ATMEGA32U4-AU Microcontroller: Schematic, Pinout, and Datasheet

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Published: 09 February 2022 | Last Updated: 09 February 2022

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ATMEGA32U4-AU

ATMEGA32U4-AU

Microchip Technology

32KB 16K x 16 FLASH AVR 8-Bit Microcontroller AVR® ATmega Series ATMEGA32U4 44 Pin 16MHz 5V 44-TQFP

Purchase Guide

32KB 16K x 16 FLASH AVR 8-Bit Microcontroller AVR® ATmega Series ATMEGA32U4 44 Pin 16MHz 5V 44-TQFP

The ATMEGA32U4-AU comes with a USB boot loader pre-installed in the controller's on-chip flash boot region. This article mainly introduces schematic, pinout, datasheet and other detailed information about Microchip Technology ATMEGA32U4-AU.

This video will show you the soldering of ATmega32U4-AU.

Soldering ATmega32U4-AU

ATMEGA32U4-AU Description

The ATMEGA32U4-AU comes with a USB boot loader pre-installed in the controller's on-chip flash boot region. This USB boot loader enables in-system programming from a USB host controller without the need to remove the component from the system, without the use of a pre-programmed application, and without the use of an external programming interface.

Based on the  AVR  improved  RISC  architecture, the ATMEGA32U4-AU  is a low-power CMOS 8-bit microcontroller. The device delivers throughputs approaching 1 MIPS per MHz by executing strong instructions in a single clock cycle, allowing the system designer to optimize power consumption versus processing performance.


ATMEGA32U4-AU Pinout

The following figure is ATMEGA32U4-AU Pinout.

pinout.jpg

Pinout


ATMEGA32U4-AU CAD Model

The followings are ATMEGA32U4-AU Symbol, Footprint and 3D Model.

symbol.png

Symbol

footprint.png

Footprint

3d model.jpg

3D Model

ATMEGA32U4-AU Features

• High Performance, Low Power AVR®  8-Bit  Microcontroller

• Advanced RISC Architecture

– 135 Powerful Instructions – Most Single Clock Cycle Execution

– 32 x 8 General Purpose Working Registers

– Fully Static Operation

– Up to 16 MIPS Throughput at 16MHz

– On-Chip 2-cycle Multiplier

• Non-volatile Program and Data Memories

– 16/32KB of In-System Self-Programmable Flash

– 1.25/2.5KB Internal  SRAM 

– 512Bytes/1KB Internal EEPROM

– Write/Erase Cycles: 10,000 Flash/100,000 EEPROM

– Data retention: 20 years at 85°C/ 100 years at 25°C(1)

– Optional Boot Code Section with Independent Lock Bits

In-System Programming by On-chip Boot Program

True Read-While-Write Operation

Parts using an external XTAL clock are pre-programmed with a default  USB  bootloader

– Programming Lock for Software Security

• JTAG (IEEE® std. 1149.1 compliant) Interface

– Boundary-scan Capabilities According to the  JTAG  Standard

– Extensive On-chip Debug Support

– Programming of Flash, EEPROM,  Fuses , and Lock Bits through the JTAG Interface

• USB 2.0 Full-speed/Low-Speed Device Module with Interrupt on Transfer Completion

– Complies fully with Universal Serial Bus Specification Rev 2.0

– Supports data transfer rates up to 12Mbit/s and 1.5Mbit/s

– Endpoint 0 for Control Transfers: up to 64-bytes

– Six Programmable Endpoints with IN or Out Directions and with Bulk, Interrupt or Isochronous Transfers

– Configurable Endpoints size up to 256 bytes in double bank mode

– Fully independent 832 bytes USB DPRAM for endpoint memory allocation

– Suspend/Resume Interrupts

– CPU Reset possible on USB Bus Reset detection

– 48MHz from  PLL  for Full-speed Bus Operation

– USB Bus Connection/Disconnection on Microcontroller Request

– Crystal-less operation for Low-Speed mode

• Peripheral Features

– On-chip PLL for USB and High-Speed Timer : 32 up to 96MHz operation

– One 8-bit Timer/Counter with Separate  Prescaler  and Compare Mode

– Two 16-bit Timer/Counter with Separate Prescaler, Compare- and Capture Mode

– One 10-bit High-Speed Timer/Counter with PLL (64MHz) and Compare Mode

– Four 8-bit  PWM  Channels

– Four PWM Channels with Programmable Resolution from 2 to 16 Bits

– Six PWM Channels for High-Speed Operation, with Programmable Resolution from 2 to 11 Bits

– Output Compare Modulator

– 12-channels, 10-bit ADC (features Differential Channels with  Programmable Gain )

– Programmable Serial USART with Hardware Flow Control

– Master/Slave SPI Serial Interface

– Byte-Oriented 2-wire Serial Interface

– Programmable Watchdog  Timer with Separate On-chip Oscillator

– On-chip Analog Comparator

– Interrupt and Wake-up on Pin Change

– On-chip Temperature Sensor

• Special Microcontroller Features

– Power-on Reset and Programmable Brown-out Detection

– Internal 8MHz Calibrated Oscillator

– Internal clock Prescaler and On-the-fly Clock Switching (Int RC / Ext Osc)

– External and Internal Interrupt Sources

– Six Sleep Modes: Idle,  ADC Noise Reduction, Power-save, Power-down, Standby, and Extended Standby

•  I/O and Packages

– All  I/O combine CMOS outputs and LVTTL inputs

– 26 Programmable I/O Lines

– 44-lead TQFP Package, 10x10mm

– 44-lead QFN Package, 7x7mm

• Operating Voltages

– 2.7 - 5.5V

• Operating temperature

– Industrial (-40°C to +85°C)

• Maximum Frequency

– 8MHz at 2.7V - Industrial range

– 16MHz at 4.5V - Industrial range


Specifications

Microchip Technology ATMEGA32U4-AU technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology ATMEGA32U4-AU.
  • Type
    Parameter
  • Factory Lead Time
    7 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    44-TQFP
  • Number of Pins
    44
  • Manufacturer Package Identifier

    The Manufacturer Package Identifier is a unique code or label assigned by the manufacturer to identify a specific package or housing style of an electronic component. This identifier helps in distinguishing between different package types of the same component, such as integrated circuits, transistors, or diodes. It typically includes information about the package dimensions, lead configuration, and other physical characteristics of the component. The Manufacturer Package Identifier is crucial for ensuring compatibility and proper assembly of electronic components in various devices and circuits.

    ATMEGA32U4-AU
  • Data Converters
    A/D 12x10b
  • Number of I/Os
    26
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    AVR® ATmega
  • Published
    2001
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    44
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn)
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    16MHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    ATMEGA32U4
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    I2C, I2S, SPI, UART, USART, USB
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    32kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    2.5K x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    2.7V~5.5V
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROCONTROLLER, RISC
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    AVR
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    Brown-out Detect/Reset, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    8-Bit
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    32KB 16K x 16
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    I2C, SPI, UART/USART, USB
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    8
  • Has ADC

    Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.

    YES
  • DMA Channels

    DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.

    NO
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    8b
  • Number of Timers/Counters
    5
  • EEPROM Size

    EEPROM Size refers to the amount of memory capacity available in an Electrically Erasable Programmable Read-Only Memory (EEPROM) chip. This parameter indicates the total storage space in bytes or bits that can be used to store data in a non-volatile manner. The EEPROM size determines the maximum amount of information that can be written, read, and erased from the memory chip. It is an important specification to consider when selecting an EEPROM for a particular application, as it directly impacts the amount of data that can be stored and accessed by the electronic component.

    1K x 8
  • Number of ADC Channels
    12
  • Number of PWM Channels
    8
  • Number of I2C Channels
    1
  • Height
    1.05mm
  • Length
    10mm
  • Width
    10mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
0 Similar Products Remaining

Parts with Similar Specs

The three parts on the right have similar specifications to Microchip Technology & ATMEGA32U4-AU.

ATMEGA32U4-AU Functional Block Diagram

The following figure is ATMEGA32U4-AU Functional Block Diagram.

Block Diagram.png

Functional Block Diagram

The AVR  core has 32 general-purpose working registers and a large instruction set. The Arithmetic Logic Unit  (ALU) is directly coupled to all 32 registers, allowing two independent registers to be accessed in a single instruction executed in one clock cycle. The resulting architecture is more code efficient than traditional  CISC  microcontrollers, with throughputs up to ten times faster.


ATMEGA32U4-AU Schematic

The ATMEGA32U4-AU Schematic is shown as follows.

Schematic.png

Schematic


ATMEGA32U4-AU Applications

• Automation & Process Control

• Consumer Electronics

• Embedded Design & Development

• Sensing & Instrumentation


ATMEGA32U4-AU Package

The following figure is ATMEGA32U4-AU Package.

package.png

Package


ATMEGA32U4-AU Manufacturer

Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, delivering low-risk product development, reduced overall system cost, and faster time to market to thousands of customers across the world. Microchip, based in Chandler, Arizona, provides excellent technical support as well as consistent delivery and quality.


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Datasheet PDF

Download datasheets and manufacturer documentation for Microchip Technology ATMEGA32U4-AU.
ATMEGA32U4-AU

Microchip Technology

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