PIC12F675 Microcontroller: Circuit, Pinout, and Datasheet [Video&FAQ]
1.75KB 1K x 14 FLASH PIC 8-Bit Microcontroller PIC® 12F Series PIC12F675 8 Pin 20MHz 5V 8-DIP (0.300, 7.62mm)









1.75KB 1K x 14 FLASH PIC 8-Bit Microcontroller PIC® 12F Series PIC12F675 8 Pin 20MHz 5V 8-DIP (0.300, 7.62mm)
PIC12F675 is an 8-Bit CMOS Microcontroller made by MICROCHIP TECHNOLOGY and is developed on high-performance RISC architecture. This article mainly introduces circuit, pinout, datasheet and other detailed information about Microchip Technology PIC12F675.

Getting Started with Programming PIC 12F675
- PIC12F675 Description
- PIC12F675 Pinout
- PIC12F675 CAD Model
- PIC12F675 Features
- Specifications
- Parts with Similar Specs
- PIC12F675 Functional Block Diagram
- How to use PIC12F675 Microcontroller
- PIC12F675 Ultrasonic Proximity Detector Circuit Diagram
- PIC12F675 Equivalent
- PIC12F675 Alternatives
- PIC12F675 Applications
- PIC12F675 Package
- PIC12F675 Manufacturer
- Trend Analysis
- Datasheet PDF
PIC12F675 Description
The PIC12F675 is an 8-Bit CMOS Microcontroller made by MICROCHIP TECHNOLOGY and is developed on high-performance RISC architecture. This microcontroller is very popular among hobbyists and engineers due its cost and small size.
The PIC12F675 is a microcontroller developed for low-cost systems and applications. Engineers will benefit from its high flash memory rewrite cycle, which makes it ideal for learning and experimenting. The controller features 2KBytes of flash memory, which is sufficient for beginners to write simple programs. The six GPIO pins are also intended to handle a maximum current of 25mA, which is sufficient for many peripheral devices and sensors.
This controller has a limited set of capabilities and cannot be used to create complex applications. It's great for novices who wish to learn how to program for the microcontroller platform.
PIC12F675 Pinout
The following shows PIC12F675 Pinout.

Pinout
| Pin Number | Pin Name | Function | Description |
| 7 | GP0/AN0/CIN+/ICSPDAT | GP0 | Bidirectional I/O w/ programmable pull-up and interrupt-on-change |
| AN0 | A/D Channel 0 input | ||
| CIN+ | Comparator input | ||
| ICSPDAT | Serial programming I/O | ||
| 6 | GP1/AN1/CIN-/VREF/ICSPCLK | GP1 | Bidirectional I/O w/ programmable pull-up and interrupt-on-change |
| AN1 | A/D Channel 1 input | ||
| CIN- | Comparator input | ||
| VREF | External voltage reference | ||
| ICSPCLK | Serial programming clock | ||
| 5 | GP2/AN2/T0CKI/INT/COUT | GP2 | Bidirectional I/O w/ programmable pull-up and interrupt-on-change |
| AN2 | A/D Channel 2 input | ||
| T0CKI | TMR0 clock input | ||
| INT | External interrupt | ||
| COUT | Comparator output | ||
| 4 | GP3/MCLR/VPP | GP3 | Input port w/ interrupt-on-change |
| MCLR | Master Clear | ||
| VPP | Programming voltage | ||
| 3 | GP4/AN3/T1G/OSC2/CLKOUT | GP4 | Bidirectional I/O w/ programmable pull-up and interrupt-on-change |
| AN3 | A/D Channel 3 input | ||
| T1G | TMR1 gate | ||
| OSC2 | Crystal/resonator | ||
| CLKOUT | FOSC/4 output | ||
| 2 | GP5/T1CKI/OSC1/CLKIN | GP5 | Bidirectional I/O w/ programmable pull-up and interrupt-on-change |
| T1CKI | TMR1 clock | ||
| OSC1 | Crystal/resonator | ||
| CLKIN | External clock input/RC oscillator connection | ||
| 8 | VSS | VSS | Ground reference |
| 1 | VDD | VDD | Positive supply |
PIC12F675 CAD Model
The PIC12F675 Symbol, Footprint and 3D Model are shown as follows.

Symbol

Footprint

3D Model
PIC12F675 Features
(1) High-Performance RISC CPU:
• Only 35 Instructions to Learn
- All single-cycle instructions except branches
• Operating Speed:
- DC - 20 MHz oscillator/clock input
- DC - 200 ns instruction cycle
• Interrupt Capability
• 8-Level Deep Hardware Stack
• Direct, Indirect, and Relative Addressing modes
(2) Special Microcontroller Features:
• Internal and External Oscillator Options
- Precision Internal 4 MHz oscillator factory calibrated to ±1%
- External Oscillator support for crystals and resonators
- 5 μs wake-up from Sleep , 3.0V, typical
• Power-Saving Sleep mode
• Wide Operating Voltage Range – 2.0V to 5.5V
• Industrial and Extended Temperature Range
• Low-Power Power-on Reset (POR)
• Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
• Brown-out Detect (BOD)
• Watchdog Timer (WDT) with Independent Oscillator for Reliable Operation
• Multiplexed MCLR/Input Pin
• Interrupt-on-Pin Change
• Individual Programmable Weak Pull-ups
• Programmable Code Protection
• High Endurance Flash /EEPROM Cell
- 100,000 write Flash endurance
- 1,000,000 write EEPROM endurance
- Flash/Data EEPROM Retention: > 40 years
(3) Low-Power Features:
• Standby Current:
- 1 nA @ 2.0V, typical
• Operating Current:
- 8.5 μA @ 32 kHz, 2.0V, typical
- 100 μA @ 1 MHz, 2.0V, typical
• Watchdog Timer Current
- 300 nA @ 2.0V, typical
• Timer1 Oscillator Current:
- 4 μA @ 32 kHz, 2.0V, typical
(4) Peripheral Features:
• 6 I/O Pins with Individual Direction Control
• High Current Sink/Source for Direct LED Drive
• Analog Comparator module with:
- One analog comparator
- Programmable on-chip comparator voltage reference (CVREF) module
- Programmable input multiplexing from device inputs
- Comparator output is externally accessible
• Analog-to-Digital Converter module (PIC12F675):
- 10-bit resolution
- Programmable 4-channel input
- Voltage reference input
• Timer0: 8-Bit Timer/Counter with 8-Bit
Programmable Prescaler
• Enhanced Timer1:
- 16-bit timer/counter with prescaler
- External Gate Input mode
- Option to use OSC1 and OSC2 in LP mode as Timer1 oscillator, if INTOSC mode selected
• In-Circuit Serial Programming™ (ICSP™) via two pins
Specifications
- TypeParameter
- Factory Lead Time6 Weeks
- Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Through Hole - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Through Hole - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
8-DIP (0.300, 7.62mm) - Number of Pins8
- Data ConvertersA/D 4x10b
- Number of I/Os5
- Watchdog TimersYes
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C TA - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tube - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
PIC® 12F - Published2003
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Number of Terminations8
- Termination
Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.
Through Hole - ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Matte Tin (Sn) - Max Power Dissipation
The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.
800mW - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
5V - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
20MHz - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
PIC12F675 - Pin Count
a count of all of the component leads (or pins)
8 - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
RS-232, USB - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
1.8kB - Oscillator Type
Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.
Internal - Nominal Supply Current
Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.
100μA - RAM Size
RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.
64 x 8 - Voltage - Supply (Vcc/Vdd)
Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.
2V~5.5V - uPs/uCs/Peripheral ICs Type
The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.
MICROCONTROLLER, RISC - Core Processor
The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.
PIC - Peripherals
In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.
POR, WDT - Program Memory Type
Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.
FLASH - Core Size
Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.
8-Bit - Program Memory Size
Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.
1.75KB 1K x 14 - Bit Size
In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.
8 - Access Time
Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.
20 μs - Has ADC
Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.
YES - DMA Channels
DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.
NO - Data Bus Width
The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.
8b - PWM Channels
PWM Channels, or Pulse Width Modulation Channels, refer to the number of independent PWM outputs available in an electronic component, such as a microcontroller or a motor driver. PWM is a technique used to generate analog-like signals by varying the duty cycle of a square wave signal. Each PWM channel can control the output of a specific device or component by adjusting the pulse width of the signal. Having multiple PWM channels allows for precise control of multiple devices simultaneously, making it a valuable feature in applications such as motor control, LED dimming, and audio signal generation. The number of PWM channels available in a component determines the flexibility and complexity of the system it can control.
NO - Number of Timers/Counters2
- Address Bus Width
A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.
8b - Density
In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.
14 kb - EEPROM Size
EEPROM Size refers to the amount of memory capacity available in an Electrically Erasable Programmable Read-Only Memory (EEPROM) chip. This parameter indicates the total storage space in bytes or bits that can be used to store data in a non-volatile manner. The EEPROM size determines the maximum amount of information that can be written, read, and erased from the memory chip. It is an important specification to consider when selecting an EEPROM for a particular application, as it directly impacts the amount of data that can be stored and accessed by the electronic component.
128 x 8 - CPU Family
CPU Family refers to a classification of microprocessors that share a common architecture and design traits. It signifies a group of processors that are typically produced by the same manufacturer and have similar functionality and features. The CPU Family can encompass various models that may differ in performance, power consumption, and specific capabilities but retain a unified core design, allowing for compatibility with software and hardware. This classification helps users and developers to understand the performance characteristics and upgrade pathways of different CPU models within the same family.
PIC - Number of A/D Converters1
- Number of Programmable I/O6
- Number of ADC Channels4
- Height4.953mm
- Length10.16mm
- Width7.112mm
- REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
No SVHC - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
Parts with Similar Specs
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltagePeripheralsView Compare
PIC12F675-I/P
8-DIP (0.300, 7.62mm)
8
8 b
5
RS-232, USB
1.8 kB
5 V
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8-DIP (0.300, 7.62mm)
8
8 b
5
RS-232, USB
1.8 kB
4.5 V
Brown-out Detect/Reset, POR, PWM, WDT
8-DIP (0.300, 7.62mm)
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Brown-out Detect/Reset, POR, PWM, WDT
8-DIP (0.300, 7.62mm)
8
8 b
5
RS-232, USB
1.8 kB
5 V
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PIC12F675 Functional Block Diagram
How to use PIC12F675 Microcontroller
Before using a microcontroller in a system or application, it must first be programmed. So, first and foremost, we must program the PIC12F675 controller.
The entire procedure for programming the PIC12F675 is as follows:
• First list all the functions to be executed by this controller.
• Next write these functions in ‘IDE software’ using a relative programming language (use ‘C’ language in MPLAB IDE ).
• After writing the desired program compile it for error elimination
• For a successful compilation IDE application generates a HEX file for the written program
• Choose the programming device (usually ‘PIC kit 3’ or ‘PIC kit 2’) which establishes communication between PC and PIC12F675
• Connect the programming device to the microcontroller appropriately
• Run the HEX file dumping software which is related to the chosen programming device
• Choose the appropriate program HEX file and burn this HEX file in PIC12F675 flash memory
• Disconnect the programmer and connect the appropriate peripherals for the controller
After plugging in the electricity, the controller runs the HEX code stored in the memory (which is a written program) and generates the desired response.
PIC12F675 Ultrasonic Proximity Detector Circuit Diagram
The ultrasonic proximity detector circuit PIC12F675 detects a distance of about 30 cm to 3 m mounted on the microcontroller.
The rotating time of the radiating ultrasonic wave reflected from any object is used to calculate ultrasonic distance. The design is as basic and tiny as feasible, thanks to the Microchip PIC12F675 microcontroller and integrated hardware functionalities, and the circuit is mounted on a PCB board.
The reflected wave connects the signal amplified with the NE5532 to the input of the PIC12F675 microcontroller's inbuilt comparator (pin 6).
An internal reference is set to the comparator and the decision level is modified inside the PIC12F675 Microcontroller. Changing its value (VRCON recording) makes adjusting the circuit's sensitivity to the input signal a breeze. The sensitivity is now tuned to the lowest feasible value thanks to the adoption of a high-quality operational amplifier in the IO1 position.
R6 is attached to the internal A/D converter's input, which continuously monitors its present position. It is utilized as a decision level for measuring the ultrasonic wave's reflection duration, and the software limits it to a range of around 30 cm to 3 m.
The microcontroller output (pin 7) and then the output transistor T1 will open if the reflected wave is set or detected at a lower range/distance, for example, to control the relay, buzzer, or any other system. LED D1 turns on the output, which remains open for the duration of the obstacle detection period within the set distance.
The ultrasonic sensor circuit is designed with DIP and SMD type 2 PCBs . SMD source asm and hex software files come in two flavors: double-layer and single-source.

Ultrasonic Proximity Detector Circuit
PIC12F675 Equivalent
PIC12F675 Alternatives
| Part Number | Description | Manufacturer |
| PIC12F675T-C/SNMICROCONTROLLERS AND PROCESSORS | 8-Pin, Flash-Based 8-Bit CMOS Microcontrollers, 0C to +70C, 8-SOIC 150mil, T/R | Microchip Technology Inc |
| PIC12F675-I/SNMICROCONTROLLERS AND PROCESSORS | 8-BIT, FLASH, 20 MHz, RISC MICROCONTROLLER, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | Microchip Technology Inc |
| PIC12F675-C/SNMICROCONTROLLERS AND PROCESSORS | 8-Pin, Flash-Based 8-Bit CMOS Microcontrollers, 0C to +70C, 8-SOIC 150mil, TUBE | Microchip Technology Inc |
| PIC12F675-I/SNC01GMICROCONTROLLERS AND PROCESSORS | 8-BIT, FLASH, 20 MHz, RISC MICROCONTROLLER, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | Microchip Technology Inc |
| PIC12F675-E/SNMICROCONTROLLERS AND PROCESSORS | 8-BIT, FLASH, 20 MHz, RISC MICROCONTROLLER, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | Microchip Technology Inc |
PIC12F675 Applications
• Low-end applications like scrolling display, temperature monitor etc
• Beginner applications
• Hobbyist projects
• Display units
• Development board for learners
PIC12F675 Package
The PIC12F675 Package is shown as follows.

Package
PIC12F675 Manufacturer
Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, delivering low-risk product development, reduced overall system cost, and faster time to market to thousands of customers across the world. Microchip, based in Chandler, Arizona, provides excellent technical support as well as consistent delivery and quality.
Trend Analysis
Datasheet PDF
- Datasheets :
- PCN Packaging :
- ConflictMineralStatement :
What is the difference between PIC12F675 and PIC12F683?
For the same series, the resources of PIC12F683 are basically double that of PIC12F675. PIC12F675 program: 1.75K, EEPROM: 128, RAM: 64, clock: 4 MHz. PIC12F683 program: 3.5K, EEPROM: 256, RAM: 128, clock: 8 MHz, one more 8-bit timer.
What is the difference between PIC12F629 and PIC12F675?
The only difference between the PIC12F629 and the PIC12F675 is that the PIC12F675 contains a 10-bit A/D converter. 8-pin PDIP, SOIC, MLF-S, and DFN packages are available.
How to burn PIC12F675 online?
(1) Check the information of PIC12F675 and set the control word to set it as the built-in 4MHZ crystal oscillator; (2) 1.46~2.5V should be high level, 1.45V is low level, just use an if...else... statement.
Who made the PIC12F675?
MICROCHIP TECHNOLOGY.
Why is the PIC12F675 popular among hobbyists and engineers?
It's cost and small size.
What is the PIC12F675 a microcontroller developed for?
Low-cost systems and applications.
What makes the PIC12F675 ideal for learning and experimenting?
High flash memory rewrites cycle.
How much flash memory does the PIC12F675 have?
2KBytes.
What is the maximum current of the PIC12F675?
25mA.
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