KSZ8081RNA Transceiver: Pinout, Equivalent and Datasheet

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Published: 10 February 2022 | Last Updated: 10 February 2022

2339

KSZ8081RNACA-TR

KSZ8081RNACA-TR

Microchip Technology

24 Terminations 3.3V 24 Pin KSZ8081 Receivers 1/1 Drivers/Receivers 1 Functions

Purchase Guide

24 Terminations 3.3V 24 Pin KSZ8081 Receivers 1/1 Drivers/Receivers 1 Functions

The KSZ8081RNA is an integrated, single 3.3V supply, fast Ethernet transceiver. It is fully compliant with the IEEE 802.3 Specification, and reduces board cost and simplifies board layout by using on-chip termination resistors for the two differential pairs and by integrating the regulator to supply the 1.2V core. Furthermore, Huge range of Semiconductors, Capacitors, Resistors and IcS in stock. Welcome RFQ.

This video shows Transceiver’s meaning, definition and explanation.

What is TRANSCEIVER? What does TRANSCEIVER mean? TRANSCEIVER meaning, definition & explanation

KSZ8081RNA Pinout

The following figure is the diagram of KSZ8081RNA pinout.

Pinout.png

Pinout


KSZ8081RNA CAD Model

The followings are KSZ8081RNA Symbol, Footprint, and 3D Model.

PCB Symbol.png

PCB Symbol


PCB Footprint.png

PCB Footprint


3D Model.png

3D Model


KSZ8081RNA Overview

The KSZ8081RNA is a single-supply 10BASE-T Ethernet physical-layer transceiver for transmission and reception of data over standard CAT-5 unshielded twisted pair (UTP) cable. The KSZ8081RNA is a highly-integrated PHY solution. It reduces board cost and simplifies board layout by using on-chip termination resistors for the differential pairs and by integrating a low-noise regulator to supply the 1.2V core, and by offering 1.8/2.5/3.3V digital I/O interface support. The KSZ8081RNA offers the Reduced Media Independent Interface (RMII) for direct connection to RMII-compliant MACs in Ethernet processors and switches. As the power-up default, the KSZ8081RNA uses a 25 MHz crystal to generate all required clocks, including the 50 MHz RMII reference clock output for the MAC. To facilitate system bring-up and debugging in production testing and in product deployment, parametric NAND tree support enables fault detection between KSZ8081RNA I/Os and the board. LinkMD® TDR-based cable diagnostics identify faulty copper cabling. The KSZ8081RNA is available in 24-pin, lead-free QFN package.

This article provides you with a basic overview of the KSZ8081RNA Transceiver, including its pin descriptions, features and specifications, etc., to help you quickly understand what KSZ8081RNA is.


KSZ8081RNA Features

● Single-Chip 10BASE-T IEEE 802.3 Compliant Ethernet Transceiver

● RMII v1.2 Interface Support with a 50 MHz Reference Clock Output to MAC, and an Option to Input a 50 MHz Reference Clock

● RMII Back-to-Back Mode Support for a 100 Mbps Copper Repeater

● MDC/MDIO Management Interface for PHY Register Configuration

● Programmable Interrupt Output

● LED Outputs for Link and Activity Status Indication

● On-Chip Termination Resistors for the Differential Pairs

● Baseline Wander Correction

● HP Auto MDI/MDI-X to Reliably Detect and Correct Straight-Through and Crossover Cable Connections with Disable and Enable Option

● Auto-Negotiation to Automatically Select the Highest Link-Up Speed (100 Mbps) and Duplex (Half/Full)

● Power-Down and Power-Saving Modes

● LinkMD® TDR-Based Cable Diagnostics to Identify Faulty Copper Cabling

● Parametric NAND Tree Support for Fault Detection Between Chip I/Os and the Board

● HBM ESD Rating (6 kV)

● Loopback Modes for Diagnostics

● Single 3.3V Power Supply with VDD I/O Options for 1.8V, 2.5V, or 3.3V

● Built-In 1.2V Regulator for Core

● Available in 24-pin 4 mm x 4 mm QFN Package


Specifications

Microchip Technology KSZ8081RNACA-TR technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology KSZ8081RNACA-TR.
  • Type
    Parameter
  • Factory Lead Time
    12 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    24-VFQFN Exposed Pad
  • Number of Pins
    24
  • Manufacturer Package Identifier

    The Manufacturer Package Identifier is a unique code or label assigned by the manufacturer to identify a specific package or housing style of an electronic component. This identifier helps in distinguishing between different package types of the same component, such as integrated circuits, transistors, or diodes. It typically includes information about the package dimensions, lead configuration, and other physical characteristics of the component. The Manufacturer Package Identifier is crucial for ensuring compatibility and proper assembly of electronic components in various devices and circuits.

    QFN44-24LD-PL-1
  • Usage Level
    Commercial grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape (CT)
  • Published
    2015
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    2 (1 Year)
  • Number of Terminations
    24
  • Type
    Transceiver
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    GOLD
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.8V 2.5V 3.3V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.2V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    KSZ8081
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Number of Channels
    1
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    Ethernet
  • Max Supply Current

    Max Supply Current refers to the maximum amount of electrical current that a component can draw from its power supply under normal operating conditions. It is a critical parameter that ensures the component operates reliably without exceeding its thermal limits or damaging internal circuitry. Exceeding this current can lead to overheating, performance degradation, or failure of the component. Understanding this parameter is essential for designing circuits that provide adequate power while avoiding overload situations.

    47mA
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    100 Mbps
  • Protocol

    In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.

    RMII
  • Number of Drivers/Receivers
    1/1
  • Duplex

    In the context of electronic components, "Duplex" refers to a type of communication system that allows for bidirectional data flow. It enables two devices to communicate with each other simultaneously, allowing for both sending and receiving of data at the same time. Duplex communication can be further categorized into two types: half-duplex, where data can be transmitted in both directions but not at the same time, and full-duplex, where data can be sent and received simultaneously. This parameter is crucial in networking and telecommunications systems to ensure efficient and effective data transmission between devices.

    Full
  • Simplex/Duplex

    In electronic components, the parameter "Simplex/Duplex" refers to the type of communication or data transmission mode supported by the component. Simplex communication is a one-way communication mode where data flows only in one direction, from the sender to the receiver. This means that the sender can only transmit data, and the receiver can only receive data. On the other hand, duplex communication is a two-way communication mode where data can flow in both directions, allowing for simultaneous transmission and reception of data between two devices. Understanding whether a component supports simplex or duplex communication is important for determining how data will be exchanged between devices and ensuring compatibility in a given system.

    Full Duplex
  • Max Junction Temperature (Tj)

    Max Junction Temperature (Tj) refers to the maximum allowable temperature at the junction of a semiconductor device, such as a transistor or integrated circuit. It is a critical parameter that influences the performance, reliability, and lifespan of the component. Exceeding this temperature can lead to thermal runaway, breakdown, or permanent damage to the device. Proper thermal management is essential to ensure the junction temperature remains within safe operating limits during device operation.

    125°C
  • Ambient Temperature Range High

    This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.

    70°C
  • Height
    900μm
  • Length
    4mm
  • Width
    4mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    Unknown
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
0 Similar Products Remaining

KSZ8081RNA Functional Block Diagram

The following is the Block Diagram of KSZ8081RNA.

System Block Diagram.png

System Block Diagram


KSZ8081RNA Equivalent

         Model number             Manufacturer                                              Description
KSZ8031RNLIMicrochip Technology IncEthernet Transceiver, 1-Trnsvr, 4 X 4 MM, LEAD FREE, QFN-24
KSZ8031RNLI-TRMicrochip Technology IncEthernet Transceiver, 4 X 4 MM, LEAD FREE, QFN-24
KSZ8051RNLI-TRMicrochip Technology IncEthernet Transceiver
KSZ8051RNLV-TRMicrochip Technology IncEthernet Transceiver
KSZ8081RNDIAMicrochip Technology IncDATACOM, ETHERNET TRANSCEIVER, QCC24
KSZ8081RNBCAMicrochip Technology IncDATACOM, ETHERNET TRANSCEIVER, QCC32
KSZ8061RNDIMicrochip Technology IncManchester Encoder
KSZ8051RNLUBMicrochip Technology IncEthernet Transceiver
KSZ8061RNBIMicrochip Technology IncManchester Encoder


Parts with Similar Specs

The three parts on the right have similar specifications to Microchip Technology & KSZ8081RNACA-TR.

KSZ8081RNA Applications

● Game Consoles

● IP Phones

● IP Set-Top Boxes

● IP TVs

● LOM

● Printers


KSZ8081RNA Package

The following diagram shows the KSZ8081RNA package.

Top View.png

Top View


Bottom View.png

Bottom View


Side View.png

Side View


KSZ8081RNA Recommended Land Pattern

The following is the Recommended Land Pattern of KSZ8081RNA.

Recommended Land Pattern.png

Recommended Land Pattern


KSZ8081RNA Manufacturer

Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.


Frequently Asked Questions

What is the essential property of the KSZ8081RNA?

The KSZ8081RNA is a single-supply 10BASE-T Ethernet physical-layer transceiver for transmission and reception of data over standard CAT-5 unshielded twisted pair (UTP) cable. The KSZ8081RNA is a highly-integrated PHY solution.

Regarding the KSZ8081RNA device, when is power-down mode enabled?

Power-down mode is used to power down the KSZ8081RNA device when it is not in use after power-up.

What is the use of the oscillator for KSZ8081RNA?

A crystal or external clock source, such as an oscillator, is used to provide the reference clock for the KSZ8081RNA.
KSZ8081RNACA-TR

Microchip Technology

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