinout, Datasheet, and Equivalents
03 September 20213301
- ATTINY88-MU 8-bit Microcontroller: Pinout, Equivalent and Datasheet
25 March 20221725
- ULN2803ADW Replacement Guide: Best Alternatives & Quick Swap Solutions 2025
29 August 2025121
- Intel CEO Reiterates: 2024 Will Achieve Process Leadership
05 May 20221055
- What is Graphics Processing Unit (GPU)?
18 October 20215290
- How Can Memory Adapt and Influence the Smart Age of the Future?
11 October 20221086
- Basic Understanding of Attenuators
15 September 202015896
- Solid-state Drive (SSD): Classification and Architecture
22 May 202113900
- Power of Dual and Isomorphic Principles in Power Electronics
24 July 20232634
- Unveiling the Potential of GaN Semiconductor-Enabled Three-Phase Propulsion Inverters for Enhanced EV Performance
09 August 20231361
- Reconfigurable Antennas: Improving Efficiency in Modern Communication
24 December 20242158
Microchip Technology
In Stock: 17
United States
China
Canada
Japan
Russia
Germany
United Kingdom
Singapore
Italy
Hong Kong(China)
Taiwan(China)
France
Korea
Mexico
Netherlands
Malaysia
Austria
Spain
Switzerland
Poland
Thailand
Vietnam
India
United Arab Emirates
Afghanistan
Åland Islands
Albania
Algeria
American Samoa
Andorra
Angola
Anguilla
Antigua & Barbuda
Argentina
Armenia
Aruba
Australia
Azerbaijan
Bahamas
Bahrain
Bangladesh
Barbados
Belarus
Belgium
Belize
Benin
Bermuda
Bhutan
Bolivia
Bonaire, Sint Eustatius and Saba
Bosnia & Herzegovina
Botswana
Brazil
British Indian Ocean Territory
British Virgin Islands
Brunei
Bulgaria
Burkina Faso
Burundi
Cabo Verde
Cambodia
Cameroon
Cayman Islands
Central African Republic
Chad
Chile
Christmas Island
Cocos (Keeling) Islands
Colombia
Comoros
Congo
Congo (DRC)
Cook Islands
Costa Rica
Côte d’Ivoire
Croatia
Cuba
Curaçao
Cyprus
Czechia
Denmark
Djibouti
Dominica
Dominican Republic
Ecuador
Egypt
El Salvador
Equatorial Guinea
Eritrea
Estonia
Eswatini
Ethiopia
Falkland Islands
Faroe Islands
Fiji
Finland
French Guiana
French Polynesia
Gabon
Gambia
Georgia
Ghana
Gibraltar
Greece
Greenland
Grenada
Guadeloupe
Guam
Guatemala
Guernsey
Guinea
Guinea-Bissau
Guyana
Haiti
Honduras
Hungary
Iceland
Indonesia
Iran
Iraq
Ireland
Isle of Man
Israel
Jamaica
Jersey
Jordan
Kazakhstan
Kenya
Kiribati
Kosovo
Kuwait
Kyrgyzstan
Laos
Latvia
Lebanon
Lesotho
Liberia
Libya
Liechtenstein
Lithuania
Luxembourg
Macao(China)
Madagascar
Malawi
Maldives
Mali
Malta
Marshall Islands
Martinique
Mauritania
Mauritius
Mayotte
Micronesia
Moldova
Monaco
Mongolia
Montenegro
Montserrat
Morocco
Mozambique
Myanmar
Namibia
Nauru
Nepal
New Caledonia
New Zealand
Nicaragua
Niger
Nigeria
Niue
Norfolk Island
North Korea
North Macedonia
Northern Mariana Islands
Norway
Oman
Pakistan
Palau
Palestinian Authority
Panama
Papua New Guinea
Paraguay
Peru
Philippines
Pitcairn Islands
Portugal
Puerto Rico
Qatar
Réunion
Romania
Rwanda
Samoa
San Marino
São Tomé & Príncipe
Saudi Arabia
Senegal
Serbia
Seychelles
Sierra Leone
Sint Maarten
Slovakia
Slovenia
Solomon Islands
Somalia
South Africa
South Sudan
Sri Lanka
St Helena, Ascension, Tristan da Cunha
St. Barthélemy
St. Kitts & Nevis
St. Lucia
St. Martin
St. Pierre & Miquelon
St. Vincent & Grenadines
Sudan
Suriname
Svalbard & Jan Mayen
Sweden
Syria
Tajikistan
Tanzania
Timor-Leste
Togo
Tokelau
Tonga
Trinidad & Tobago
Tunisia
Turkey
Turkmenistan
Turks & Caicos Islands
Tuvalu
U.S. Outlying Islands
U.S. Virgin Islands
Uganda
Ukraine
Uruguay
Uzbekistan
Vanuatu
Vatican City
Venezuela
Wallis & Futuna
Yemen
Zambia
Zimbabwe