How STMicroelectronics BCP53-16 Became a PNP Favorite

UTMEL

Published: 19 August 2025 | Last Updated: 19 August 2025

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BCP53-16

BCP53-16

STMicroelectronics

Trans GP BJT PNP 80V 1A 1600mW Automotive 4-Pin(3 Tab) SOT-223 T/R

Purchase Guide

Trans GP BJT PNP 80V 1A 1600mW Automotive 4-Pin(3 Tab) SOT-223 T/R

STMicroelectronics BCP53-16 leads PNP transistors in 2025 with superior voltage, current, and thermal performance, making it a top engineer choice.

Product Introduction

The STMicroelectronics BCP53-16 stands out as a top choice for PNP transistors in 2025. Many engineers pick this transistor because it offers a strong balance of voltage, current, and power handling in a small package. Its collector-emitter voltage reaches 80 V, and it can handle up to 1 A of current. The table below shows how its key numbers compare with other similar PNP transistors:

ParameterSTMicroelectronics BCP53-16Other PNPs (Typical Range)
Collector-Emitter Voltage80 V80 V
Maximum Collector Current1 A0.8 – 1 A
Power Dissipation1.2 – 2 W0.725 – 2 W

Engineers value this transistor for its reliable performance and efficient design, especially when comparing it to other options in the market.

Overview     

Key Specs

The STMicroelectronics BCP53-16 offers a strong set of features for many electronic designs. This PNP transistor supports a collector-emitter voltage (Vce) of up to 80 volts. It can handle a maximum collector current (Ic) of 1 ampere. The device manages power dissipation between 1.5 and 2 watts, which helps it work well in circuits that need medium power. Its current gain (hFE) ranges from 25 to 250, making it flexible for different signal strengths. The SOT-223 package gives the transistor a compact size and helps with heat management.

Engineers often choose this transistor for its balance of voltage, current, and power in a small footprint.

Key Specifications:

  • Collector-Emitter Voltage (Vce): 80 V

  • Maximum Collector Current (Ic): 1 A

  • Power Dissipation (Pd): 1.5–2 W

  • Current Gain (hFE): 25–250

  • Package: SOT-223

Applications

The STMicroelectronics BCP53-16 finds use in many modern electronics. It works well in amplifiers, switches, voltage regulators, and as a driver for MOSFETs. Many engineers use it in power management and audio circuits. Recent industry reports show that this transistor appears in a wide range of automotive and industrial systems.

Application CategorySpecific Uses / Examples
Advanced Driver Assistance Systems (ADAS)LiDAR systems, front/rear camera systems, radar sensor modules
Body Control & LightingAdaptive front LED lights, HVAC blower motors, interior LED lighting
Centralized ArchitectureIn-vehicle network protection, zone control units
Chassis & SafetyAirbag controllers, ABS/ESC, electronic power steering
Conventional PowertrainCooling fans, electronic fuel injection, fluid pumps
Electrification (xEV powertrain)Battery management systems, high-voltage traction inverters, on-board chargers
Infotainment & TelematicsLED backlights for touchscreens, multimedia bus protection, DC/DC converters
Other SectorsIndustrial, consumer, mobile, and wearable electronics

This wide range of uses shows why the STMicroelectronics BCP53-16 has become a favorite among engineers. Its reliable performance and flexible design help it fit into many types of projects.

STMicroelectronics BCP53-16 Features

Power and Thermal

The STMicroelectronics BCP53-16 handles medium power levels with ease. It supports up to 2 watts of power dissipation, which makes it suitable for many electronic circuits. The transistor can carry a collector current of up to 1 ampere. This level of current works well for both switching and amplification tasks.

Thermal management stands out as a key feature. The SOT-223 package includes an exposed heatsink tab. This tab helps move heat away from the transistor quickly. When heat leaves the device faster, the transistor stays cooler and works more reliably. Engineers often choose this part for designs that need stable operation under moderate loads.

Tip: Good thermal performance means longer life for electronic parts. Devices that stay cool last longer and fail less often.

Package Benefits

The SOT-223 package offers several advantages. It has a flat, compact shape that saves space on circuit boards. The exposed metal tab on the back of the package connects directly to the circuit board. This design improves heat transfer and allows for better cooling.

The package also makes assembly easier. Automated machines can place SOT-223 parts quickly and accurately. This helps manufacturers build products faster and with fewer errors. The package supports both hand-soldering and automated assembly, which adds flexibility for different production needs.

A summary of package benefits:

  • Efficient heat dissipation with exposed tab

  • Small size for high-density layouts

  • Easy handling in automated assembly

  • Reliable performance in various environments

The STMicroelectronics BCP53-16 combines strong power handling with a smart package design. These features help engineers create reliable and efficient electronic systems.

Comparison

Competing PNPs

Many engineers compare the STMicroelectronics BCP53-16 with other well-known PNP transistors. Some of the most common alternatives include the BC327, MJE2955, and 2N2907. Each transistor has its own strengths and fits different needs in electronic circuits.

  • BC327: This transistor works well for low-power applications. It handles a maximum collector current of 0.8 A and a collector-emitter voltage of 45 V. Its small TO-92 package makes it easy to use in compact designs.

  • MJE2955: This device supports higher power. It can handle up to 10 A of collector current and 60 V of collector-emitter voltage. The TO-220 package helps with heat dissipation, but it takes up more space.

  • 2N2907: This classic PNP transistor supports up to 0.6 A of collector current and 60 V of collector-emitter voltage. It often appears in signal and switching circuits.

  • BCP53-16T1G and BCP53-16HE3-TP: These parts are direct equivalents to the STMicroelectronics BCP53-16. They share the same electrical characteristics and package style.

Note: Engineers should always check the datasheet for each transistor to match the right part to their project.

Performance

The STMicroelectronics BCP53-16 stands out for its balance of electrical performance and package design. The table below shows how it compares to other PNP transistors:

TransistorVce (Max)Ic (Max)Pd (Max)hFE RangePackageThermal Feature
STMicroelectronics BCP53-1680 V1 A1.5–2 W25–250SOT-223Exposed heatsink tab
BC32745 V0.8 A0.625 W100–630TO-92Standard plastic case
MJE295560 V10 A75 W20–70TO-220Large metal tab
2N290760 V0.6 A0.4 W100–300TO-92Standard plastic case
  • Electrical Characteristics: The STMicroelectronics BCP53-16 offers a higher voltage rating than the BC327 and 2N2907. It supports more current than both, but less than the MJE2955. This makes it a strong choice for medium-power circuits.

  • Thermal Performance: The SOT-223 package with an exposed heatsink tab helps the BCP53-16 manage heat better than the TO-92 packages of the BC327 and 2N2907. The MJE2955 handles more power but uses a much larger TO-220 package.

  • Package Differences: The SOT-223 package saves board space and allows for automated assembly. The TO-92 package is smaller but does not handle as much heat. The TO-220 package is large and best for high-power needs.

Tip: When engineers need a PNP transistor for medium power and want to save space, the STMicroelectronics BCP53-16 often becomes the best option.

The BCP53-16 and its equivalents, like BCP53-16T1G and BCP53-16HE3-TP, give engineers flexibility. They combine good electrical ratings with a package that fits modern assembly lines. This makes them popular in many new designs.

Real-World Use

Reliability

Engineers often select the STMicroelectronics BCP53-16 for projects that demand consistent performance. This transistor shows strong reliability in both laboratory tests and field applications. Many users report that the device maintains stable operation even when exposed to temperature changes or electrical stress. The SOT-223 package helps the transistor manage heat, which reduces the risk of failure.

Note: Devices that stay cool usually last longer. The exposed heatsink tab on the BCP53-16 helps keep the temperature low.

Manufacturers have tested the BCP53-16 in automotive and industrial environments. These tests show that the transistor can handle voltage spikes and power surges. The device also resists damage from vibration and mechanical shock. This makes it a good choice for systems that need to work without interruption.

A summary of reliability features:

  • Withstands voltage spikes and surges

  • Handles thermal stress with efficient heat dissipation

  • Resists vibration and shock in harsh environments

User Feedback

Users from different industries share positive experiences with the BCP53-16. Many engineers say that the transistor performs well in both new designs and as a replacement in older circuits. They appreciate the compact SOT-223 package, which saves space on crowded boards.

A few common points from user reviews:

Feedback CategoryUser Comments
Performance"Stable operation under load"
Assembly"Easy to solder and place"
Versatility"Works in many circuit types"
Reliability"Rarely fails in the field"

Some engineers highlight the ease of sourcing the BCP53-16. Distributors often keep it in stock, which helps avoid project delays. Others mention that the device’s datasheet provides clear information, making design and troubleshooting easier.

👍 The BCP53-16 earns trust from engineers who value reliability, ease of use, and strong technical support.

Market in 2025

Availability

In 2025, the STMicroelectronics BCP53-16 remains widely available. Distributors across North America, Europe, and Asia keep this PNP transistor in stock. Many online electronics stores list the BCP53-16 as a standard item. Engineers can order it in both small and large quantities. This steady supply helps companies avoid delays in production.

Manufacturers continue to produce the BCP53-16 because demand stays high. Automotive, industrial, and consumer electronics companies use this part in many products. Authorized distributors receive regular shipments from STMicroelectronics. This ensures that the BCP53-16 does not face shortages, even when global supply chains experience stress.

Tip: Engineers who need a reliable source for the BCP53-16 can check major distributors like Digi-Key, Mouser, and Arrow. These suppliers often provide real-time stock updates.

A quick look at typical sources:

  • Global Distributors: Digi-Key, Mouser, Arrow, Farnell

  • Regional Suppliers: RS Components, Newark, TME

  • Online Marketplaces: LCSC, AliExpress

Pricing

The price of the STMicroelectronics BCP53-16 stays competitive in 2025. Most distributors offer this transistor at a low cost, especially for bulk orders. Single-unit prices usually range from $0.20 to $0.50. Larger orders can bring the price down to $0.10 per unit or less.

Quantity OrderedTypical Price per Unit (USD)
1–9$0.20–$0.50
10–99$0.15–$0.30
100+$0.08–$0.15

Prices may change based on region, distributor, and market demand. However, the BCP53-16 remains affordable for most projects. Engineers often choose it because it offers good value for its performance.

Note: Buying in bulk can help companies save money and secure enough stock for future needs.

The strong availability and fair pricing of the BCP53-16 make it a smart choice for both small and large-scale designs in 2025.

Engineer Preference

Community

Engineers often share their experiences with the STMicroelectronics BCP53-16 in online forums and technical groups. Many users praise its reliability and ease of use. They say the SOT-223 package helps with heat management and fits well on crowded circuit boards. Some engineers like that the part is easy to find and meets strict environmental standards.

A common topic in the community involves design challenges. Engineers discuss how to keep the transistor within safe limits for current, voltage, and temperature. They often refer to the following table when planning their circuits:

ParameterSpecification / ValueDesign Challenge / Impact on Integration
Maximum Collector Current1.5 AMust not be exceeded to avoid overheating and damage
Collector-Emitter Breakdown Voltage80 VVoltage limits must be respected to prevent transistor breakdown
Maximum Power Dissipation1.5 WThermal dissipation must be managed within this limit to ensure reliability
Peak Reflow Temperature260 °CSoldering process must not exceed this temperature to avoid component damage
Operating Temperature Range-65 °C to 150 °C TJDesign must ensure operation within this temperature range
Mounting TypeSurface MountPhysical mounting and packaging constraints must be considered
Environmental ComplianceRoHS3, REACH SVHCCompliance affects material selection and manufacturing processes
Lifecycle StatusActive, 8 weeks lead timeLead time impacts project scheduling and component availability

Engineers recommend checking these values before starting a new project. Careful planning helps avoid problems later.

Design Wins

The STMicroelectronics BCP53-16 appears in many successful products. Companies use it in automotive systems, power supplies, and consumer electronics. Design teams choose this transistor because it offers a good mix of performance and cost. Its strong ratings for voltage and current make it a favorite for medium-power circuits.

Some engineers highlight the part’s fast lead time and active lifecycle status. This means they can count on getting the part when they need it. Others point out that the device meets RoHS3 and REACH SVHC standards, which helps with global product compliance.

A few reasons why design teams pick this transistor:

  • Reliable operation in harsh environments

  • Easy integration into automated assembly lines

  • Good support from distributors and the manufacturer

Many engineers say the STMicroelectronics BCP53-16 helps them finish projects on time and within budget. Its strong community support and proven track record make it a top choice for new designs.


The BCP53-16 stands out among PNP transistors in 2025 for several reasons:

  • Strong voltage and current ratings

  • Reliable thermal performance in a compact SOT-223 package

  • Proven track record in real-world applications

Engineers trust this transistor for its value and consistent results. The BCP53-16 remains a top choice for modern designs. Readers can review the datasheet or try the BCP53-16 in their next project to see its benefits firsthand.

FAQ

What makes the BCP53-16 different from other PNP transistors?

The BCP53-16 offers a higher voltage rating and better thermal management than many similar PNP transistors. Its SOT-223 package helps it stay cool and fit into tight spaces.

Can the BCP53-16 replace older PNP transistors in existing designs?

Yes, engineers often use the BCP53-16 as a drop-in replacement. It matches or exceeds the ratings of many older PNP transistors. Always check the datasheet for compatibility.

Is the BCP53-16 suitable for automotive applications?

The BCP53-16 works well in automotive systems. It handles voltage spikes, vibration, and temperature changes. Many engineers use it in safety, lighting, and power management circuits.

Where can engineers find technical support for the BCP53-16?

Engineers can find support on STMicroelectronics’ website, distributor pages, and online forums. The datasheet provides detailed information. Many community members share tips and design advice.

Specifications

STMicroelectronics BCP53-16 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics BCP53-16.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 8 months ago)
  • Factory Lead Time
    8 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    TO-261-4, TO-261AA
  • Number of Pins
    4
  • Transistor Element Material

    The "Transistor Element Material" parameter in electronic components refers to the material used to construct the transistor within the component. Transistors are semiconductor devices that amplify or switch electronic signals and are a fundamental building block in electronic circuits. The material used for the transistor element can significantly impact the performance and characteristics of the component. Common materials used for transistor elements include silicon, germanium, and gallium arsenide, each with its own unique properties and suitability for different applications. The choice of transistor element material is crucial in designing electronic components to meet specific performance requirements such as speed, power efficiency, and temperature tolerance.

    SILICON
  • Collector-Emitter Breakdown Voltage
    80V
  • Collector-Emitter Saturation Voltage
    -500mV
  • Number of Elements
    1
  • hFEMin
    40
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    150°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape (CT)
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    4
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    1.6W
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    50MHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    BCP53
  • Pin Count

    a count of all of the component leads (or pins)

    4
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Single
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    1.6W
  • Case Connection

    Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.

    COLLECTOR
  • Transistor Application

    In the context of electronic components, the parameter "Transistor Application" refers to the specific purpose or function for which a transistor is designed and used. Transistors are semiconductor devices that can amplify or switch electronic signals and are commonly used in various electronic circuits. The application of a transistor can vary widely depending on its design and characteristics, such as whether it is intended for audio amplification, digital logic, power control, or radio frequency applications. Understanding the transistor application is important for selecting the right type of transistor for a particular circuit or system to ensure optimal performance and functionality.

    SWITCHING
  • Gain Bandwidth Product

    The gain–bandwidth product (designated as GBWP, GBW, GBP, or GB) for an amplifier is the product of the amplifier's bandwidth and the gain at which the bandwidth is measured.

    50MHz
  • Polarity/Channel Type

    In electronic components, the parameter "Polarity/Channel Type" refers to the characteristic that determines the direction of current flow or the type of signal that can be accommodated by the component. For components like diodes and transistors, polarity indicates the direction in which current can flow through the component, such as forward bias or reverse bias for diodes. For components like MOSFETs or JFETs, the channel type refers to whether the component is an N-channel or P-channel device, which determines the type of charge carriers that carry current through the component. Understanding the polarity or channel type of a component is crucial for proper circuit design and ensuring that the component is connected correctly to achieve the desired functionality.

    PNP
  • Transistor Type

    Transistor type refers to the classification of transistors based on their operation and construction. The two primary types are bipolar junction transistors (BJTs) and field-effect transistors (FETs). BJTs use current to control the flow of current, while FETs utilize voltage to control current flow. Each type has its own subtypes, such as NPN and PNP for BJTs, and MOSFETs and JFETs for FETs, impacting their applications and characteristics in electronic circuits.

    PNP
  • Collector Emitter Voltage (VCEO)

    Collector-Emitter Voltage (VCEO) is a key parameter in electronic components, particularly in transistors. It refers to the maximum voltage that can be applied between the collector and emitter terminals of a transistor while the base terminal is open or not conducting. Exceeding this voltage limit can lead to breakdown and potential damage to the transistor. VCEO is crucial for ensuring the safe and reliable operation of the transistor within its specified limits. Designers must carefully consider VCEO when selecting transistors for a circuit to prevent overvoltage conditions that could compromise the performance and longevity of the component.

    80V
  • Max Collector Current

    Max Collector Current is a parameter used to specify the maximum amount of current that can safely flow through the collector terminal of a transistor or other electronic component without causing damage. It is typically expressed in units of amperes (A) and is an important consideration when designing circuits to ensure that the component operates within its safe operating limits. Exceeding the specified max collector current can lead to overheating, degradation of performance, or even permanent damage to the component. Designers must carefully consider this parameter when selecting components and designing circuits to ensure reliable and safe operation.

    1A
  • DC Current Gain (hFE) (Min) @ Ic, Vce

    The parameter "DC Current Gain (hFE) (Min) @ Ic, Vce" in electronic components refers to the minimum value of the DC current gain, denoted as hFE, under specific operating conditions of collector current (Ic) and collector-emitter voltage (Vce). The DC current gain hFE represents the ratio of the collector current to the base current in a bipolar junction transistor (BJT), indicating the amplification capability of the transistor. The minimum hFE value at a given Ic and Vce helps determine the transistor's performance and efficiency in amplifying signals within a circuit. Designers use this parameter to ensure proper transistor selection and performance in various electronic applications.

    100 @ 150mA 2V
  • Current - Collector Cutoff (Max)

    The parameter "Current - Collector Cutoff (Max)" refers to the maximum current at which a transistor or other electronic component will cease to conduct current between the collector and emitter terminals. This parameter is important in determining the maximum current that can flow through the component when it is in the cutoff state. Exceeding this maximum cutoff current can lead to malfunction or damage of the component. It is typically specified in the component's datasheet and is crucial for proper circuit design and operation.

    100nA ICBO
  • Vce Saturation (Max) @ Ib, Ic

    The parameter "Vce Saturation (Max) @ Ib, Ic" in electronic components refers to the maximum voltage drop across the collector-emitter junction when the transistor is in saturation mode. This parameter is specified at a certain base current (Ib) and collector current (Ic) levels. It indicates the minimum voltage required to keep the transistor fully conducting in saturation mode, ensuring that the transistor operates efficiently and does not enter the cutoff region. Designers use this parameter to ensure proper transistor operation and to prevent overheating or damage to the component.

    500mV @ 50mA, 500mA
  • Transition Frequency

    Transition Frequency in electronic components refers to the frequency at which a device can transition from one state to another, typically defining the upper limit of its operating frequency. It is a critical parameter in determining the speed and performance of active components like transistors and integrated circuits. This frequency is influenced by factors such as capacitance, resistance, and the inherent characteristics of the materials used in the component's construction. Understanding transition frequency is essential for optimizing circuit designs and ensuring reliable signal processing in various applications.

    50MHz
  • Max Breakdown Voltage

    The "Max Breakdown Voltage" of an electronic component refers to the maximum voltage that the component can withstand across its terminals before it breaks down and allows current to flow uncontrollably. This parameter is crucial in determining the operating limits and safety margins of the component in a circuit. Exceeding the maximum breakdown voltage can lead to permanent damage or failure of the component. It is typically specified by the manufacturer in datasheets to guide engineers and designers in selecting the appropriate components for their applications.

    80V
  • Collector Base Voltage (VCBO)

    Collector Base Voltage (VCBO) is the maximum allowable voltage that can be applied between the collector and base terminals of a bipolar junction transistor when the emitter is open. It is a critical parameter that determines the voltage rating of the transistor and helps prevent breakdown in the collector-base junction. Exceeding this voltage can lead to permanent damage or failure of the component.

    100V
  • Emitter Base Voltage (VEBO)

    Emitter Base Voltage (VEBO) is a parameter used in electronic components, particularly in transistors. It refers to the maximum voltage that can be applied between the emitter and base terminals of a transistor without causing damage to the device. Exceeding this voltage limit can lead to breakdown of the transistor and potential failure. VEBO is an important specification to consider when designing circuits to ensure the proper operation and reliability of the components. It is typically provided in the datasheet of the transistor and should be carefully observed to prevent any potential damage during operation.

    5V
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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BCP53-16

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