How to Fix Issues with the STM32F091RCT6 Step by Step
256KB 256K x 8 FLASH ARM® Cortex®-M0 32-Bit Microcontroller STM32F0 Series STM32F09 64 Pin 48MHz 3.3V 64-LQFP









256KB 256K x 8 FLASH ARM® Cortex®-M0 32-Bit Microcontroller STM32F0 Series STM32F09 64 Pin 48MHz 3.3V 64-LQFP
Troubleshoot STM32F091RCT6 issues like power instability, faulty connections, and debugging errors with step-by-step solutions for reliable performance.
Product Introduction
Troubleshooting the STM32F091RCT6 microcontroller is essential for maintaining its performance. When issues arise, they can disrupt your project and waste valuable time. You need a systematic approach to identify and resolve problems efficiently. By breaking the process into clear steps, you can pinpoint errors faster and restore your MCU to full functionality. This method not only saves time but also helps you understand the inner workings of your microcontroller.
Step 1: Check the Power Supply of the STM32F091RCT6
Verify Voltage Levels
Start by measuring the voltage levels supplied to your STM32F091RCT6. Use a multimeter to check if the voltage matches the specifications in the datasheet. The microcontroller requires a stable voltage to function correctly. If the voltage is too low or too high, it can cause erratic behavior or even damage the MCU. Ensure the power source is reliable and capable of handling the required power consumption of the STM32F091RCT6.
Inspect the Voltage Regulator
The voltage regulator plays a critical role in maintaining a steady supply to the MCU. Examine the regulator for signs of overheating or physical damage. If you suspect the regulator is faulty, replace it with a new one. Verify that the regulator's output voltage aligns with the STM32F091RCT6's requirements. A malfunctioning regulator can lead to inconsistent power consumption, which may disrupt the microcontroller's operation.
Check for Power Supply Noise or Instability
Power supply noise or instability can interfere with the STM32F091RCT6's performance. To detect these issues, follow these steps:
Use an oscilloscope with sufficient bandwidth and sample rate.
Connect a high-quality probe to minimize ambient noise.
Attach a dynamic load to the power supply output to simulate switching loads.
Place the oscilloscope across the output capacitor using a short ground spring or wire ground stub.
Adjust the oscilloscope settings for AC or DC coupling as needed.
Power the circuit and observe transient spikes or fluctuations.
These measurements help you identify noise or instability that could affect the MCU's power consumption. Addressing these issues ensures the STM32F091RCT6 operates efficiently and reliably.
Step 2: Inspect Physical Connections of the Microcontroller
Examine Cables and Connectors
Faulty cables or connectors can disrupt the operation of your STM32F091RCT6. Begin by visually inspecting all cables and connectors for signs of wear, corrosion, or physical damage. Ensure each connector is securely attached and properly aligned with its corresponding pins. Loose or misaligned connections can cause intermittent issues that are difficult to diagnose.
Industry standards like IPC/WHMA-A-620 and J-STD-001 provide guidelines for inspecting cables and connectors. These standards emphasize proper wire preparation, crimping, soldering, and connectorization. Refer to the table below for a quick overview:
| Standard | Description |
|---|---|
| IPC/WHMA-A-620 | Requirements and Acceptance for Cable and Wire Harness Assemblies, detailing wire preparation, crimping, soldered interconnections, connectorization, and testing methodology. |
| J-STD-001 | Establishes requirements for solder connections impacting wire-to-PCB interfaces, including criteria for through-hole soldering and proper wetting of connections. |
Following these guidelines ensures reliable connections and minimizes the risk of electrical faults.
Check Soldering Quality
Poor soldering can lead to unstable connections between the STM32F091RCT6 and other components. Examine solder joints for cracks, uneven surfaces, or insufficient solder coverage. Use a magnifying glass or microscope for a closer look. High-quality soldering should meet specific criteria, such as a minimum PTH fill of 75% and circular wetting of 270° for components and 330° for solder.
| Criteria | Requirement |
|---|---|
| Minimum PTH fill | 75% |
| Circular wetting (component) | 270° |
| Circular wetting (solder) | 330° |
If you find soldering defects, rework the affected areas using proper soldering techniques. This step ensures stable electrical connections and prevents unexpected failures.
Look for Loose or Damaged Components
Loose or damaged components can cause your MCU to malfunction. Perform a thorough visual inspection to identify burnt, swollen, or physically damaged components. Use the following methods to detect issues:
Visual Inspection: Check for visible signs of damage, such as burnt or swollen components.
Comparative Method: Compare the board with a functioning one to identify defects.
Substitution Method: Replace suspected faulty ICs with new ones to verify functionality.
Automated X-ray Inspection (AXI): Use X-ray imaging to detect hidden defects in soldering or components.
These practices help you pinpoint problematic components and restore your STM32F091RCT6 to optimal performance. Addressing physical connection issues ensures the microcontroller operates reliably in your application.
Step 3: Verify the Programming Interface and Reset Pin
Confirm Correct Pin Connections
Incorrect pin connections can prevent your STM32F091RCT6 from functioning properly. Start by reviewing the microcontroller's datasheet to identify the correct pinout for the programming interface. Compare the pin connections on your circuit board with the datasheet. Pay special attention to pins like SWDIO and SWCLK, which are critical for programming.
Use a multimeter to check for continuity between the pins and their respective traces. If you find any disconnected or shorted pins, rework the soldering or replace damaged components. Proper pin connections ensure the programming interface communicates effectively with the debugger.
Test the Reset Pin Functionality
The reset pin plays a vital role in initializing the STM32F091RCT6. To test its functionality, follow these steps:
Connect the reset pin to a pull-up resistor as specified in the datasheet.
Use an oscilloscope to monitor the pin's voltage level during operation.
Press the reset button or toggle the pin manually to observe its behavior.
If the reset pin fails to respond, inspect the surrounding circuitry for issues. Replace faulty components or adjust the resistor value if necessary. A functional reset pin ensures the MCU can recover from errors and start programming correctly.
Ensure the Debugger is Properly Configured
A misconfigured debugger can block communication with the STM32F091RCT6. Verify the debugger settings in your programming software. Check that the correct target microcontroller is selected and the communication protocol matches the MCU's requirements.
Here’s a quick checklist for debugger configuration:
Debugger Compatibility: Ensure your debugger supports the STM32F091RCT6.
Firmware Updates: Update the debugger firmware to the latest version.
Connection Settings: Confirm the baud rate, clock speed, and interface type (e.g., SWD or JTAG).
If the debugger still fails to connect, test it with another MCU to rule out hardware issues. Proper debugger configuration guarantees seamless programming and debugging of your microcontroller.
Step 4: Examine the Clock and Oscillator of the STM32F091RCT6
Check the External Oscillator Circuit
The external oscillator circuit plays a vital role in the STM32F091RCT6's performance. Start by inspecting the crystal oscillator and its surrounding components. Look for physical damage, such as cracks or discoloration, on the crystal. Verify that the capacitors connected to the oscillator match the values recommended in the microcontroller's datasheet. Incorrect capacitor values can lead to unstable clock signals, which may affect the MCU's performance.
Use an oscilloscope to measure the oscillator's output signal. Ensure the waveform is clean and matches the expected frequency. If the signal appears distorted or absent, replace the crystal or check for faulty soldering. A properly functioning oscillator circuit ensures the MCU operates at the correct clock speed.
Verify Clock Configuration in Firmware
Incorrect clock settings in the firmware can cause the STM32F091RCT6 to malfunction. Open your debugging software and review the clock configuration settings. Confirm that the system clock source matches your hardware setup. For example, if you are using an external oscillator, ensure the firmware is configured to use it instead of the internal clock.
Pay attention to the clock prescalers and multipliers. These settings determine the final clock frequency supplied to the MCU. Incorrect values can lead to performance issues or even prevent the microcontroller from starting. Adjust the settings as needed and reprogram the firmware to apply the changes.
Test for Clock Signal Stability
Clock signal stability is crucial for the STM32F091RCT6's performance optimization. Use an oscilloscope to monitor the clock signal over time. Look for fluctuations in frequency or amplitude, which could indicate instability. Environmental factors, such as temperature changes, can also affect the clock signal. Ensure the oscillator circuit is placed away from heat sources or other components that generate electromagnetic interference.
If you detect instability, consider adding decoupling capacitors near the oscillator circuit. These capacitors help filter out noise and improve signal stability. A stable clock signal ensures the MCU performs reliably under various conditions.
Tip: Regularly testing the clock and oscillator can prevent debugging challenges caused by timing issues.
Step 5: Troubleshoot Debugger and Software Settings
Confirm Debugger Compatibility
Your debugger must be compatible with the STM32F091RCT6 to ensure smooth communication with the MCU. Start by checking the debugger's specifications against the microcontroller's datasheet. Confirm that the debugger supports the SWD or JTAG interface, as these are commonly used for STM32 devices.
If compatibility issues arise, update the debugger's firmware to the latest version. Many debugging tools, such as ST-Link or J-Link, offer regular updates to improve efficiency and support newer devices. Test the debugger with another MCU to rule out hardware faults. Ensuring compatibility prevents unnecessary delays during programming and debugging.
Check Software Settings and Firmware
Incorrect software settings can hinder the STM32F091RCT6's performance. Review your debugging software configurations carefully. Verify that the correct target MCU is selected and that the communication protocol matches your setup. Debugging tools like PlatformIO or Visual Studio Code provide graphical interfaces to simplify this process.
Optimize your firmware by removing debugging information before deployment. Debugging data can slow down the MCU and reduce efficiency. Implement Over-the-Air (OTA) updates cautiously to avoid interruptions that might corrupt the firmware. Use backup memory during updates to protect data integrity and prevent device bricking. Regularly check for firmware updates to fix bugs, add features, and enhance security.
Test Communication Between the Debugger and Microcontroller
Testing communication between the debugger and the STM32F091RCT6 ensures proper functionality. Follow these systematic steps:
Use a serial interface to print debug messages for initial bug identification.
Implement the SWD interface to access live data during firmware execution.
Set breakpoints to analyze memory state at specific points in the code.
Monitor variable changes in real-time without re-flashing the firmware.
Modify variables directly through the debug interface as needed.
Step through the code to locate crash points if the program fails unexpectedly.
These steps help you identify communication issues and improve debugging efficiency. A reliable connection between the debugger and MCU ensures smooth programming and troubleshooting.
Tip: Always test communication in a controlled environment to avoid external interference that could affect debugging results.
Step 6: Investigate Less Common Causes of Power Consumption Issues
Check for Electrostatic Discharge (ESD) Damage
Electrostatic discharge (ESD) can silently damage your STM32F091RCT6 microcontroller, leading to unexpected power consumption. ESD occurs when static electricity builds up and discharges into sensitive components. To identify ESD damage, inspect the microcontroller for physical signs like burn marks or discoloration. Use an ESD-safe workstation to prevent further damage during troubleshooting.
Implement power-saving techniques to mitigate ESD-related issues. For example, ensure proper grounding of your circuit board and use ESD-protective packaging for storage. Adding ESD suppressors to your design can also safeguard the microcontroller from future discharges. These steps enhance energy efficiency and reduce the risk of excessive power consumption caused by ESD damage.
Tip: Always handle the microcontroller with ESD-safe tools to avoid accidental damage during repairs.
Inspect for Faulty or Damaged Components
Faulty components can disrupt low-power operation and increase power consumption. Begin by checking the power supply to ensure the microcontroller receives the correct voltage and current. Use a multimeter or oscilloscope for precise measurements. Next, verify the code using a debugger or simulator to identify errors that might cause abnormal consumption.
Test the inputs and outputs with a logic analyzer to confirm proper functionality. Examine the hardware for physical defects using a magnifying glass or microscope. If you suspect a component is damaged, consult the datasheet and user manual for troubleshooting guidance. These diagnostic techniques help you pinpoint issues and restore the microcontroller to its low-power states.
Evaluate Environmental Factors (e.g., temperature, humidity)
Environmental conditions like temperature and humidity can significantly impact power consumption. High temperatures may increase the microcontroller's operating frequency, leading to higher consumption. Humidity can affect sensor performance, causing errors that disrupt low-power modes.
To minimize these effects, test your microcontroller under various environmental conditions. For example, evaluate its performance at different temperature and humidity levels. Use corrective models to adjust for environmental variations and maintain energy efficiency. Keeping the microcontroller in a stable environment ensures reliable low-power operation.
Note: Place the microcontroller away from heat sources and moisture to prevent environmental interference.
Troubleshooting the STM32F091RCT6 microcontroller becomes easier when you follow a systematic approach. Each step, from checking the power supply to investigating environmental factors, helps you identify and resolve issues effectively. For example:
Measure voltage levels to ensure stability.
Inspect connectors and soldering to verify proper attachment.
Use connectors designed to prevent backward installation errors.
Documenting your findings during each step is essential. It allows you to track patterns and avoid repeating mistakes in future projects. A structured process not only saves time but also improves the reliability of your microcontroller.
Tip: Keep a troubleshooting log to build a reference for similar issues later.
FAQ
1. What tools do you need to troubleshoot the STM32F091RCT6?
You need a multimeter, oscilloscope, debugger (e.g., ST-Link or J-Link), soldering tools, and a logic analyzer. These tools help you measure voltage, inspect signals, debug firmware, and verify connections.
2. How can you prevent electrostatic discharge (ESD) damage?
Use an ESD-safe workstation and tools. Ground your circuit board properly and store components in ESD-protective packaging. Adding ESD suppressors to your design also helps safeguard the microcontroller.
3. What should you check if the microcontroller doesn’t start?
Verify the power supply voltage, inspect the reset pin functionality, and confirm the clock configuration in the firmware. Check for loose connections or damaged components.
4. Can environmental factors affect the STM32F091RCT6?
Yes, temperature and humidity can impact performance. High temperatures may increase power consumption, while humidity can disrupt sensors. Keep the microcontroller in a stable environment away from heat sources and moisture.
5. What is the best way to document troubleshooting steps?
Maintain a troubleshooting log. Record each step, findings, and solutions. This helps you track patterns and avoid repeating mistakes in future projects.
Tip: Use diagrams or photos to visually document hardware setups for easier reference later.
Specifications
- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 7 months ago) - Factory Lead Time10 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
64-LQFP - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of Pins64
- Weight342.689036mg
- Data ConvertersA/D 19x12b; D/A 2x12b
- Number of I/Os52
- Watchdog TimersYes
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C TA - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
STM32F0 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Number of Terminations64
- Max Power Dissipation
The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.
455mW - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
QUAD - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
NOT SPECIFIED - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
3.3V - Terminal Pitch
The center distance from one pole to the next.
0.5mm - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
48MHz - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
NOT SPECIFIED - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
STM32F09 - Qualification Status
An indicator of formal certification of qualifications.
Not Qualified - Supply Voltage-Min (Vsup)
The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.
2V - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
CAN, I2C, I2S, IrDA, LIN, SPI, USART - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
256kB - Oscillator Type
Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.
Internal - RAM Size
RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.
32K x 8 - Voltage - Supply (Vcc/Vdd)
Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.
2V~3.6V - uPs/uCs/Peripheral ICs Type
The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.
MICROCONTROLLER, RISC - Core Processor
The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.
ARM® Cortex®-M0 - Peripherals
In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.
DMA, I2S, POR, PWM, WDT - Program Memory Type
Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.
FLASH - Core Size
Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.
32-Bit - Program Memory Size
Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.
256KB 256K x 8 - Connectivity
In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.
CANbus, I2C, IrDA, LINbus, SPI, UART/USART - Supply Current-Max
Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.
30.3mA - Bit Size
In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.
32 - Has ADC
Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.
YES - DMA Channels
DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.
YES - Data Bus Width
The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.
32b - Number of Timers/Counters10
- Core Architecture
In electronic components, the term "Core Architecture" refers to the fundamental design and structure of the component's internal circuitry. It encompasses the arrangement of key components, such as processors, memory units, and input/output interfaces, within the device. The core architecture plays a crucial role in determining the component's performance, power efficiency, and overall capabilities. Different core architectures are optimized for specific applications and requirements, such as high-speed processing, low power consumption, or specialized functions. Understanding the core architecture of electronic components is essential for engineers and designers to select the most suitable components for their projects.
ARM - On Chip Program ROM Width
The parameter "On Chip Program ROM Width" refers to the data width of the read-only memory (ROM) implemented on a semiconductor chip. It indicates the number of bits that can be accessed simultaneously in each ROM read operation. A wider ROM width allows for faster data retrieval and processing, as more information can be transferred at once. This parameter is crucial in determining the overall performance and efficiency of electronic devices that utilize programmable ROM for storing firmware or application logic.
8 - CPU Family
CPU Family refers to a classification of microprocessors that share a common architecture and design traits. It signifies a group of processors that are typically produced by the same manufacturer and have similar functionality and features. The CPU Family can encompass various models that may differ in performance, power consumption, and specific capabilities but retain a unified core design, allowing for compatibility with software and hardware. This classification helps users and developers to understand the performance characteristics and upgrade pathways of different CPU models within the same family.
CORTEX-M0 - Number of A/D Converters1
- Number of UART Channels8
- Number of ADC Channels19
- Max Junction Temperature (Tj)
Max Junction Temperature (Tj) refers to the maximum allowable temperature at the junction of a semiconductor device, such as a transistor or integrated circuit. It is a critical parameter that influences the performance, reliability, and lifespan of the component. Exceeding this temperature can lead to thermal runaway, breakdown, or permanent damage to the device. Proper thermal management is essential to ensure the junction temperature remains within safe operating limits during device operation.
105°C - Number of PWM Channels6
- Number of I2C Channels2
- Ambient Temperature Range High
This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.
85°C - Height1.6mm
- REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
No SVHC - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant
Parts with Similar Specs
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STM32F091RCT6
64-LQFP
64
ARM
32 b
52
CAN, I2C, I2S, IrDA, LIN, SPI, USART
256 kB
3.3 V
64-LQFP
-
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54
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3.3 V
64-LQFP
64
ARM
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I2C, IrDA, LIN, SPI, UART, USART
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3.3 V
64-LQFP
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54
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3 V
64-LQFP
-
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50
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3.3 V
Datasheet PDF
- Datasheets :
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