STM32H743VIT6 Microcontroller: 480MHz, 100-LQFP, Pinout and Datasheet

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Published: 10 February 2022 | Last Updated: 10 February 2022

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STM32H743VIT6

STM32H743VIT6

STMicroelectronics

2MB 2M x 8 FLASH ARM® Cortex®-M7 32-Bit Microcontroller STM32H7 Series STM32H743 480MHz 3V 100-LQFP

Purchase Guide

2MB 2M x 8 FLASH ARM® Cortex®-M7 32-Bit Microcontroller STM32H7 Series STM32H743 480MHz 3V 100-LQFP

STM32H743VIT6 is a 32-bit high-performance microcontroller based on the Arm® Cortex®-M4 processor with FPU and DSP functionality. This article will go into more detail about STM32H743VIT6, including pinout, CAD model, block diagram, features, and so on.

This video demonstrates the details of STM32H743VIT6.

Electronics: Can't flash big binaries using dfu-util/pydfu to STM32H743VIT6 (2 Solutions!!)

STM32H743VIT6 Description

STM32H743VIT6 is based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 480 MHz. The Cortex® -M7 core features a floating-point unit (FPU) which supports Arm® double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data types. STM32H743VIT6 supports a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.

STM32H743VIT6 incorporates high-speed embedded memories with a dual-bank Flash memory of up to 2 Mbytes, up to 1 Mbyte of RAM (including 192 Kbytes of TCM RAM, up to 864 Kbytes of user SRAM, and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix, and a multi-layer AXI interconnects supporting internal and external memory access.

STM32H743VIT6 offers three ADCs, two DACs, two ultra-low-power comparators, a low-power RTC, a high-resolution timer, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support four digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces. 


STM32H743VIT6 Pinout

STM32H743VIT6 Pinout.jpg


STM32H743VIT6 Pinout


STM32H743VIT6 CAD Model

STM32H743VIT6Symbol.png


STM32H743VIT6 Symbol


STM32H743VIT6 Footprint.png


STM32H743VIT6 Footprint


STM32H743VIT6 3D Model.png


STM32H743VIT6 3D Model


STM32H743VIT6 Block Diagram

STM32H743VIT6Block Diagram.png


STM32H743VIT6 Block Diagram


STM32H743VIT6 Power Supply Scheme

STM32H743VIT6 Power supply scheme.png


STM32H743VIT6 Power Supply Scheme


Specifications

STMicroelectronics STM32H743VIT6 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics STM32H743VIT6.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 7 months ago)
  • Factory Lead Time
    12 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    100-LQFP
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Data Converters
    A/D 20x16b; D/A 2x12b
  • Number of I/Os
    82
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    STM32H7
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    100
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    480MHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    STM32H743
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    Ethernet, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    2MB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    1M x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    1.71V~3.6V
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROCONTROLLER, RISC
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    ARM® Cortex®-M7
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    32-Bit
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    2MB 2M x 8
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    32
  • Has ADC

    Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.

    YES
  • DMA Channels

    DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.

    YES
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    32b
  • Number of Timers/Counters
    20
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    8
  • Number of A/D Converters
    3
  • Number of UART Channels
    9
  • Number of ADC Channels
    36
  • Max Junction Temperature (Tj)

    Max Junction Temperature (Tj) refers to the maximum allowable temperature at the junction of a semiconductor device, such as a transistor or integrated circuit. It is a critical parameter that influences the performance, reliability, and lifespan of the component. Exceeding this temperature can lead to thermal runaway, breakdown, or permanent damage to the device. Proper thermal management is essential to ensure the junction temperature remains within safe operating limits during device operation.

    125°C
  • Number of PWM Channels
    42
  • Number of I2C Channels
    4
  • Ambient Temperature Range High

    This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.

    85°C
  • Number of SPI Channels
    6
  • Number of USB Channels
    2
  • Number of Ethernet Channels
    1
  • Height
    1.6mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
0 Similar Products Remaining

STM32H743VIT6 Features

Core

32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data

and 16 Kbytes of instruction cache; frequency

up to 480 MHz, MPU, 1027 DMIPS/

2.14 DMIPS/MHz (Dhrystone 2.1), and DSP

instructions

Memories

• Up to 2 Mbytes of Flash memory with reading while-write support

• Up to 1 Mbyte of RAM: 192 Kbytes of TCM

RAM (inc. 64 Kbytes of ITCM RAM +

128 Kbytes of DTCM RAM for time-critical

routines), Up to 864 Kbytes of user SRAM, and

4 Kbytes of SRAM in the Backup domain

• Dual mode Quad-SPI memory interface

running up to 133 MHz

• Flexible external memory controller with up to

32-bit data bus: SRAM, PSRAM,

SDRAM/LPSDR SDRAM, NOR/NAND Flash

memory clocked up to 100 MHz in

Synchronous mode

• CRC calculation unit

Security

• ROP, PC-ROP, active tamper

General-purpose input/outputs

• Up to 168 I/O ports with interrupt capability

Reset and power management

• 3 separate power domains which can be

independently clock-gated or switched off:

– D1: high-performance capabilities

– D2: communication peripherals and timers

– D3: reset/clock control/power management


STM32H743VIT6 Package Dimension

STM32H743VIT6 Package.png


STM32H743VIT6 Package Dimension


STM32H743VIT6 Manufacturer

STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio, and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology, and its products play a key role in enabling today's convergence trends.


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Datasheet PDF

Download datasheets and manufacturer documentation for STMicroelectronics STM32H743VIT6.
Frequently Asked Questions

What is the STM32H743VIT6s high performance?

Arm® Cortex®-M3 32-bit RISC core.

What is the power supply of the STM32H743VIT6?

2.0 to 3.6 V

What type of applications can the STM32H743VIT6 design?

 Low-power applications.
STM32H743VIT6

STMicroelectronics

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