LSM6DSOXTR: 3.6V, iNEMO, Accelerometer and Datasheet

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Published: 28 April 2022 | Last Updated: 28 April 2022

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LSM6DSOXTR

LSM6DSOXTR

STMicroelectronics

STMICROELECTRONICS - LSM6DSOXTR - Modul MEMS, seria iNEMO LSM6D, IMU, 3V do 3.6V, ±16g, LGA-14

Purchase Guide

STMICROELECTRONICS - LSM6DSOXTR - Modul MEMS, seria iNEMO LSM6D, IMU, 3V do 3.6V, ±16g, LGA-14

The LSM6DSOX is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSOX supports main OS requirements, offering real, virtual, and batch sensors with 9 kbytes for dynamic data batching. This article will introduce more details about LSM6DSOXTR, including Description, CAD model, Features, Absolute maximum ratings, Electrical characteristics, and so on.

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LSM6DSOXTR Description

The LSM6DSOX is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSOX supports main OS requirements, offering real, virtual, and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DSOX has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps. The LSM6DSOX fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer. The LSM6DSOX OIS can be configured from the Auxiliary SPI and primary interface (SPI / I²C & MIPI I3CSM). High robustness to mechanical shock makes the LSM6DSOX the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSOX is available in a plastic land grid array (LGA) package.


LSM6DSOXTR CAD Model

LSM6DSOXTR Symbol.png


LSM6DSOXTR Symbol


LSM6DSOXTR Footprint.png


LSM6DSOXTR Footprint


LSM6DSOXTR 3D Model.png


LSM6DSOXTR 3D Model


LSM6DSOXTR Features

• Power consumption: 0.55 mA in combo high-performance mode

• “Always-on" experience with low power consumption for both accelerometer and

gyroscope

• Smart FIFO up to 9 kbyte

• Android compliant

• ±2/±4/±8/±16 g full scale

• ±125/±250/±500/±1000/±2000 dps full scale

• Analog supply voltage: 1.71 V to 3.6 V

• Independent IO supply (1.62 V)

• Compact footprint: 2.5 mm x 3 mm x 0.83 mm

• SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization

• Auxiliary SPI for OIS data output for gyroscope and accelerometer

• OIS configurable from Aux SPI, primary interface (SPI / I²C & MIPI I3CSM)

• Advanced pedometer, step detector and step counter

• Significant Motion Detection, Tilt detection

• Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click

• Programmable finite state machine: accelerometer, gyroscope and external

sensors

• Machine Learning Core

• S4S data synchronization

• Embedded temperature sensor

• ECOPACK®, RoHS, and “Green” compliant


LSM6DSOXTR Absolute maximum ratings

SymbolRatingsMaximum valueUnit
VddSupply voltage-0.3 to 4.8V
TSTGStorage temperature range-40 to +125°C
SgAcceleration for 0.2 ms20,000g
ESDElectrostatic discharge protection (HBM)2kV
VinInput voltage on any control pin
(including CS, SCL/SPC, SDA/SDI/SDO, SDO/SA0)
-0.3 to Vdd_IO +0.3V


LSM6DSOXTR Electrical characteristics

SymbolParameterTest conditionsMin.Typ.(1)Max.Unit
VddSupply voltage
1.711.83.6V
Vdd_IOPower supply for I/O
1.62
3.6V
IddHPGyroscope and accelerometer current consumption in high-performance mode

0.55
mA
LA_IddHPAccelerometer current consumption in high-performance mode

170
µA
LA_IddLPAccelerometer current consumption in low-power modeODR = 50 Hz
ODR = 1.6 Hz

26
4.5

µA
LA_IddULPAccelerometer current consumption in ultra-low-power modeODR = 50 Hz
ODR = 1.6 Hz

9.5
4.4

µA
IddPDGyroscope and accelerometer current consumption during power-down

3
µA
TonTurn-on time

35
ms
VIADigital high-level input voltage
0.7 * VDD_IO

V
VILDigital low-level input voltage


0.3 * VDD_IOV
VEOHHigh-level output voltageIOH = 4 mA(2)VDD_IO
-0.2


V
VOLLow-level output voltageIOL = 4 mA(2)

0.2V
TopOperating temperature range
-40
85°C


I²C/I3C coexistence in LSM6DSOX

I²CI3C coexistence in LSM6DSOX.png

LSM6DSOXTR Block diagram of filters

LSM6DSOXTR Block diagram of filters.png

LSM6DSOX Electrical connections

LSM6DSOX Electrical connections.png

Specifications

STMicroelectronics LSM6DSOXTR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics LSM6DSOXTR.
  • Type
    Parameter
  • Factory Lead Time
    16 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    14-VFLGA Module
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Usage Level
    Industrial grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    iNEMO
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    14
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BUTT
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    compliant
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    LSM6D
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PBGA-B14
  • Output Type

    The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.

    I2C, SPI
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    3.6V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    1.71V
  • Analog IC - Other Type

    Analog IC - Other Type is a parameter used to categorize electronic components that are integrated circuits (ICs) designed for analog signal processing but do not fall into more specific subcategories such as amplifiers, comparators, or voltage regulators. These ICs may include specialized analog functions such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), voltage references, or signal conditioning circuits. They are typically used in various applications where precise analog signal processing is required, such as in audio equipment, instrumentation, communication systems, and industrial control systems. Manufacturers provide detailed specifications for these components to help engineers select the most suitable IC for their specific design requirements.

    ANALOG CIRCUIT
  • Sensor Type

    In electronic components, the parameter "Sensor Type" refers to the specific type of sensor technology used in a particular component to detect and measure physical phenomena such as light, temperature, pressure, motion, or proximity. Different sensor types utilize various principles and mechanisms to convert the detected input into an electrical signal that can be processed by the electronic component. Common sensor types include photodiodes, thermistors, accelerometers, and proximity sensors, each designed for specific applications and environments. Understanding the sensor type is crucial for selecting the right component for a given task and ensuring accurate and reliable sensing capabilities in electronic systems.

    Accelerometer, Gyroscope, 6 Axis
  • Length
    3mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    0.86mm
  • Width
    2.5mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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Datasheet PDF

Download datasheets and manufacturer documentation for STMicroelectronics LSM6DSOXTR.

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Frequently Asked Questions

1.What system-in-package features a 3D digital accelerometer and a 3D digital gyroscope?

LSM6DSOX.

2.What is a system-in-package with a 3D digital accelerometer and a 3D digital gyroscope?

0.55 mA.

3.How many kbytes does the LSM6DSOX offer for dynamic data batching?

9 kbytes.

4.What is STs family of?

MEMS sensor modules.

5.What technology allows the design of a dedicated circuit that is trimmed to match the characteristics of the sensing element?

CMOS technology.
LSM6DSOXTR

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