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TDA8356 Power Circuit: Equivalent, Pinout, Datasheet

Sophie

Published: 18 March 2022 | Last Updated: 18 March 2022

11501

TDA8356/N6,112

TDA8356/N6,112

NXP USA Inc.

TDA8356 Specialized ICs

Purchase Guide

TDA8356 Specialized ICs

The TDA8356 is a power circuit for use in 90° and 110°colour deflection systems for field frequencies of 50 to 120 Hz. This article will unlock its pinout, datasheet, equivalent, circuit and more details about TDA8356.

TDA8356 Pinout

TDA8356 Pinout.jpg

TDA8356 Pinout

SYMBOLPINDESCRIPTION
drive(pos)1input power-stage   (positive);
    includes lI(sb) signal bias
Live(neg)2input power-stage   (negative);
    includes l(sb) signal bias
Vp3operating supply voltage
Vo(B) _4output voltage B
GND5ground
VFB6input flyback supply voltage
VO(A)7output voltage A
Vo(guard)8guard output voltage
V(t)9input feedback voltage


TDA8356 Cad Model

Symbol

TDA8356 Symbol.jpg

TDA8356 Symbol

Footprint

TDA8356 Footprint.jpg

TDA8356 Footprint

3D Model

TDA8356 3D Model.jpg

TDA8356 3D Model

TDA8356 Overview

The TDA8356  is a power circuit for use in 90  ° and 110  ° colour deflection systems for field frequencies of 50 to 120Hz. The circuit provides a DC  driven vertical deflection output circuit.  operating as a highly efficient class G system.

 


TDA8356 Feature

•Few external components 

• Highly efficient fully DC-coupled vertical output bridge circuit 

• Vertical flyback switch 

• Guard circuit 

• Protection against

 – Short-circuit of the output pins (7 and 4) 

– Short-circuit of the output pins to VP. 

• Temperature protection 

• High EMC immunity because of common-mode inputs 

• A guard signal in zoom mode.

TDA8356 Equivalent

The equivalent for TDA8356:

  • NTE7131

TDA8356 Functional Block Diagram

The following circuit shows the block diagram of TDA8356

TDA8356 Block Diagram.jpg

TDA8356 Block Diagram

TDA8356 Application Circuit

TDA8356 Application Circuit is shown below

TDA8356 Application Circuit.jpg

TDA8356 Application Circuit

TDA8356 Package

TDA8356 Package.jpg

TDA8356 Package

TDA8356 Manufacturer

NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60  years of combined experience and expertise, the company has 45,000  employees in more than 35  countries.  Freescale Semiconductor has been acquired by NXP Semiconductor.  Freescale Semiconductor   parts are now a part of the NXP family (Dec 2015)

Specifications

NXP USA Inc. TDA8356/N6,112 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. TDA8356/N6,112.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    9-SIP
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    9-PSIL
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Published
    1999
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    TDA8356
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Parts with Similar Specs

Datasheet PDF

Download datasheets and manufacturer documentation for NXP USA Inc. TDA8356/N6,112.
Frequently Asked Questions

The TDA8356 is used in what types of colour deflection systems?

90 ° and 110 ° colour deflection systems

What type of circuit does the TDA8356 provide?

DC drove vertical deflection output circuit.

What type of system does the TDA8356 operate as?

class G.
TDA8356/N6,112

NXP USA Inc.

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