Kioxia America THGBMJG6C1LBAU7 Memory Overview

UTMEL

Published: 28 August 2025 | Last Updated: 28 August 2025

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THGBMJG6C1LBAU7

THGBMJG6C1LBAU7

Kioxia America, Inc.

e•MMC™ Memory IC e•MMC™ Series

Purchase Guide

e•MMC™ Memory IC e•MMC™ Series

Kioxia America THGBMJG6C1LBAU7 offers 8GB eMMC 5.1 flash memory, 400MB/s read speed, wide temperature range, and robust reliability for embedded systems.

Product Introduction

The Kioxia THGBMJG6C1LBAU7 is an 8GB eMMC 5.1 flash memory device from Kioxia America. Engineers and product managers rely on this high-performance emmc flash memory for demanding embedded applications. Understanding its technical specifications, performance, and integration steps ensures successful product development. Kioxia designs this memory to meet the reliability needs of both industrial and consumer devices in 2025.

The global eMMC 5.1 market in 2025 shows strong growth:

  • Estimated at $500 million, with a projected CAGR between 8% and 15%.

  • Automotive and industrial automation drive demand for robust storage.

  • Asia-Pacific leads due to its electronics manufacturing strength.

Specifications

Overview

The Kioxia THGBMJG6C1LBAU7 stands out as a robust e-mmc solution for embedded systems. This device delivers high-capacity storage and reliable flash memory for both industrial and consumer applications. Its compact form factor allows engineers to integrate it into space-constrained designs. The emmc device supports a wide range of operating temperatures, making it suitable for harsh environments. With advanced nand technology, the memory offers consistent performance and endurance. Product managers value its high-speed data storage and efficient power consumption, which help extend device battery life.

Technical Data

The following table summarizes the key specifications of the Kioxia THGBMJG6C1LBAU7 e-mmc flash memory:

Specification CategoryDetails
Product CategoryeMMC Flash
SeriesTHGBM
Memory Size (Capacity)8 GB
Interface TypeeMMC 5.1
Supply Voltage Range2.7 V to 3.6 V
Operating Temperature Range-40°C to +105°C
Package / CaseFBGA-153
Dimensions11.5 mm x 13 mm x 1 mm
Mounting StyleSMD/SMT
Moisture SensitiveYes
Unit Weight0.146432 oz
NAND Technology15nm MLC NAND
Sequential Read Speed400 MB/s
Environmental ComplianceRoHS Compliant

This emmc device uses advanced 15nm nand flash, which enables a compact form factor and high read/write performance. The wide voltage and temperature ranges support reliable operation in both consumer electronics and industrial equipment. The device also includes integrated memory management features such as error correction code (ECC), wear leveling, and bad block management, which enhance data integrity and extend the lifespan of the storage.

Performance

The Kioxia THGBMJG6C1LBAU7 delivers fast read/write speeds, supporting high-speed read and write operations up to 400 MB/s. This level of performance meets the demands of modern embedded systems that require quick access to large amounts of data. The emmc 5.1 interface ensures compatibility with a broad range of host controllers and devices. The 15nm nand process technology not only boosts speed but also improves reliability, especially in challenging industrial environments.

Engineers can rely on this flash memory for applications that demand consistent performance and high-capacity storage. The device’s robust error correction and wear-leveling algorithms protect data against corruption and extend the usable life of the storage. Its compact form factor and low power consumption make it ideal for portable devices, while the wide temperature range ensures stable operation in automotive and industrial settings.

Note: The Kioxia THGBMJG6C1LBAU7’s combination of high capacity, advanced nand technology, and strong data management features makes it a leading choice for high-speed data storage in 2025.

Features

Memory Management

The Kioxia THGBMJG6C1LBAU7 offers advanced memory management features that set it apart in the e-mmc market. This e-mmc managed flash device uses a controller to handle complex tasks like bad block management and garbage collection. These features help maintain consistent performance and extend the life of the storage. The managed architecture allows engineers to focus on system design without worrying about low-level flash operations. The device supports fast read/write speeds, which ensures quick access to data and smooth operation in demanding applications. With e-mmc technology, users benefit from reliable storage and efficient data handling.

Reliability

Reliability remains a top priority for embedded storage solutions. The Kioxia THGBMJG6C1LBAU7 incorporates advanced error correction and wear-leveling technologies designed to improve data integrity and prolong the lifespan of the chip. These features collectively ensure the reliability of the device, particularly in embedded applications such as smartphones, tablets, and SSDs. The emmc device uses robust nand flash to protect data from corruption and maintain high performance over time. Engineers trust this e-mmc for its ability to deliver stable storage in both consumer and industrial environments. The combination of managed flash and strong error correction supports consistent speed and dependable operation.

Power Efficiency

Power efficiency plays a crucial role in modern embedded systems. The Kioxia THGBMJG6C1LBAU7 delivers low power consumption, which helps extend battery life in portable devices. The emmc architecture optimizes power use during both active and idle states. This feature makes the device suitable for applications that require long operating times without frequent charging. The managed flash design reduces unnecessary power draw, supporting energy-efficient performance. With low power consumption and high speed, the device meets the needs of next-generation products that demand both performance and efficiency.

Tip: Devices with low power consumption and advanced flash management can operate longer and more reliably in the field.

Applications      

Consumer Devices

The Kioxia THGBMJG6C1LBAU7 supports a wide range of consumer devices. Its high-capacity storage and reliable performance make it a popular choice for many products. Manufacturers use this memory in devices that require fast access to data and efficient storage management. Common consumer devices that benefit from this eMMC memory include:

  • Mobile devices such as smartphones and tablets

  • Automotive entertainment systems, including in-car infotainment

  • Consumer electronics and embedded systems

  • Medical devices

  • Networking equipment

These devices need dependable storage to handle multimedia files, applications, and user data. The 8GB capacity ensures enough space for daily use, while the advanced memory management features protect data integrity. The compact design allows easy integration into slim and lightweight products.

Industrial Use

Industrial environments demand robust storage solutions. The Kioxia THGBMJG6C1LBAU7 meets these needs with its reliable NAND Flash technology and stable operation across a wide temperature range. The following table highlights how this memory addresses key industrial requirements:

Key Memory Requirements in Industrial ApplicationsHow Kioxia THGBMJG6C1LBAU7 Meets These Needs
High reliabilityUses NAND Flash technology for reliable performance
Stable operation over wide temperature rangeOperates from -25°C to 85°C ensuring stable performance
Sufficient storage capacityProvides 64GB capacity
High-speed data transferSequential read speed up to 400 MB/s
Compact packaging for efficient integrationCompact BGA (FBGA-153) package supports space-saving design
Compatibility with various deviceseMMC interface ensures broad device compatibility
Voltage operation rangeOperates within 2.7V to 3.6V voltage range

Industrial systems often run in harsh conditions. The device’s wide temperature range and robust storage features ensure reliable operation. High-speed data transfer supports real-time processing and logging, which are critical in industrial automation and control systems.

IoT and Embedded

IoT and embedded applications require memory that balances performance, security, and efficiency. The Kioxia THGBMJG6C1LBAU7 offers several advantages for these systems. Its compact size and high-capacity storage make it ideal for space-constrained designs. The following table summarizes the main features and benefits for IoT and embedded applications:

FeatureDescription
Operating Temperature RangeAvailable in Commercial (-25℃ to 85℃) and Industrial (-40℃ to 105℃) temperature grades.
Package SizeCompact 11.5 x 13mm 153-ball BGA package, saving space in embedded applications.
JEDEC Standard ComplianceMeets JEDEC 5.0/5.1 standards for compatibility and interoperability.
Security - RPMBReplay Protected Memory Block for authentication and protection against unauthorized data access.
Sudden Power Loss ProtectionAutomatic data integrity protection during unexpected power loss without external components.
Ecosystem SupportComprehensive ecosystem including open-source software, chipsets, and drivers for easy integration.

IoT devices often operate in remote or challenging environments. The device’s reliability features, such as sudden power loss protection and secure data storage, help maintain system stability. Its low power consumption supports long battery life, which is essential for embedded applications that require continuous operation.

Note: The Kioxia THGBMJG6C1LBAU7 provides a strong foundation for next-generation consumer, industrial, and IoT devices by delivering reliable, high-capacity storage and advanced data protection.

Integration

System Requirements

Engineers must check system requirements before adding the Kioxia THGBMJG6C1LBAU7 to a design. The device needs a host controller that supports eMMC 5.1. The power supply should provide a stable voltage between 2.7V and 3.6V. The system must operate within the device’s temperature range, from -40°C to 105°C. Designers should confirm that the board layout supports the 153-ball FBGA package. The memory also requires proper signal routing for high-speed data transfer. Meeting these requirements helps maintain system performance and reliability.

Tip: Always review the datasheet for the latest electrical and mechanical requirements.

Design Tips

Designers can follow several tips to ensure smooth integration. Place the eMMC device close to the host controller to reduce signal delay. Use short and direct traces for data lines. Add decoupling capacitors near the power pins to filter noise. Follow the recommended PCB footprint for the FBGA-153 package. Test the memory in the target environment to check for stability. These steps help prevent common issues and improve product quality.

  • Keep traces short and matched in length.

  • Use ground planes to reduce interference.

  • Check for proper soldering during assembly.

Compatibility

The Kioxia THGBMJG6C1LBAU7 works with many processors and chipsets that support eMMC 5.1. It follows JEDEC standards, which ensures broad compatibility. Most operating systems with eMMC drivers can use this memory. The device supports both commercial and industrial temperature grades, making it suitable for many applications. Engineers should verify software support for advanced features like secure erase and RPMB. Testing with the final system helps confirm full compatibility.

Note: Compatibility checks early in the design process save time and reduce costly changes later.

Kioxia America Comparison

Similar Models

Kioxia America offers several eMMC memory models for embedded applications. The THGBMJG6C1LBAU7 stands out for its high capacity and fast read speeds. The following table compares this model with other options from Kioxia and Toshiba Memory Corporation:

Feature / ModelTHGBMJG6C1LBAU7 (Kioxia America)THGBMJG6C1LBAIL (Kioxia America)THGBMJG6C1LBAU8 (Toshiba Memory Corporation)
Storage CapacityUp to 64GBDifferent capacity (unspecified)Enhanced features and performance
Read SpeedUp to 400 MB/sLower than THGBMJG6C1LBAU7Higher than THGBMJG6C1LBAU7
eMMC StandardeMMC 5.1eMMC complianteMMC compliant
Power ConsumptionLowNot specifiedNot specified
Operating Temperature-40°C to 105°CNot specifiedNot specified
Form FactorCompact BGABGA packageBGA package
Application SuitabilityMobile, automotive, industrialEmbedded applicationsDemanding embedded applications
AdvantagesHigh speed, large capacityBalanced specsEnhanced performance
DisadvantagesHigher cost, complex integrationNot specifiedNot specified

Kioxia America designed the THGBMJG6C1LBAU7 for users who need high speed and large storage. The THGBMJG6C1LBAIL offers a balance between speed and capacity. The THGBMJG6C1LBAU8 from Toshiba Memory Corporation provides even greater performance for advanced needs.

Alternatives

Engineers and product managers often compare Kioxia America eMMC solutions with other brands. The THGBMJG6C1LBAU7 provides several advantages for industrial, consumer, and IoT applications. The table below outlines the main pros and cons:

AspectDetails / ProsCons / Limitations
Capacity64GB eMMC NAND Flash memory suitable for ample storage needsN/A
InterfaceIndustry-standard eMMC interface ensures broad compatibilityN/A
PackageCompact BGA-153 package ideal for space-constrained embedded systemsN/A
Voltage RangeOperates between 2.7V to 3.6VN/A
Temperature Range-25°C to 85°C, suitable for many industrial and consumer environmentsLimited for harsh industrial or automotive environments requiring wider range
PerformanceSequential read speed up to 400 MB/s; write speed around 50 MB/sN/A
Industrial UseReliable performance in demanding environmentsTemperature range may limit use in extreme conditions
Consumer & IoT UseProvides ample storage and fast data access for mobile, consumer electronics, and IoT devicesN/A
Security & Data IntegrityPotential benefits from RPMB security and power loss protection in related modelsUncertainty about security features in this specific model
Ecosystem SupportSupported by a well-established ecosystem facilitating easy integrationN/A

Kioxia America delivers strong performance and reliability with the THGBMJG6C1LBAU7. Users benefit from high-speed data access and broad compatibility. Some applications may require enhanced security or a wider temperature range. In those cases, engineers may consider other Kioxia models or competing brands. Product managers should match the memory solution to the specific needs of their project.

Tip: Always review the application requirements before selecting a memory device. Kioxia America provides a range of options to fit different environments and performance needs.


The Kioxia THGBMJG6C1LBAU7 delivers strong reliability and performance for a wide range of applications. Users benefit from high-speed data transfer, advanced error correction, and protection features that support both industrial and consumer needs.

  • Key advantages include:

    • Fast eMMC 5.1 interface

    • Wide temperature support for harsh environments

    • Security and power loss protection

    • Easy integration with open-source support

For further details, engineers should:

  • Review the official datasheet for technical information

  • Contact Mouser Electronics for support or integration guidance

FAQ

What devices can use the Kioxia THGBMJG6C1LBAU7 eMMC memory?

The Kioxia THGBMJG6C1LBAU7 works in smartphones, tablets, industrial controllers, and IoT devices. It supports any system with an eMMC 5.1 interface and a compatible host controller.

How does this memory handle data errors?

The device uses advanced error correction code (ECC) and wear-leveling algorithms. These features protect data from corruption and extend the memory’s lifespan.

Is the Kioxia THGBMJG6C1LBAU7 suitable for harsh environments?

Yes. The memory operates from -40°C to 105°C. This wide temperature range makes it reliable for both industrial and automotive applications.

What support resources are available for integration?

Engineers can access datasheets, reference designs, and open-source drivers from Kioxia America. Technical support teams also help with integration and troubleshooting.

Can users upgrade to higher capacity models easily?

Users can select higher capacity eMMC models from Kioxia with similar interfaces and packages. Always check compatibility with the system’s hardware and software before upgrading.

Specifications

Kioxia America, Inc. THGBMJG6C1LBAU7 technical specifications, attributes, parameters and parts with similar specifications to Kioxia America, Inc. THGBMJG6C1LBAU7.
  • Type
    Parameter
  • Factory Lead Time
    12 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    153-WFBGA
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~105°C TA
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    e•MMC™
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    64Gb 8G x 8
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    FLASH
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    eMMC
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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THGBMJG6C1LBAU7

Kioxia America, Inc.

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