KSZ9031RNX Integrated Triple-speed Transceiver: Equivalent, Pinout and Datasheet
48 Terminations KSZ9031 Receivers 4/4 Drivers/Receivers 1 Functions
The KSZ9031RNX is a completely integrated triple-speed (10BASE-T/100BASE-TX/1000BASE-T) Ethernet physical layer transceiver solution for transmission. Furthermore, Huge range of Semiconductors, Capacitors, Resistors and IcS in stock. Welcome RFQ.
- KSZ9031RNX Pinout
- KSZ9031RNX CAD Model
- Description
- KSZ9031RNX Features
- Specifications
- KSZ9031RNX Functional Block Diagram
- KSZ9031RNX RESET CIRCUIT
- KSZ9031RNX REFERENCE CIRCUITS — LED STRAP-IN PINS
- KSZ9031RNX MAGNETIC — CONNECTION AND SELECTION
- KSZ9031RNX Equivalent
- KSZ9031RNX Application
- KSZ9031RNX Package
- KSZ9031RNX Manufacturer
- Parts with Similar Specs
- Datasheet PDF
- Trend Analysis
KSZ9031RNX Pinout

KSZ9031RNX Pinout

KSZ9031RNX Pin Assignment (TOP VIEW)
KSZ9031RNX CAD Model

Symbol

Footprint
Description
The KSZ9031RNX is a completely integrated triple-speed (10BASE-T/100BASE-TX/1000BASE-T) Ethernet physicallayer transceiver for transmission and reception of data on standard CAT-5 unshielded twisted pair (UTP) cable.
The KSZ9031RNX reduces board cost and simplifies board layout by using on-chip termination resistors for the four differential pairs and by integrating an LDO controller to drive a low-cost MOSFET to supply the 1.2V core. On the copper media interface, the KSZ9031RNX can automatically detect and correct for differential pair misplacements and polarity reversals, and correct propagation delays and re-sync timing between the four differential pairs, as specified in the IEEE 802.3 standard for 1000BASE-T operation.
The KSZ9031RNX offers diagnostic features to facilitate system bring-up and debugging in production testing and in product deployment.
KSZ9031RNX Features
• Single-Chip 10/100/1000 Mbps Ethernet Transceiver Suitable for IEEE 802.3 Applications
• RGMII Timing Supports On-Chip Delay According to RGMII Version 2.0, with Programming Options for External Delay and Making Adjustments and Corrections to TX and RX Timing Paths
• RGMII with 3.3V/2.5V/1.8V Tolerant I/Os
• Auto-Negotiation to Automatically Select the Highest Link-Up Speed (10/100/1000 Mbps) and Duplex (Half/Full)
• On-Chip Termination Resistors for the Differential Pairs
• On-Chip LDO Controller to Support Single 3.3V Supply Operation–Requires Only One External FET to Generate 1.2V for the Core
• Jumbo Frame Support up to 16 KB
• 125 MHz Reference Clock Output
• Energy Detect Power-Down Mode for Reduced Power Consumption When the Cable is Not Attached
• Wake-On-LAN (WOL) Support with Robust Custom-Packet Detection
• Programmable LED Outputs for Link, Activity, and Speed
• Baseline Wander Correction
• LinkMD TDR-Based Cable Diagnostic to Identify Faulty Copper Cabling
• Parametric NAND Tree Support to Detect Faults Between Chip I/Os and Board
• Loopback Modes for Diagnostics
• Automatic MDI/MDI-X Crossover to Detect and Correct Pair Swap at all Speeds of Operation
• Automatic Detection and Correction of Pair Swaps, Pair Skew, and Pair Polarity
• MDC/MDIO Management Interface for PHY Register Configuration
• Interrupt Pin Option
• Power-Down and Power-Saving Modes
• Operating Voltages
- Core (DVDDL, AVDDL, AVDDL_PLL): 1.2V (External FET or Regulator)
- VDD I/O (DVDDH): 3.3V, 2.5V, or 1.8V
- Transceiver (AVDDH): 3.3V or 2.5V (Commercial Temp.)
• AEC-Q100 Grade 3 (KSZ9031RNXUA/UB) and Grade 2 (KSZ9031RNXVA/VB) Qualified for Automotive Applications
• 48-pin QFN (7 mm×7 mm) Package
Specifications
- TypeParameter
- Factory Lead Time1 Weeks
- Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
48-VFQFN Exposed Pad - Usage LevelIndustrial grade
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Published1996
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Number of Terminations48
- TypeTransceiver
- Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Matte Tin (Sn) - annealed - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
1.8V 2.5V 3.3V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
QUAD - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
NO LEAD - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Number of Functions1
- Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
1.2V - Terminal Pitch
The center distance from one pole to the next.
0.5mm - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
30 - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
KSZ9031 - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
S-XQCC-N48 - Number of Channels1
- Data Rate
Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).
1 Gbps - Protocol
In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.
Ethernet - Number of Drivers/Receivers4/4
- Duplex
In the context of electronic components, "Duplex" refers to a type of communication system that allows for bidirectional data flow. It enables two devices to communicate with each other simultaneously, allowing for both sending and receiving of data at the same time. Duplex communication can be further categorized into two types: half-duplex, where data can be transmitted in both directions but not at the same time, and full-duplex, where data can be sent and received simultaneously. This parameter is crucial in networking and telecommunications systems to ensure efficient and effective data transmission between devices.
Full - Simplex/Duplex
In electronic components, the parameter "Simplex/Duplex" refers to the type of communication or data transmission mode supported by the component. Simplex communication is a one-way communication mode where data flows only in one direction, from the sender to the receiver. This means that the sender can only transmit data, and the receiver can only receive data. On the other hand, duplex communication is a two-way communication mode where data can flow in both directions, allowing for simultaneous transmission and reception of data between two devices. Understanding whether a component supports simplex or duplex communication is important for determining how data will be exchanged between devices and ensuring compatibility in a given system.
Full Duplex - Max Junction Temperature (Tj)
Max Junction Temperature (Tj) refers to the maximum allowable temperature at the junction of a semiconductor device, such as a transistor or integrated circuit. It is a critical parameter that influences the performance, reliability, and lifespan of the component. Exceeding this temperature can lead to thermal runaway, breakdown, or permanent damage to the device. Proper thermal management is essential to ensure the junction temperature remains within safe operating limits during device operation.
125°C - Ambient Temperature Range High
This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.
85°C - Height900μm
- Length7mm
- Width7mm
- RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
KSZ9031RNX Functional Block Diagram

System Block Diagram

KSZ9031RNX Block Diagram
KSZ9031RNX RESET CIRCUIT

RESET CIRCUIT WITH MIC826 VOLTAGE SUPERVISOR

RECOMMENDED RESET CIRCUIT FOR CPU OR FPGA RESET OUTPUT

RESET CIRCUIT IF TRIGGERED BY THE POWER SUPPLY
KSZ9031RNX REFERENCE CIRCUITS — LED STRAP-IN PINS

REFERENCE CIRCUITS FOR LED STRAPPING PINS
KSZ9031RNX MAGNETIC — CONNECTION AND SELECTION

TYPICAL GIGABIT MAGNETIC INTERFACE CIRCUIT

MAGNETICS SELECTION CRITERIA

COMPATIBLE SINGLE-PORT 10 or 100 or 1000 MAGNETICS

COMPATIBLE SINGLE-PORT 10 or 100 or 1000 MAGNETICS
KSZ9031RNX Equivalent
| Model number | Manufacturer | Description |
| KSZ8895RQ | Microchip Technology Inc | Ethernet Transceiver, CMOS, PQFP128, LEAD FREE, PLASTIC, QFP-128 |
| AQR107-B0-EG-Y | Marvell Technology Group Ltd | Ethernet Transceiver, CMOS, PBGA104, FCCSP-104 |
| KSZ9893RNXI | Microchip Technology Inc | Ethernet Transceiver |
| KSZ8864CNXIA-TR | Microchip Technology Inc | DATACOM, ETHERNET TRANSCEIVER, QCC64 |
| KSZ9031RNXUB-TRVAO | Microchip Technology Inc | Ethernet Transceiver |
| 88E3016-A2-NNC1C000 | Marvell Technology Group Ltd | Ethernet Transceiver, CMOS, 9 X 9 MM, ROHS COMPLIANT, QFN-64 |
| KSZ9031RNXCA-TR | Microchip Technology Inc | DATACOM, ETHERNET TRANSCEIVER, QCC48 |
| LAN9354T/ML | Microchip Technology Inc | DATACOM, ETHERNET TRANSCEIVER |
| KSZ9031RNXCA | Microchip Technology Inc | DATACOM, ETHERNET TRANSCEIVER |
| KSZ8563RNXI | Microchip Technology Inc | Ethernet Transceiver, PQCC64 |
KSZ9031RNX Application
• Laser/Network Printer
• Network Attached Storage (NAS)
• Network Server
• Gigabit LAN on Motherboard (GLOM)
• Broadband Gateway
• Gigabit SOHO/SMB Router
• IPTV
• IP Set-Top Box
• Game Console
• Triple-Play (Data, Voice, Video) Media Center
• Industrial Control
• Automotive In-Vehicle Networking
KSZ9031RNX Package

Top view

Bottom view

Side view
KSZ9031RNX Manufacturer
Microchip Technology Inc., is a leader that provides microcontroller and analog semiconductors. Microchip was headquartered in Chandler, Arizona. We are delicated to offering low-risk product development, reducing total system cost and accelerating time to market. We mainly serve for different fields of customers applications around the world. To provide prominent technical support along with reliable delivery and quality is our goal.
Parts with Similar Specs
Datasheet PDF
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Trend Analysis
What is the definition of the KSZ9031RNX?
The KSZ9031RNX is a completely integrated triple-speed Ethernet physicallayer transceiver for transmission and reception of data on standard CAT-5 unshielded twisted pair (UTP) cable.
Whether the KSZ9031RNX complies with the auto-negotiation protocol?
The KSZ9031RNX conforms to the auto-negotiation protocol, defined in Clause 28 of the IEEE 802.3 Specification. Auto-negotiation allows UTP (unshielded twisted pair) link partners to select the highest common mode of operation.
Whether the KSZ9031RNX supports the IEEE 802.3 MII management interface?
The KSZ9031RNX supports the IEEE 802.3 MII management interface, also known as the Management Data Input/Output (MDIO) interface. This interface allows upper-layer devices to monitor and control the state of the KSZ9031RNX.
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