SN74LVC1G08DBVR: Overview, Applications and Datasheet
3.3V V 4 ns ns 4.5 ns ns 2.9mm mm Gates & Inverters 32mA mA 1.45mm mm 15.790684mg mg Surface Mount Surface Mount 1.65V~5.5V V 10μA μA









3.3V V 4 ns ns 4.5 ns ns 2.9mm mm Gates & Inverters 32mA mA 1.45mm mm 15.790684mg mg Surface Mount Surface Mount 1.65V~5.5V V 10μA μA
The VCC operating voltage range for this single 2-input positive-AND gate is 1.65 V to 5.5 V.
SN74LVC1G08DBVR Description
The VCC operating voltage range for this single 2-input positive-AND gate is 1.65 V to 5.5 V.
Positive logic or the Boolean function are executed by the SN74LVC1G08 device.
Over a wide range of VCC operating conditions, the CMOS device maintains low static power dissipation and high output drive.
There are several packages available for the SN74LVC1G08, one of which is the ultra-small DPW package, measuring 0.8 mm × 0.8 mm in body size.
SN74LVC1G08DBVR Pinout

SN74LVC1G08DBVR CAD Model
Symbol

Footprint

3D Model

SN74LVC1G08DBVR Features
Facilitates 5-V VCC Function
Acceptable Voltages for Inputs: 5.5 V
Offers VCC Down Translation
3.6 ns maximum tpd at 3.3 V
Low Power Needed, Maximum ICC of 10-µA
±24-mA Drive for Output at 3.3 V
Specifications
- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 1 day ago) - Factory Lead Time6 Weeks
- Contact Plating
Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.
Gold - Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
SC-74A, SOT-753 - Number of Pins5
- Weight15.790684mg
- Number of Elements1
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~125°C - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
74LVC - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e4 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Number of Terminations5
- Termination
Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.
SMD/SMT - ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - Packing Method
The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.
TR - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
1.65V~5.5V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Number of Functions1
- Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
3.3V - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
74LVC1G08 - Pin Count
a count of all of the component leads (or pins)
5 - Max Output Current
The maximum current that can be supplied to the load.
32mA - Power Supplies
an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?
3.3V - Output Current
The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.
32mA - Propagation Delay
the flight time of packets over the transmission link and is limited by the speed of light.
4 ns - Quiescent Current
The quiescent current is defined as the current level in the amplifier when it is producing an output of zero.
10μA - Turn On Delay Time
Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.
4.5 ns - Family
In electronic components, the parameter "Family" typically refers to a categorization or classification system used to group similar components together based on their characteristics, functions, or applications. This classification helps users easily identify and select components that meet their specific requirements. The "Family" parameter can include various subcategories such as resistors, capacitors, diodes, transistors, integrated circuits, and more. Understanding the "Family" of an electronic component can provide valuable information about its compatibility, performance specifications, and potential uses within a circuit or system. It is important to consider the "Family" parameter when designing or troubleshooting electronic circuits to ensure proper functionality and compatibility with other components.
LVC/LCX/Z - Logic Function
In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.
AND - Number of Inputs2
- Logic Type
Logic Type in electronic components refers to the classification of circuits based on the logical operations they perform. It includes types such as AND, OR, NOT, NAND, NOR, XOR, and XNOR, each defining the relationship between binary inputs and outputs. The logic type determines how the inputs affect the output state based on specific rules of Boolean algebra. This classification is crucial for designing digital circuits and systems, enabling engineers to select appropriate components for desired functionalities.
AND Gate - Max Propagation Delay @ V, Max CL
The parameter "Max Propagation Delay @ V, Max CL" in electronic components refers to the maximum amount of time it takes for a signal to propagate through the component from input to output when operating at a specific voltage (V) and driving a maximum specified load capacitance (CL). This parameter is crucial in determining the speed and performance of the component in a circuit. A shorter propagation delay indicates faster signal processing and better overall performance. Designers use this parameter to ensure that signals can be transmitted and received within the required timing constraints in their electronic systems.
4ns @ 5V, 50pF - Schmitt Trigger
A Schmitt Trigger is a type of comparator circuit commonly used in electronics to convert an analog input signal into a digital output signal. It has hysteresis, which means that the output switches at different voltage levels depending on whether the input is rising or falling. This hysteresis helps to eliminate noise and provide a more stable output signal. Schmitt Triggers are often used in applications where noise immunity and signal conditioning are important, such as in signal processing, waveform shaping, and digital logic circuits.
NO - Height1.45mm
- Length2.9mm
- Width1.6mm
- Thickness
Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.
1.2mm - REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
No SVHC - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
Parts with Similar Specs
- ImagePart NumberManufacturerPackage / CaseNumber of InputsNumber of PinsLogic FunctionPropagation DelaySupply VoltageQuiescent CurrentNumber of TerminationsView Compare
SN74LVC1G08DBVR
SC-74A, SOT-753
2
5
AND
4 ns
3.3 V
10 μA
5
SC-74A, SOT-753
2
5
AND
5.8 ns
3.3 V
1 μA
5
SC-74A, SOT-753
2
5
AND
7.9 ns
3.3 V
1 μA
5
SC-74A, SOT-753
2
5
AND
4.6 ns
3.3 V
1 μA
5
SC-74A, SOT-753
2
5
AND
4.5 ns
1.8 V
20 μA
5
SN74LVC1G08DBVR Applications
The ATCA Group
ANC, or active noise cancellation
Reader for Barcodes
Monitor for Blood Pressure
CPAP Device
Cable Fixtures
SN74LVC1G08DBVR Package

Datasheet PDF
- Datasheets :
- PCN Assembly/Origin :
What is the maximum current the SN74LVC1G08DBVR can sink/source?
The SN74LVC1G08DBVR has a maximum output current of 32 mA, which means it can either sink or source up to 32 mA of current.
Can the SN74LVC1G08DBVR handle open-drain or open-collector outputs?
No, the SN74LVC1G08DBVR is not designed to support open-drain or open-collector outputs. It has a standard push-pull output configuration, where the output can actively drive high or low logic levels.
LM319 Comparator: Datasheet, Pinout and Circuit17 November 20213536
A Comprehensive Guide to the Analog Devices Inc. 5962-8773802GA Linear Amplifier06 March 202473
XC7K160T-2FFG676I AMD/Xilinx FPGA: Detailed Specifications and Features07 April 2025397
An Overview of STM32L082xx Ultra-Low-Power 32-bit MCU29 February 2024199
6N139 Optocoupler: Pinout, Applications and Datasheet13 August 20212315
STM32F401CCU6 Microcontroller: 84MHz,48-UFQFN, Pinout and Features08 February 20228768
TPS54061DRBT, 60V, Step-Down, MOSFETs, 200mA24 February 2022240
A Comprehensive Guide to LTC6601IUF-1#PBF Active Filter Interface06 March 202485
Elon Musk: The Neuralink Brain Chip Developed By Its Company Could Help Treat Morbid Obesity24 April 20222050
What causes the Noise of Electronic Equipment when it is Running?01 August 20222226
Working Principle and Application of Infrared Sensors27 October 202515560
Semiconductor Industry Poised for $1 Trillion Growth Opportunity by 203020 November 20232322
A $39 Billion Investment Wave Expected to Boost AI and Semiconductor Stocks26 September 2023901
PMIC - Gate Drivers: A Purpose-Built Integrated Circuit22 February 20231541
Apple Will Help TSMC to Be in the Leading Position in the Next Era16 March 20221993
What is a Cell Phone Antenna?21 July 202128130
Texas Instruments
In Stock: 183360
United States
China
Canada
Japan
Russia
Germany
United Kingdom
Singapore
Italy
Hong Kong(China)
Taiwan(China)
France
Korea
Mexico
Netherlands
Malaysia
Austria
Spain
Switzerland
Poland
Thailand
Vietnam
India
United Arab Emirates
Afghanistan
Åland Islands
Albania
Algeria
American Samoa
Andorra
Angola
Anguilla
Antigua & Barbuda
Argentina
Armenia
Aruba
Australia
Azerbaijan
Bahamas
Bahrain
Bangladesh
Barbados
Belarus
Belgium
Belize
Benin
Bermuda
Bhutan
Bolivia
Bonaire, Sint Eustatius and Saba
Bosnia & Herzegovina
Botswana
Brazil
British Indian Ocean Territory
British Virgin Islands
Brunei
Bulgaria
Burkina Faso
Burundi
Cabo Verde
Cambodia
Cameroon
Cayman Islands
Central African Republic
Chad
Chile
Christmas Island
Cocos (Keeling) Islands
Colombia
Comoros
Congo
Congo (DRC)
Cook Islands
Costa Rica
Côte d’Ivoire
Croatia
Cuba
Curaçao
Cyprus
Czechia
Denmark
Djibouti
Dominica
Dominican Republic
Ecuador
Egypt
El Salvador
Equatorial Guinea
Eritrea
Estonia
Eswatini
Ethiopia
Falkland Islands
Faroe Islands
Fiji
Finland
French Guiana
French Polynesia
Gabon
Gambia
Georgia
Ghana
Gibraltar
Greece
Greenland
Grenada
Guadeloupe
Guam
Guatemala
Guernsey
Guinea
Guinea-Bissau
Guyana
Haiti
Honduras
Hungary
Iceland
Indonesia
Iran
Iraq
Ireland
Isle of Man
Israel
Jamaica
Jersey
Jordan
Kazakhstan
Kenya
Kiribati
Kosovo
Kuwait
Kyrgyzstan
Laos
Latvia
Lebanon
Lesotho
Liberia
Libya
Liechtenstein
Lithuania
Luxembourg
Macao(China)
Madagascar
Malawi
Maldives
Mali
Malta
Marshall Islands
Martinique
Mauritania
Mauritius
Mayotte
Micronesia
Moldova
Monaco
Mongolia
Montenegro
Montserrat
Morocco
Mozambique
Myanmar
Namibia
Nauru
Nepal
New Caledonia
New Zealand
Nicaragua
Niger
Nigeria
Niue
Norfolk Island
North Korea
North Macedonia
Northern Mariana Islands
Norway
Oman
Pakistan
Palau
Palestinian Authority
Panama
Papua New Guinea
Paraguay
Peru
Philippines
Pitcairn Islands
Portugal
Puerto Rico
Qatar
Réunion
Romania
Rwanda
Samoa
San Marino
São Tomé & Príncipe
Saudi Arabia
Senegal
Serbia
Seychelles
Sierra Leone
Sint Maarten
Slovakia
Slovenia
Solomon Islands
Somalia
South Africa
South Sudan
Sri Lanka
St Helena, Ascension, Tristan da Cunha
St. Barthélemy
St. Kitts & Nevis
St. Lucia
St. Martin
St. Pierre & Miquelon
St. Vincent & Grenadines
Sudan
Suriname
Svalbard & Jan Mayen
Sweden
Syria
Tajikistan
Tanzania
Timor-Leste
Togo
Tokelau
Tonga
Trinidad & Tobago
Tunisia
Turkey
Turkmenistan
Turks & Caicos Islands
Tuvalu
U.S. Outlying Islands
U.S. Virgin Islands
Uganda
Ukraine
Uruguay
Uzbekistan
Vanuatu
Vatican City
Venezuela
Wallis & Futuna
Yemen
Zambia
Zimbabwe






