MCP2561FD CAN Transceiver: Features, Equivalent and Datasheet

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Published: 21 January 2022 | Last Updated: 21 January 2022

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MCP2561FD-E/MF

MCP2561FD-E/MF

Microchip Technology

8 Terminations 8 Pin MCP2561 Receivers 1/1 Drivers/Receivers 1 Functions

Purchase Guide

8 Terminations 8 Pin MCP2561 Receivers 1/1 Drivers/Receivers 1 Functions

The MCP2561FD is a high-speed CAN device, fault-tolerant device that serves as the interface between a CAN protocol controller and the physical bus. The MCP2561FD device provides differential transmit and receive capability for the CAN protocol controller, and is fully compatible with the ISO-11898-2 and ISO-11898-5 standards. Furthermore, Huge range of Semiconductors, Capacitors, Resistors and IcS in stock. Welcome RFQ.

This video shows us that MCP2561FD transceiver supports CAN and CAN FD Networking.

MCP2561/2FD Transceivers Support CAN and CAN FD Networking

MCP2561FD Pinout

The following figure is the diagram of MCP2561FD pinout.

Pinout.png

Pinout

MCP2561FD CAD Model

The following is MCP2561FD Footprint.

Footprint.png

Footprint


MCP2561FD Overview

The MCP2561FD is a second generation high-speed CAN transceiver from Microchip Technology Inc. It offers the same features as the MCP2561. Additionally, it guarantees Loop Delay Symmetry in order to support the higher data rates required for CAN FD. The maximum propagation delay was improved to support longer bus length. The device meets the automotive requirements for CAN FD bit rates exceeding 2 Mbps, low quiescent current, electromagnetic compatibility (EMC) and electrostatic discharge (ESD).

This article provides you with a basic overview of the MCP2561FD CAN Transceiver, including its pin descriptions, features and specifications, etc., to help you quickly understand what MCP2561FD is.


MCP2561FD Features

● Optimized for CAN FD (Flexible Data rate) at 2, 5 and 8 Mbps Operation

   ◆ Maximum Propagation Delay: 120 ns

   ◆ Loop Delay Symmetry: -10%/+10% (2 Mbps)

● Implements ISO-11898-2 and ISO-11898-5 Standard Physical Layer Requirements

● Very Low Standby Current (5 µA, typical)

● VIO Supply Pin to Interface Directly to CAN Controllers and Microcontrollers with 1.8V to 5.5V I/O

● SPLIT Output Pin to Stabilize Common Mode in Biased Split Termination Schemes

● CAN Bus Pins are Disconnected when Device is Unpowered

   ◆ An Unpowered Node or Brown-Out Event will Not Load the CAN Bus

● Detection of Ground Fault:

   ◆ Permanent Dominant Detection on TXD

   ◆ Permanent Dominant Detection on Bus

● Power-on Reset and Voltage Brown-Out Protection on VDD Pin

● Protection Against Damage Due to Short-Circuit Conditions (Positive or Negative Battery Voltage)

● Protection Against High-Voltage Transients in Automotive Environments

● Automatic Thermal Shutdown Protection

● Suitable for 12V and 24V Systems

● Meets or exceeds stringent automotive design requirements including “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”, Version 1.3, May 2012

   ◆ Radiated emissions @ 2 Mbps with Common Mode Choke (CMC)

   ◆ DPI @ 2 Mbps with CMC

● High ESD Protection on CANH and CANL, meeting IEC61000-4-2 up to ±14 kV

● Available in PDIP-8L, SOIC-8L and 3x3 DFN-8L

● Temperature ranges:

   ◆ Extended (E): -40°C to +125°C

   ◆ High (H): -40°C to +150°C


Specifications

Microchip Technology MCP2561FD-E/MF technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology MCP2561FD-E/MF.
  • Type
    Parameter
  • Factory Lead Time
    12 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    8-VDFN Exposed Pad
  • Number of Pins
    8
  • Weight
    37.393021mg
  • Usage Level
    Automotive grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~125°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Published
    2014
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    8
  • Type
    Transceiver
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn) - annealed
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    4.5V~5.5V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    NO LEAD
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    MCP2561
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    CAN
  • Operating Supply Current

    Operating Supply Current, also known as supply current or quiescent current, is a crucial parameter in electronic components that indicates the amount of current required for the device to operate under normal conditions. It represents the current drawn by the component from the power supply while it is functioning. This parameter is important for determining the power consumption of the component and is typically specified in datasheets to help designers calculate the overall power requirements of their circuits. Understanding the operating supply current is essential for ensuring proper functionality and efficiency of electronic systems.

    70mA
  • Max Supply Current

    Max Supply Current refers to the maximum amount of electrical current that a component can draw from its power supply under normal operating conditions. It is a critical parameter that ensures the component operates reliably without exceeding its thermal limits or damaging internal circuitry. Exceeding this current can lead to overheating, performance degradation, or failure of the component. Understanding this parameter is essential for designing circuits that provide adequate power while avoiding overload situations.

    70mA
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    8Mbps
  • Protocol

    In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.

    CANbus
  • Number of Drivers/Receivers
    1/1
  • Receiver Hysteresis

    Receiver hysteresis is?commonly used to ensure glitch-free reception even when differential noise is present. This application report compares the noise immunity of the SN65HVD37 to similar devices available from competitors. Contents.

    200mV
  • Number of Receivers
    1
  • Height
    950μm
  • Length
    3mm
  • Width
    3mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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MCP2561FD Functional Block Diagram

The following is the Block Diagram of MCP2561FD.

Block Diagram.png

Block Diagram


MCP2561FD Equivalent

             Model number                 Manufacturer                                       Description
TJA1040T/N1NXP SemiconductorsIC DATACOM, INTERFACE CIRCUIT, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, MS-012, SOT96-1, SOP-8, Network Interface
TJA1040T/V,112NXP SemiconductorsTJA1040 - High-speed CAN transceiver with standby mode SOIC 8-Pin
935288885118NXP SemiconductorsIC DATACOM, INTERFACE CIRCUIT, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8, Network Interface
TJA1040T/N1,118NXP SemiconductorsTJA1040 - High-speed CAN transceiver with standby mode SOIC 8-Pin
MAX3057ASA+Maxim Integrated ProductsInterface Circuit, BICMOS, PDSO8, 0.150 INCH, SOIC-8
MAX3057ASAMaxim Integrated ProductsInterface Circuit, 1-Trnsvr, BICMOS, PDSO8, 0.150 INCH, SOIC-8
935263363118NXP SemiconductorsIC DATACOM, INTERFACE CIRCUIT, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8, Network Interface
SN65HVD251DG4Texas InstrumentsHigh Speed CAN Transceiver with Short Loop Delay 8-SOIC -40 to 125
935300641118NXP SemiconductorsDATACOM, INTERFACE CIRCUIT, PDSO8
TJA1042TK/3NXP SemiconductorsDATACOM, INTERFACE CIRCUIT, PDSO8, 3 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-229, SOT782-1, HVSON-8


Parts with Similar Specs

The three parts on the right have similar specifications to Microchip Technology & MCP2561FD-E/MF.

MCP2561FD Package

The following diagram shows the MCP2561FD package.

Top View.png

Top View


Side View.png

Side View


Bottom View.png

Bottom View


MCP2561FD Package Marking Information

The following is the Package Marking Information of MCP2561FD.

8-Lead DFN (3x3 mm).png

8-Lead DFN (3x3 mm)


Example.png

Example


MCP2561FD Recommended Land Pattern

The following diagram shows the MCP2561FD Recommended Land Pattern.

Recommended Land Pattern.png

Recommended Land Pattern


MCP2561FD Manufacturer

Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.


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Datasheet PDF

Download datasheets and manufacturer documentation for Microchip Technology MCP2561FD-E/MF.
Frequently Asked Questions

What is the essential property of the MCP2561FD?

The MCP2561FD is a high-speed CAN device, fault-tolerant device that serves as the interface between a CAN protocol controller and the physical bus. The MCP2561FD device provides differential transmit and receive capability for the CAN protocol controller, and is fully compatible with the ISO-11898-2 and ISO-11898-5 standards.

What should a CAN controller do to achieve high speed data communication?

The CAN controller gets interrupted by a negative edge on the RXD pin (Dominant state on the CAN bus). The CAN controller must put the MCP2561FD back into Normal mode, using the STBY pin, in order to enable high speed data communication.

How does the MCP2561FD protect the device from high current loads?

The device is further protected from excessive current loading by thermal shutdown circuitry that disables the output drivers when the junction temperature exceeds a nominal limit of +175°C. All other parts of the chip remain operational, and the chip temperature is lowered due to the decreased power dissipation in the transmitter outputs. This protection is essential to protect against bus line short-circuit-induced damage.
MCP2561FD-E/MF

Microchip Technology

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