1N4001 vs. 1N4148: Which one is better?
Standard Diode Rectifier Small Signal =< 200mA (Io), Any Speed 1V @ 10mA -65°C~175°C 5μA @ 75V Cut Tape (CT) DO-204AH, DO-35, Axial Through Hole









Standard Diode Rectifier Small Signal =< 200mA (Io), Any Speed 1V @ 10mA -65°C~175°C 5μA @ 75V Cut Tape (CT) DO-204AH, DO-35, Axial Through Hole
The 1N4148 is a standard silicon switching signal diode. It is one of the most popular and long-lived switching diodes because of its dependable specifications and low cost. The 1N4001 is used in AC adapters for common household appliances. This article is going to cover the differences between 1N4148 and 1N4001 from the perspective of description, dimensions, electrical characteristics, features, and more details.

Can I use 1N4148 diodes instead of a 1N4001 diode for reducing the speed of a 5V 1.8W fan?
1N4148 Description
The 1N4148 is a standard silicon switching signal diode. It is one of the most popular and long-lived switching diodes because of its dependable specifications and low cost. Its name follows the JEDEC nomenclature. The 1N4148 is useful in switching applications up to about 100 MHz with a reverse-recovery time of no more than 4 ns.
1N4001 Description
The 1N4001 is used in AC adapters for common household appliances. This JEDEC device number series is available in the DO-41 axial package. Diodes with similar ratings are available in SMA and MELF surface-mount packages (in other part number series).
Comparison of dimensions of the 1N4001 vs. 1N4148

1N4001 Dimensions

1N4148 Dimensions
Comparison of electrical characteristics of the 1N4001 vs. 1N4148
1N4001 Electrical characteristics
Operating Temperature: -65°C to +175°C
Storage Temperature: -65°C to +175°C
Maximum Thermal Resistance: 300K/W Junction To Ambient
1N4148 Electrical characteristics
Operating Temperature: -65°C to +175°C
Storage Temperature: -65°C to +175°C
Maximum Thermal Resistance: 300K/W Junction To Ambient
Comparison of features of the 1N4001 vs. 1N4148
1N4001 Features
Halogen free available upon request by adding suffix "-HF"
Low Current Leakage and Low Cost
Lead Free Finish/RoHS Compliant(Note1)("P"Suffix designates
Compliant. See ordering information)
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
1N4148 Features
High Reliability
Low Current Leakage
Metalurgically Bonded Construction
Moisture Sensitivity Level 1
Marking: Cathode band and type number
Lead Free Finish/Rohs Compliant (Note 1) ("P" Suffix designates
Compliant. See ordering information)
Comparison of maximum ratings of the 1N4001 vs. 1N4148
1N4001 Maximum ratings
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Typical Thermal Resistance: 35°C/W Junction to Case 25°C/W Junction to Lead at 0.375"
| MCC | Device Marking | Maximum Recurrent Peak Reverse Voltage | Maximum RMS | Maximum DC |
| Catalog Number | Voltage | Blocking Voltage | ||
| 1N4001 | 1N4001 | 50V | 35V | 50V |
| 1N4002 | 1N4002 | 100V | 70V | 100V |
| 1N4003 | 1N4003 | 200V | 140V | 200V |
| 1N4004 | 1N4004 | 400V | 280V | 400V |
| 1N4005 | 1N4005 | 600V | 420V | 600V |
| 1N4006 | 1N4006 | 800V | 560V | 800V |
| 1N4007 | 1N4007 | 1000V | 700V | 1000V |
1N4148 Maximum ratings
• Operating Temperature: -65°C to +175°C
• Storage Temperature: -65°C to +175°C
• Maximum Thermal Resistance: 300K/W Junction To Ambient
Specifications
- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
IN PRODUCTION (Last Updated: 1 month ago) - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Through Hole - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
DO-204AH, DO-35, Axial - Supplier Device Package
The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.
DO-35 - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Cut Tape (CT) - Published2003
- Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Obsolete - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
1N4148 - Speed
In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.
Small Signal =< 200mA (Io), Any Speed - Diode Type
In electronic components, the parameter "Diode Type" refers to the specific type or configuration of a diode, which is a semiconductor device that allows current to flow in one direction only. There are various types of diodes, each designed for specific applications and functions. Common diode types include rectifier diodes, zener diodes, light-emitting diodes (LEDs), and Schottky diodes, among others. The diode type determines the diode's characteristics, such as forward voltage drop, reverse breakdown voltage, and maximum current rating, making it crucial for selecting the right diode for a particular circuit or application. Understanding the diode type is essential for ensuring proper functionality and performance in electronic circuits.
Standard - Current - Reverse Leakage @ Vr
Current - Reverse Leakage @ Vr is a parameter that describes the amount of current that flows in the reverse direction through a diode or other semiconductor component when a reverse voltage (Vr) is applied across it. This leakage current is typically very small, but it is important to consider in electronic circuits as it can affect the overall performance and reliability of the component. The reverse leakage current is influenced by factors such as the material properties of the semiconductor, temperature, and the magnitude of the reverse voltage applied. Manufacturers provide this parameter in datasheets to help engineers and designers understand the behavior of the component in reverse bias conditions.
5μA @ 75V - Voltage - Forward (Vf) (Max) @ If
The parameter "Voltage - Forward (Vf) (Max) @ If" refers to the maximum voltage drop across a diode when it is forward-biased and conducting a specified forward current (If). It indicates the maximum potential difference the diode can withstand while allowing current to flow in the forward direction without breaking down. This value is crucial for designing circuits as it helps determine how much voltage will be lost across the diode during operation. Higher Vf values can lead to reduced efficiency in power applications, making this parameter essential for optimizing circuit performance.
1V @ 10mA - Operating Temperature - Junction
Operating Temperature - Junction refers to the maximum temperature at which the junction of an electronic component can safely operate without causing damage or performance degradation. This parameter is crucial for determining the reliability and longevity of the component, as excessive heat can lead to thermal stress and failure. Manufacturers specify the operating temperature range to ensure that the component functions within safe limits under normal operating conditions. It is important for designers and engineers to consider the operating temperature - junction when selecting and using electronic components to prevent overheating and ensure optimal performance.
-65°C~175°C - Voltage - DC Reverse (Vr) (Max)
Voltage - DC Reverse (Vr) (Max) is a parameter in electronic components that specifies the maximum reverse voltage that the component can withstand without breaking down. This parameter is crucial for components like diodes and transistors that are often subjected to reverse voltage during operation. Exceeding the maximum reverse voltage can lead to the component failing or getting damaged. Designers need to consider this parameter when selecting components to ensure the reliability and longevity of their circuits.
75V - Current - Average Rectified (Io)
The parameter "Current - Average Rectified (Io)" in electronic components refers to the average value of the rectified current flowing through the component. This parameter is important in determining the average power dissipation and thermal considerations of the component. It is typically specified in datasheets for diodes, rectifiers, and other components that handle alternating current (AC) and convert it to direct current (DC). Understanding the average rectified current helps in selecting the appropriate component for a given application to ensure reliable operation and prevent overheating.
150mA - Reverse Recovery Time
Reverse Recovery Time is a key parameter in semiconductor devices, particularly diodes and transistors. It refers to the time taken for a diode or transistor to switch from conducting in the forward direction to blocking in the reverse direction when the polarity of the voltage across the device is reversed. This parameter is crucial in applications where fast switching speeds are required, as a shorter reverse recovery time allows for quicker response times and improved efficiency. Reverse Recovery Time is typically specified in datasheets for electronic components and is an important consideration in circuit design to ensure optimal performance and reliability.
4ns - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
Non-RoHS Compliant
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