STM32F401RET6 vs GD32 Microcontrollers Key Differences
512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller STM32F4 Series STM32F401 64 Pin 84MHz 3.3V 64-LQFP









512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller STM32F4 Series STM32F401 64 Pin 84MHz 3.3V 64-LQFP
Compare STM32F401RET6 and GD32 microcontrollers on performance, cost, and compatibility. Learn which suits your embedded system's needs and budget.
Product Introduction
Choosing the right microcontroller can shape the success of your embedded system project. The STM32F401RET6 stands out for its robust performance, but GD32 microcontrollers often attract developers with their cost-effectiveness. Compatibility differences also play a major role in your decision. Understanding these factors helps you select the best option for your specific needs, whether you prioritize speed, budget, or ecosystem support.
When you compare these microcontrollers, you gain insights that simplify your development process and improve your product outcomes.
Overview of STM32F401RET6
Key Specifications of STM32F401RET6
The STM32F401RET6 is a powerful microcontroller built on the ARM Cortex-M4 architecture. It operates at a maximum frequency of 84 MHz, making it suitable for demanding applications. Its memory configuration includes 256KB of flash memory and 64KB of RAM, providing ample space for code and data storage. The microcontroller supports a wide range of connectivity options, such as I2C, SPI, UART/USART, USB OTG, and more. With 50 general-purpose I/O pins, it offers flexibility for interfacing with peripherals.
Here’s a quick overview of its specifications:
| Specification | Details |
|---|---|
| Core Architecture | ARM Cortex-M4 |
| Maximum Frequency | 84 MHz |
| Flash Memory | 256KB |
| RAM | 64KB |
| Connectivity Options | I2C, IrDA, LINbus, SDIO, SPI, UART/USART, USB OTG |
| General Purpose I/O Pins | 50 |
| Package Type | 64-LQFP Package - 10mm x 10mm |
| Quality and Reliability | High quality and reliability for industrial applications |
| Application Fields | Industrial controls, medical devices, advanced consumer electronics |
Features of a High-Performance Microcontroller
The STM32F401RET6 stands out as a high-performance microcontroller due to its advanced ARM Cortex-M4 core. This core includes a floating-point unit (FPU), which enhances its ability to handle complex mathematical computations. The microcontroller achieves a CPU clock rate of 84 MHz, ensuring fast execution of instructions. Its memory configuration, with 512KB of flash memory and 96KB of SRAM, supports resource-intensive applications.
The microcontroller also excels in peripheral integration. It supports multiple communication protocols, making it versatile for various embedded systems. Its reliability and quality make it a preferred choice for industrial and medical applications.
| Metric | Value |
|---|---|
| CPU Clock Rate | 84 MHz |
| Core | ARM Cortex-M4F |
| Flash Memory | 512 KB |
| SRAM | 96 KB |
Ideal Use Cases for STM32F401RET6
The STM32F401RET6 microcontroller is ideal for applications requiring high performance and reliability. It has been successfully used in TinyML experiments, such as atmospheric pressure forecasting. In one case, it powered a system using Long Short-Term Memory (LSTM) networks to predict weather patterns. Despite its limited memory, the microcontroller achieved a Root Mean Square Error of 0.0255, showcasing its ability to handle deep learning tasks.
Other applications include industrial controls, where precision and reliability are critical. It also finds use in medical devices, where its high-quality standards ensure dependable performance. Advanced consumer electronics, such as smart home devices, benefit from its robust processing capabilities and versatile connectivity options.
The STM32F401RET6 proves its worth in scenarios where performance, reliability, and flexibility are essential.
Overview of GD32 Microcontrollers
Key Specifications of GD32 Microcontrollers
GD32 microcontrollers are known for their high performance and versatility. They are built on ARM Cortex-M cores and offer a wide range of series, including GD32A7x and GD32R501. These microcontrollers support advanced technologies like dual-core architecture and real-time control capabilities. They also comply with international safety standards such as AEC-Q100 Grade 1 and ISO26262 ASIL B, making them suitable for critical applications.
Here’s a quick look at their specifications:
| Feature/Aspect | Details |
|---|---|
| Series | GD32A7x and GD32R501 |
| Flash Memory | Up to 4MB with dual Flash bank support for OTA upgrades |
| Operating Temperature Range | -40℃ to +125℃ |
| Safety Standards | AEC-Q100 Grade1, ISO26262 ASIL B |
| Development Tools | Full support from TASKING VX-toolset for Arm |
| Applications | Automotive electronics, industrial automation, renewable energy inverters |
These specifications highlight the microcontroller's ability to handle demanding environments and applications.
Features and Strengths of GD32 Microcontrollers
GD32 microcontrollers excel in performance and efficiency. They achieve a maximum clock speed of 108 MHz, surpassing many competitors. Their flash storage speed benefits from caching, making them faster than traditional on-die flash solutions. The architecture is optimized for efficiency, ensuring smooth operation in real-time systems.
| Performance Indicator | GD32 Microcontrollers | STM32 Microcontrollers |
|---|---|---|
| Maximum Clock Speed | 108 MHz | 72 MHz |
| Flash Storage Speed | Faster due to caching | Slower on-die Flash |
| Architecture | Unique and efficient | Standard architecture |
These strengths make GD32 microcontrollers a compelling choice for developers seeking high performance at a competitive price.
Use Cases for GD32 Microcontrollers
You can use GD32 microcontrollers in a variety of fields. They are ideal for automotive electronics, where safety and reliability are critical. Industrial automation systems also benefit from their real-time control capabilities and robust design. Renewable energy inverters often rely on GD32 microcontrollers for their efficiency and ability to operate in harsh conditions.
Their compatibility with development tools like the TASKING VX-toolset enhances your development process, saving time and effort. Whether you are designing for automotive, industrial, or energy applications, GD32 microcontrollers provide the flexibility and performance you need.
Key Differences Between STM32F401RET6 and GD32 Microcontrollers
Performance Comparison Between STM32F401RET6 and GD32
When comparing the performance of STM32F401RET6 and GD32 microcontrollers, you’ll notice distinct strengths in each. The STM32F401RET6 operates at a clock speed of 84 MHz, powered by the ARM Cortex-M4 core with a floating-point unit (FPU). This makes it highly efficient for applications requiring complex mathematical computations, such as signal processing or machine learning tasks. Its 512KB of flash memory and 96KB of RAM provide ample resources for demanding applications.
On the other hand, GD32 microcontrollers, such as the GD32F103RCT6, achieve a higher clock speed of 108 MHz. This gives them an edge in raw processing power, especially for real-time control systems. GD32 microcontrollers also benefit from optimized flash storage with caching, which enhances data access speeds. However, the GD32F103RCT6 offers only 256KB of flash memory, which may limit its use in memory-intensive applications.
In terms of I/O capabilities, both microcontrollers provide robust options. The STM32F401RET6 features 50 general-purpose I/O pins, while GD32 microcontrollers offer similar flexibility. These interfaces allow you to connect a wide range of peripherals, making both options suitable for diverse embedded systems.
If your application prioritizes computational performance and memory, the STM32F401RET6 is a strong contender. For higher clock speeds and faster flash storage access, GD32 microcontrollers may be the better choice.
Cost and Value Analysis of Both Microcontrollers
Cost plays a crucial role in selecting a microcontroller, especially for budget-sensitive projects. Here’s a detailed comparison of the cost and value of STM32F401RET6 and GD32F103RCT6:
| Microcontroller | Flash Memory | RAM | Price |
|---|---|---|---|
| STM32F401RET6 | 512K | 96K | $3.80 |
| GD32F103RCT6 | 256K | N/A | $1.92 |
The STM32F401RET6 costs nearly twice as much as the GD32F103RCT6. However, it offers double the flash memory and includes 96KB of RAM, which the GD32F103RCT6 lacks. This makes the STM32F401RET6 a better choice for applications requiring more storage and processing resources. Conversely, the GD32F103RCT6 provides excellent value for cost-sensitive projects, especially when memory requirements are modest.
You should also consider the long-term economic efficiency. STM32 microcontrollers often come with extensive documentation, community support, and a mature development ecosystem. These factors can reduce development time and costs, adding to their overall value. GD32 microcontrollers, while cost-effective, may require additional effort to integrate into your workflow due to limited ecosystem support.
Compatibility and Ecosystem Differences
The compatibility and ecosystem of a microcontroller significantly impact your development experience. STM32F401RET6 benefits from STMicroelectronics’ well-established ecosystem, including the STM32CubeMX configuration tool and a wide range of middleware libraries. These tools simplify development and reduce debugging time. Additionally, the STM32F401RET6 is compatible with popular IDEs like Keil, IAR, and STM32CubeIDE, giving you flexibility in your development environment.
GD32 microcontrollers, while compatible with ARM Cortex-M development tools, lack the same level of ecosystem maturity. For example, GD32 microcontrollers rely on third-party tools like the TASKING VX-toolset for development. While these tools are effective, they may not offer the same level of integration and ease of use as STM32’s ecosystem. Furthermore, GD32 microcontrollers often face challenges with pin-to-pin compatibility when replacing STM32 microcontrollers, which can complicate hardware design.
If you value a seamless development experience and robust ecosystem support, STM32F401RET6 is the better choice. However, if you’re willing to invest extra effort in integration, GD32 microcontrollers can still deliver excellent results.
Practical Considerations for Choosing a Microcontroller
Application-Specific Recommendations
Selecting the right microcontroller depends heavily on the specific requirements of your application. Each embedded system has unique demands, and understanding these is crucial for making an informed choice. Here are some key factors to consider:
Performance Needs: For high-performance applications like signal processing or machine learning, microcontrollers with advanced cores, such as ARM Cortex-M4 or M7, are ideal. These cores often include features like floating-point units (FPU) and digital-to-analog converters (DAC), which enhance computational efficiency.
Memory Requirements: Applications with large codebases or data storage needs, such as IoT devices or smart meters, benefit from microcontrollers with higher RAM and flash memory capacities.
Interfaces and Connectivity: Industrial automation systems often require robust communication protocols like CAN, SPI, or Ethernet. Ensure the microcontroller supports the interfaces your application demands.
Environmental Conditions: For automotive or renewable energy applications, choose microcontrollers that operate reliably in extreme temperatures and comply with safety standards like ISO26262 ASIL B.
The growing adoption of embedded applications in sectors like automotive and medical highlights the importance of these considerations. For instance, the integration of TinyML with microcontrollers has enabled on-device analytics, making them indispensable for smart and connected devices.
Tip: Always evaluate the form factor and package size of the microcontroller to ensure it fits seamlessly into your hardware design.
Long-Term Support and Availability
When choosing a microcontroller, you must also consider its long-term availability and support. The global microcontroller market is expanding rapidly, with a projected CAGR of 11.0% from 2023 to 2030. This growth is driven by increasing demand from sectors like medical, automotive, and smart grid systems. However, not all microcontrollers offer the same level of longevity and ecosystem support.
Here are some critical aspects to evaluate:
Manufacturer Commitment: Opt for microcontrollers from manufacturers with a proven track record of long-term support. Companies like STMicroelectronics provide extensive documentation, software tools, and community resources, which can significantly reduce development time.
Ecosystem Maturity: A mature ecosystem simplifies development. For example, STM32 microcontrollers benefit from tools like STM32CubeMX and STM32CubeIDE, which streamline configuration and debugging.
Supply Chain Stability: Ensure the microcontroller you select has a stable supply chain. This is particularly important for industrial automation and automotive applications, where production delays can have significant consequences.
Future-Proofing: Choose microcontrollers that align with emerging trends like IoT and AI. The combination of AI and microcontrollers, such as through TinyML, enables advanced analytics directly on devices, ensuring your product remains competitive.
| Session Date | Focus Area | Description |
|---|---|---|
| July 25 | Industry Overview | Insights into the current state of microcontrollers and their applications. |
| July 26 | Selection Criteria | Examination of criteria for selecting microcontrollers. |
| July 27 | Modern Selection Process | Discussion on how software influences microcontroller selection today. |
| July 28 | Use Cases | Application examples for selecting microcontrollers in specific scenarios. |
| July 29 | Best Practices | Exploration of best practices and considerations in microcontroller selection. |
The rise of smart and connected devices has made microcontrollers essential in modern products. By considering long-term support and availability, you can ensure your embedded system remains reliable and adaptable to future needs.
Note: Always verify the microcontroller’s compliance with industry standards to avoid compatibility issues in critical applications.
When choosing between STM32F401RET6 and GD32 microcontrollers, you must weigh their strengths. STM32F401RET6 excels in performance with its advanced sram and adc capabilities. It offers robust memory and digital-to-analog converters, making it ideal for complex applications. GD32 microcontrollers, on the other hand, provide cost-effective solutions with competitive sram and memory options. Their datasheets highlight their efficiency in real-time systems.
For high-performance needs, STM32F401RET6 is the better choice. If budget constraints are a priority, GD32 microcontrollers deliver excellent value. Always consider your application’s specific requirements before deciding.
FAQ
1. Which microcontroller is better for beginners, STM32F401RET6 or GD32?
STM32F401RET6 is better for beginners. Its ecosystem includes tools like STM32CubeMX and STM32CubeIDE, which simplify development. GD32 microcontrollers require more effort to integrate due to limited documentation and ecosystem support.
2. Can GD32 microcontrollers directly replace STM32 in existing designs?
Not always. GD32 microcontrollers often face pin-to-pin compatibility issues with STM32. You may need to adjust your hardware design or firmware to ensure proper functionality.
Tip: Always check the datasheets for compatibility before making substitutions.
3. Are GD32 microcontrollers reliable for industrial applications?
Yes, GD32 microcontrollers meet international safety standards like AEC-Q100 and ISO26262 ASIL B. These certifications make them suitable for industrial and automotive applications.
4. What are the main advantages of STM32F401RET6 over GD32?
STM32F401RET6 offers better ecosystem support, higher memory capacity, and advanced features like a floating-point unit (FPU). These advantages make it ideal for complex applications like machine learning and signal processing.
5. How do I choose between STM32F401RET6 and GD32 for my project?
Focus on your project’s needs. Choose STM32F401RET6 for performance and ecosystem support. Opt for GD32 if cost is a priority and your application doesn’t require extensive memory or advanced features.
Note: Evaluate long-term support and availability when making your decision.
Specifications
- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 7 months ago) - Factory Lead Time12 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
64-LQFP - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of Pins64
- Weight342.689036mg
- Data ConvertersA/D 16x12b
- Number of I/Os50
- Watchdog TimersYes
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C TA - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
STM32F4 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Number of Terminations64
- Max Power Dissipation
The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.
313mW - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
QUAD - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
3.3V - Terminal Pitch
The center distance from one pole to the next.
0.5mm - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
84MHz - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
STM32F401 - Operating Supply Voltage
The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.
3.3V - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
I2C, I2S, IrDA, SPI, USART, USB - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
512kB - Oscillator Type
Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.
Internal - RAM Size
RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.
96K x 8 - Voltage - Supply (Vcc/Vdd)
Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.
1.7V~3.6V - uPs/uCs/Peripheral ICs Type
The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.
MICROCONTROLLER, RISC - Core Processor
The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.
ARM® Cortex®-M4 - Peripherals
In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT - Program Memory Type
Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.
FLASH - Core Size
Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.
32-Bit - Program Memory Size
Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.
512KB 512K x 8 - Connectivity
In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.
I2C, IrDA, LINbus, SDIO, SPI, UART/USART, USB OTG - Bit Size
In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.
32 - Has ADC
Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.
YES - DMA Channels
DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.
YES - Data Bus Width
The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.
32b - Number of Timers/Counters8
- Core Architecture
In electronic components, the term "Core Architecture" refers to the fundamental design and structure of the component's internal circuitry. It encompasses the arrangement of key components, such as processors, memory units, and input/output interfaces, within the device. The core architecture plays a crucial role in determining the component's performance, power efficiency, and overall capabilities. Different core architectures are optimized for specific applications and requirements, such as high-speed processing, low power consumption, or specialized functions. Understanding the core architecture of electronic components is essential for engineers and designers to select the most suitable components for their projects.
ARM - On Chip Program ROM Width
The parameter "On Chip Program ROM Width" refers to the data width of the read-only memory (ROM) implemented on a semiconductor chip. It indicates the number of bits that can be accessed simultaneously in each ROM read operation. A wider ROM width allows for faster data retrieval and processing, as more information can be transferred at once. This parameter is crucial in determining the overall performance and efficiency of electronic devices that utilize programmable ROM for storing firmware or application logic.
8 - Number of A/D Converters1
- Number of ADC Channels12
- Max Junction Temperature (Tj)
Max Junction Temperature (Tj) refers to the maximum allowable temperature at the junction of a semiconductor device, such as a transistor or integrated circuit. It is a critical parameter that influences the performance, reliability, and lifespan of the component. Exceeding this temperature can lead to thermal runaway, breakdown, or permanent damage to the device. Proper thermal management is essential to ensure the junction temperature remains within safe operating limits during device operation.
105°C - Number of PWM Channels23
- Number of I2C Channels3
- Ambient Temperature Range High
This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.
85°C - Height1.6mm
- REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
No SVHC - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
Parts with Similar Specs
- ImagePart NumberManufacturerPackage / CaseNumber of PinsCore ArchitectureData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltageView Compare
STM32F401RET6
64-LQFP
64
ARM
32 b
50
I2C, I2S, IrDA, SPI, USART, USB
512 kB
3.3 V
64-LQFP
64
ARM
32 b
47
I2C, IrDA, SPI, UART, USART
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1.2 V
64-LQFP
64
ARM
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50
I2C, I2S, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB
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3.3 V
64-LQFP
64
ARM
32 b
50
I2C, I2S, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB
512 kB
3.3 V
64-UFBGA, WLCSP
64
ARM
32 b
51
CAN, I2C, IrDA, LIN, SPI, UART, USART, USB
512 kB
3.3 V
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