TPS82130SILT Step-Down Converter: 17V, 3A, Pinout
DC DC CONVERTER 0.9-5V
The TPS82130SILT is a MicroSiP power module with a 17-V input and a 3-A step-down converter. The article is going to introduce the features, applications and other details of the device.

TPS82130SILR Supplier and TI TPS82130SILT Distributor in China - Rantle East Electronic
TPS82130SILT Description
The TPS82130SILT is a MicroSiP power module with a 17-V input and a 3-A step-down converter that is optimized for small solution size and high efficiency. To simplify design, remove external components, and save PCB space, the module incorporates a synchronous step-down converter and an inductor. The low-profile and compact design allows for automated installation using typical surface mount equipment.
TPS82130SILT Pinout

TPS82130SILT CAD Model
Symbol

Footprint

3D Model

TPS82130SILT Features
• 3-mm × 2.8-mm × 1.5-mm MicroSiP™ package
• 3-V to 17-V input range
• 3-A continuous output current
• DCS-Control™ topology
• Power save mode for light-load efficiency
• 20-µA operating quiescent current
• 0.9-V to 6-V adjustable output voltage
• 100% duty cycle for lowest dropout
• Power-good output
• Programmable soft start-up with tracking
• Thermal shutdown protection
• –40°C to 125°C operating temperature range
• Create a custom design using the TPS82130 with the WEBENCH® Power Design
TPS82130SILT Functional Block Diagram

Specifications
- TypeParameter
- Factory Lead Time16 Weeks
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 1 day ago) - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
8-SMD Module - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Number of Pins8
- Voltage - Input (Nom)12V
- SwitchingFrequency2MHz
- Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
MicroSip™ - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~125°C - Size / Dimension
In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.
0.12Lx0.11W x 0.06 H 3.0mmx2.8mmx1.5mm - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e1 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
2 (1 Year) - Number of Terminations8
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - TypeNon-Isolated PoL Module
- Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Tin/Silver/Copper (Sn/Ag/Cu) - Applications
The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.
ITE (Commercial) - Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
ALSO OPERATES IN ADJUSTABLE MODE FROM 0.9 TO 5V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
NO LEAD - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Number of Functions1
- Terminal Pitch
The center distance from one pole to the next.
0.65mm - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
NOT SPECIFIED - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
TPS82130 - Number of Outputs1
- Max Supply Voltage
In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.
17V - Min Supply Voltage
The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.
3V - Current - Output (Max)
Current - Output (Max) is a parameter in electronic components that specifies the maximum amount of current that the component can deliver at its output. This parameter is crucial in determining the capability of the component to supply power to other parts of a circuit or system. It is typically measured in amperes (A) and helps in ensuring that the component can handle the required current without getting damaged or causing malfunctions. Designers and engineers use this specification to select components that can meet the current requirements of their circuits and prevent overloading or overheating issues.
3A - Current - Output
Current - Output is a parameter in electronic components that refers to the maximum amount of current that can be delivered by the output of the component. It is a crucial specification as it determines the capability of the component to supply power to connected devices or circuits. The current output rating is typically specified in amperes (A) and is important for ensuring that the component can safely and effectively power the load it is connected to without overheating or failing. Designers and engineers must consider the current output rating when selecting components to ensure compatibility and reliable operation of the overall system.
3A - Quiescent Current
The quiescent current is defined as the current level in the amplifier when it is producing an output of zero.
20μA - Max Output Voltage
The maximum output voltage refers to the dynamic area beyond which the output is saturated in the positive or negative direction, and is limited according to the load resistance value.
5V - Voltage - Output
Voltage - Output is a parameter that refers to the electrical potential difference between the output terminal or pin of an electronic component and a reference point, typically ground. It indicates the level of voltage that the component is capable of providing at its output under specified operating conditions. This parameter is crucial in determining the performance and functionality of the component in a circuit, as it directly affects the signal or power being delivered to other components or devices connected to the output. Engineers and designers use the voltage output specification to ensure compatibility and proper functioning of the component within the overall system.
5V - Control Mode
In electronic components, "Control Mode" refers to the method or mode of operation used to regulate or control the behavior of the component. This parameter determines how the component responds to input signals or commands to achieve the desired output. The control mode can vary depending on the specific component and its intended function, such as voltage regulation, current limiting, or frequency modulation. Understanding the control mode of an electronic component is crucial for proper integration and operation within a circuit or system.
VOLTAGE-MODE - Control Technique
In electronic components, "Control Technique" refers to the method or approach used to regulate and manage the operation of the component. This parameter is crucial in determining how the component functions within a circuit or system. Different control techniques can include analog control, digital control, pulse-width modulation (PWM), and various feedback mechanisms. The choice of control technique can impact the performance, efficiency, and overall functionality of the electronic component. It is important to select the appropriate control technique based on the specific requirements and characteristics of the application in which the component will be used.
PULSE WIDTH MODULATION - Min Output Voltage
Min Output Voltage refers to the lowest voltage level that an electronic component, such as a voltage regulator or power supply, can provide reliably under specified conditions. It indicates the minimum threshold required for proper operation of connected devices. Operating below this voltage may lead to device malfunction or failure to operate as intended.
900mV - Switcher Configuration
Switcher Configuration in electronic components refers to the arrangement or setup of a switcher circuit, which is a type of power supply that converts one form of electrical energy into another. The configuration of a switcher circuit includes the specific components used, such as transistors, diodes, capacitors, and inductors, as well as their interconnections and control mechanisms. The switcher configuration determines the efficiency, voltage regulation, and other performance characteristics of the power supply. Different switcher configurations, such as buck, boost, buck-boost, and flyback, are used for various applications depending on the desired output voltage and current requirements. Understanding and selecting the appropriate switcher configuration is crucial in designing reliable and efficient power supply systems for electronic devices.
BUCK - Max Duty Cycle
Max Duty Cycle refers to the maximum percentage of time that an electronic component, such as a switch or a power supply, can be in an "on" state during a defined time period. It is an important parameter in pulse-width modulated (PWM) systems and helps determine how often a device can operate without overheating or sustaining damage. By specifying the maximum duty cycle, manufacturers provide guidance on the safe operational limits of the component, ensuring reliability and efficiency in various applications.
100 % - Features
In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.
OTP - Height1.53mm
- RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
No SVHC - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
TPS82130SILT Applications
• Industrial applications
• Telecom and networking applications
• Solid state drives
TPS82130SILT Typical Application Circuit

TPS82130SILT Typical Application Circuit
TPS82130SILT Manufacturer
Texas Instruments Incorporated (TI) is an American technology company based in Dallas, Texas, that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globally. It is one of the top 10 semiconductor companies worldwide based on sales volume. The company's focus is on developing analog chips and embedded processors, which account for more than 80% of its revenue. TI also produces TI digital light processing technology and education technology products including calculators, micro-controllers, and multi-core processors. The company boasts 45,000 patents around the globe as of 2016.
Trend Analysis
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TPS82130SILT
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Datasheet PDF
- PCN Assembly/Origin :
- Datasheets :
What is TPS82130SILT?
The TPS82130SILT is a MicroSiP power module with a 17-V input and a 3-A step-down converter that is optimized for small solution size and high efficiency. To simplify design, remove external components, and save PCB space, the module incorporates a synchronous step-down converter and an inductor. The low-profile and compact design allows for automated installation using typical surface mount equipment.
What is the recommended operating temperature of the component?
-40°C~125°C.
What is the package of the device?
8-SMD Module.
What is the component’s number of pins?
8.
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