TPS1H000AQDGNRQ1 High-Side Switch: Circuit, Pinout, and Datasheet

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Published: 31 March 2022 | Last Updated: 31 March 2022

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TPS1H000AQDGNRQ1

TPS1H000AQDGNRQ1

Texas Instruments

N-Channel 0.65mm PMIC Automotive, AEC-Q100 Series TPS1H000 8 Pin 13.5V 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad

Purchase Guide

N-Channel 0.65mm PMIC Automotive, AEC-Q100 Series TPS1H000 8 Pin 13.5V 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad

The TPS1H000AQDGNRQ1 is a smart high-side switch that has an internal charge pump and a single-channel NMOS power FET. This article mainly introduces Circuit, Pinout, Datasheet and other detailed information about Texas Instruments TPS1H000AQDGNRQ1.

This video will show you the Transistor as a switch - low side or high side.

Transistor as a switch - low side or high side

TPS1H000AQDGNRQ1 Description

The TPS1H000AQDGNRQ1 is a smart high-side switch that has an internal charge pump and a single-channel NMOS power FET. The configurable current-limit mechanism considerably improves the system's overall reliability. The load may be intelligently controlled thanks to full diagnostic features.

Setting the current-limit value for the application is possible with the external high-accuracy current limit. When there is an overcurrent, the device increases system reliability by effectively clamping the inrush current. By decreasing the size of PCB traces and connectors, as well as the capacity of the previous power stage, the TPS1H000AQDGNRQ1 device can cut system costs. When a current limit is reached, the TPS1H000AQDGNRQ1 device has three modes. Users can adjust the output to one of three modes by configuring the DELAY pin: hold the current consistently, latch off instantly, or retry automatically. The design flexibility provided by the customizable behaviors during current limit addresses functionality, cost, and thermal dissipation.

With the digital status output, the TPS1H000AQDGNRQ1 device offers full diagnostics. Real-time on-state monitoring is possible thanks to high-accuracy and low-threshold open-load detection. The TPS1H000AQDGNRQ1 device also offers a standalone mode, which allows the system to implement complete functionality locally without the use of an MCU.

The TPS1H000AQDGNRQ1 is a smart high-side switch that can be used to control a wide range of resistive, inductive, and capacitive loads, such as LEDs, relays, and sub-modules.


TPS1H000AQDGNRQ1 Pinout

The following is TPS1H000AQDGNRQ1 Pinout.

pinout.png

Pinout

Pin NumberPin NameDescription
4CLAdjustable current limit. Connect to device GND if external current limit is not used
5DELAYFunction configuration when in current limit; internal pullup
2DIAG_ENEnable the diagnostic function
3FAULTOpen-drain diagnostic status output. Leave floating if not used
6GNDGround pin
1INInput control for output activation; internal pulldown
7OUTOutput, source of the high-side switch, connected to the load
8VSPower supply, drain for the high-side switch

Thermal padThermal pad. Connect to device GND or leave floating.


TPS1H000AQDGNRQ1 CAD Model

The following shows TPS1H000AQDGNRQ1 CAD Model.

symbol.png

Symbol

footprint.png

Footprint

3d model.jpg

3D Model


TPS1H000AQDGNRQ1 Features

• Qualified for Automotive Applications

• AEC-Q100 Qualified With the Following Results:

– Device Temperature Grade 1: –40°C to 125°C

 Ambient Operating Temperature Range

– Device HBM ESD Classification Level H2

– Device CDM ESD Classification Level C4B

• Single-Channel 1000-mΩ Smart High-Side Switch

• Wide Operating Voltage: 3.4 V to 40 V • Low Standby Current: <500 nA

• Adjustable Current Limit With External Resistor

– ±15% When ≥150 mA

– ±10% When ≥300 mA

• Configurable Behavior After Current Limit

– Holding Mode

– Latch-Off Mode With Adjustable Delay Time

– Auto-Retry Mode

• Supports Standalone Operation Without an MCU

• Protection:

– Short-to-GND and Overload

– Thermal Shutdown and Thermal Swing 

– Negative Voltage Clamp for Inductive Loads

– Loss-of-GND and Loss-of-Battery

• Diagnostics:

– Overload and Short-to-GND Detection

– Open-Load and Short-to-Battery Detection in ON or OFF State

– Thermal Shutdown and Thermal Swing


Specifications

Texas Instruments TPS1H000AQDGNRQ1 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments TPS1H000AQDGNRQ1.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 3 days ago)
  • Factory Lead Time
    6 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    8
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~125°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Automotive, AEC-Q100
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    2 (1 Year)
  • Number of Terminations
    8
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    13.5V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    TPS1H000
  • Number of Outputs
    1
  • Output Type

    The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.

    N-Channel
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    4V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    On/Off
  • Output Configuration

    Output Configuration in electronic components refers to the arrangement or setup of the output pins or terminals of a device. It defines how the output signals are structured and how they interact with external circuits or devices. The output configuration can determine the functionality and compatibility of the component in a circuit design. Common types of output configurations include single-ended, differential, open-drain, and push-pull configurations, each serving different purposes and applications in electronic systems. Understanding the output configuration of a component is crucial for proper integration and operation within a circuit.

    High Side
  • Output Current

    The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.

    1A
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    Not Required
  • Input Type

    Input type in electronic components refers to the classification of the signal or data that a component can accept for processing or conversion. It indicates whether the input is analog, digital, or a specific format such as TTL or CMOS. Understanding input type is crucial for ensuring compatibility between different electronic devices and circuits, as it determines how signals are interpreted and interacted with.

    Non-Inverting
  • Switch Type

    Based on their characteristics, there are basically three types of switches: Linear switches, tactile switches and clicky switches.

    Relay, Solenoid Driver
  • Nominal Input Voltage

    The actual voltage at which a circuit operates can vary from the nominal voltage within a range that permits satisfactory operation of equipment. The word “nominal” means “named”.

    40V
  • Ratio - Input:Output

    The parameter "Ratio - Input:Output" in electronic components refers to the relationship between the input and output quantities of a device or system. It is a measure of how the input signal or energy is transformed or converted into the output signal or energy. This ratio is often expressed as a numerical value or percentage, indicating the efficiency or effectiveness of the component in converting the input to the desired output. A higher ratio typically signifies better performance or higher efficiency, while a lower ratio may indicate losses or inefficiencies in the conversion process. Understanding and optimizing the input-output ratio is crucial in designing and evaluating electronic components for various applications.

    1:1
  • Voltage - Load

    Voltage - Load refers to the voltage across a load component in an electronic circuit when it is connected and operational. It represents the electrical potential difference that drives current through the load, which can be a resistor, motor, or other devices that consume electrical power. The voltage - load relationship is crucial for determining how much power the load will utilize and how it will affect the overall circuit performance. Properly managing voltage - load is essential for ensuring devices operate efficiently and safely within their specified limits.

    4V~40V
  • Fault Protection

    Protection against electric shock under. single fault conditions.

    Current Limiting (Fixed), Over Temperature
  • Turn On Time

    The time that it takes a gate circuit to allow a current to reach its full value.

    90 µs
  • Output Peak Current Limit-Nom

    Output Peak Current Limit-Nom is a parameter in electronic components that specifies the maximum current that can be delivered by the output under normal operating conditions. This limit is typically set to protect the component from damage due to excessive current flow. It ensures that the component operates within its safe operating limits and prevents overheating or other potential issues. Designers and engineers use this parameter to ensure proper functioning and reliability of the electronic system in which the component is used.

    1A
  • Rds On (Typ)

    The parameter "Rds On (Typ)" in electronic components refers to the typical on-state resistance of a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) when it is fully conducting. This parameter indicates the resistance encountered by the current flowing through the MOSFET when it is in the on-state, which affects the power dissipation and efficiency of the component. A lower Rds On value indicates better conduction and lower power loss in the MOSFET. Designers often consider this parameter when selecting components for applications where minimizing power loss and maximizing efficiency are critical factors.

    1 Ω
  • Max Junction Temperature (Tj)

    Max Junction Temperature (Tj) refers to the maximum allowable temperature at the junction of a semiconductor device, such as a transistor or integrated circuit. It is a critical parameter that influences the performance, reliability, and lifespan of the component. Exceeding this temperature can lead to thermal runaway, breakdown, or permanent damage to the device. Proper thermal management is essential to ensure the junction temperature remains within safe operating limits during device operation.

    150°C
  • Turn Off Time

    Turn Off Time is a parameter in electronic components, particularly in devices like transistors and diodes. It refers to the time taken for the component to switch from an ON state to an OFF state when a control signal is applied. This parameter is crucial in determining the speed and efficiency of the component's operation. A shorter turn off time indicates faster switching speeds, which is important in applications where rapid switching is required, such as in power electronics and digital circuits. Manufacturers provide this specification in datasheets to help engineers and designers select the right components for their specific requirements.

    90 µs
  • Built-in Protections

    Built-in protections in electronic components refer to the safety features and mechanisms that are integrated into the component to prevent damage or malfunction in various situations. These protections are designed to safeguard the component from overvoltage, overcurrent, overheating, short circuits, and other potential hazards that could occur during operation. By having built-in protections, electronic components can operate more reliably and safely, extending their lifespan and reducing the risk of failure. These protections are essential for ensuring the overall performance and longevity of electronic devices and systems.

    TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    Slew Rate Controlled
  • Height
    1.1mm
  • Length
    3mm
  • Width
    3mm
  • Thickness

    Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

    1.02mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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TPS1H000AQDGNRQ1 Functional Block Diagram

The following figure is TPS1H000AQDGNRQ1 Functional Block Diagram.

Functional Block Diagram.png

Functional Block Diagram


TPS1H000AQDGNRQ1 Typical Block Diagram

The following figure shows TPS1H000AQDGNRQ1 Typical Block Diagram.

Typical Block Diagram.png

Typical Block Diagram


TPS1H000AQDGNRQ1 Layout

TJ must be less than 175°C to avoid thermal shutdown. The power dissipation may be significant if the output current is quite high. The  PCB  layout, on the other hand, is critical. A good PCB design can improve heat transfer, which is critical for the device's long-term durability.

• Increase the heat conductivity of the board by increasing the copper covering on the PCB. The copper on the PCB is the primary heatflow channel from the package to the ambient. When there are no heat sinks attached to the PCB on the opposite side of the board from the package, maximum copper is critical.

• To improve the board's thermal conductivity, place as many thermal vias as feasible right beneath the package thermal pad.

• To avoid solder voids, all thermal vias should be plated shut or plugged and sealed on both sides of the board. Solder coverage should be at least 85% to assure reliability and performance.

layout.png

Layout


TPS1H000AQDGNRQ1 Typical Application

The following figure shows an example of how to design the external circuitry parameters.

Typical Application Circuitry.png

Typical Application Circuitry

• The VVS ranges from 6 to 18 volts.

• 100 mA nominal current.

• A current limit of 500 mA is expected.

• When a thermally sensitive system reaches its current limit, the output latches off after 0.2 seconds. The 0.2 s is used to provide a safe start-up for a capacitive load by clamping the inrush current but not latching it off.

• On-state open-load detection, short-to-GND or overcurrent detection, and thermal shutdown detection are all available with the 5-V MCU.


TPS1H000AQDGNRQ1 Applications

• Single-Channel LED Driver

• Single-Channel High-Side Relay Driver

• Body Lighting

• Advanced Driver Assistance Systems (ADAS) Sensors

• General Resistive, Inductive and Capacitive Loads


TPS1H000AQDGNRQ1 Package

The following figure is TPS1H000AQDGNRQ1 Package.

package.png

Package


TPS1H000AQDGNRQ1 Manufacturer

Texas Instruments (TI), a multinational semiconductor business with operations in 35 countries, is first and foremost a reflection of its employees. We are problem-solvers cooperating to transform the world via technology, from the TIer who introduced the first functional integrated circuit in 1958 to the more than 30,000 TIers throughout the world today who develop, build, and distribute analog and embedded processor chips.


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Datasheet PDF

Download datasheets and manufacturer documentation for Texas Instruments TPS1H000AQDGNRQ1.
Frequently Asked Questions

What does the TPS1H000AQDGNRQ1 have?

NMOS power FET.

What greatly improves the systems overall reliability?

The configurable current-limit mechanism.

What can the load be controlled by the TPS1H000AQDGNRQ1?

Full diagnostic features.

How does the TPS1H000AQDGNRQ1 improve system reliability?

The inrush current.

How many modes does the TPS1H000AQDGNRQ1 have when a current limit is reached?

Three.

What does the TPS1H000AQDGNRQ1 device use to adjust the output to one of three modes?

DELAY pin.

What is the design flexibility of the TPS1H000AQDGNRQ1 device?

Customizable behaviors.

What does the TPS1H000AQDGNRQ1 offer with the digital status output?

Full diagnostics.

What is possible thanks to high-accuracy and low-threshold open-load detection?

Real-time on-state monitoring.

What does the TPS1H000AQDGNRQ1 device offer?

Standalone mode.
TPS1H000AQDGNRQ1

Texas Instruments

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