nRF52810 Multiprotocol SoC : Datasheet, Pinout, Schematic
TxRx + MCU 2.4GHz 1.7V~3.6V I2C, UART 2Mbps 4.6mA - Receiving 4.6mA~25mA - Transmitting 32 32-VFQFN Exposed Pad
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TxRx + MCU 2.4GHz 1.7V~3.6V I2C, UART 2Mbps 4.6mA - Receiving 4.6mA~25mA - Transmitting 32 32-VFQFN Exposed Pad
The nRF52810 is the third member of the nRF52 Series SoCs. This article will unlock more details about nRF52810.

Test Board Kit nRF52810 Bluetooth 5.0 module E73-TBA ebyte 2.4GHz Tran
nRF52810 Pinout

nRF52810 Pinout
nRF52810 CAD Model
Symbol

Symbol
Footprint

Footprint
3D Model

3D Model
nRF52810 Description
The nRF52810 High-Performance Multiprotocol SoC are high-performance multiprotocol SoCs that support Bluetooth 5, ANT and 2.4GHz proprietary applications. The nRF52810 SoCs are designed with advanced features like Bluetooth 5 and an ARM Cortex-M4 CPU, making them ideal for low-cost Bluetooth low energy applications. The nRF52810 series offers a broad selection of features, memory variants and small-footprint package options.
Specifications
- TypeParameter
- Factory Lead Time20 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
32-VFQFN Exposed Pad - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Published2017
- Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
2 (1 Year) - Number of Terminations32
- TypeTxRx + MCU
- HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8542.31.00.01 - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
1.7V~3.6V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
QUAD - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
NO LEAD - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
NOT SPECIFIED - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
3V - Terminal Pitch
The center distance from one pole to the next.
0.5mm - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
2.4GHz - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
NOT SPECIFIED - Protocol
In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.
Bluetooth v5.0 - Power - Output
Power Output in electronic components refers to the amount of electrical power that a device can deliver to a load. It is typically measured in watts and indicates the effectiveness of the component in converting electrical energy into usable work or signal. Power Output can vary based on the component's design, operating conditions, and intended application, making it a critical factor in the performance of amplifiers, power supplies, and other electronic devices. Understanding the Power Output helps in selecting appropriate components for specific applications to ensure efficiency and reliability.
4dBm - RF Family/Standard
The parameter "RF Family/Standard" in electronic components refers to the specific radio frequency (RF) technology or standard that the component complies with or is designed for. RF technology encompasses a wide range of frequencies used for wireless communication, such as Wi-Fi, Bluetooth, cellular networks, and more. Different RF standards dictate the frequency bands, modulation techniques, data rates, and other specifications for communication systems. Understanding the RF family/standard of a component is crucial for ensuring compatibility and optimal performance in RF applications.
Bluetooth - Sensitivity
Sensitivity in electronic components refers to the degree to which the output of a device responds to changes in input. It indicates how effectively a component translates a specific input signal into an observable output. High sensitivity means that even small variations in input can produce significant changes in output, making the device more responsive to signals. Sensitivity is crucial in applications where precise measurements or signal detection are required.
-96dBm - Data Rate (Max)
Data Rate (Max) refers to the maximum rate at which data can be transferred or processed within an electronic component or device. It is typically measured in bits per second (bps) or megabits per second (Mbps). This parameter is important for determining the speed and efficiency of data transmission or processing in various electronic applications such as computer systems, networking devices, and memory modules. A higher data rate indicates that the component is capable of handling larger volumes of data at a faster pace, leading to improved performance and responsiveness in electronic systems. It is crucial to consider the Data Rate (Max) specification when selecting electronic components to ensure compatibility and optimal functionality for specific applications.
2Mbps - Serial Interfaces
A serial interface is a communication interface between two digital systems that transmits data as a series of voltage pulses down a wire. Essentially, the serial interface encodes the bits of a binary number by their "temporal" location on a wire rather than their "spatial" location within a set of wires.
I2C, UART - Current - Receiving
Current - Receiving refers to the amount of electrical current that an electronic component or device is capable of accepting from a power source or another component in a circuit. It indicates the maximum current that can be safely received without causing damage or malfunction. This parameter is crucial for ensuring compatibility and reliability in electronic designs, as exceeding the rated receiving current can lead to overheating or failure of the component.
4.6mA - Current - Transmitting
Current - Transmitting is a parameter used to describe the maximum amount of electrical current that an electronic component can handle while in the transmitting mode. This parameter is crucial for components such as transistors, diodes, and integrated circuits that are involved in transmitting signals or power within a circuit. Exceeding the specified current transmitting rating can lead to overheating, component failure, or even damage to the entire circuit. Designers and engineers must carefully consider this parameter when selecting components to ensure the reliability and performance of the electronic system.
4.6mA~25mA - GPIO
GPIO stands for General Purpose Input/Output. It is a type of electronic pin found on microcontrollers, microprocessors, and other integrated circuits that can be configured to either input or output digital signals. GPIO pins can be used to connect and communicate with external devices such as sensors, LEDs, motors, and more. They provide a flexible way to interact with the physical world by allowing the device to both receive and send digital signals. GPIO pins can be programmed and controlled by software to perform various functions based on the specific requirements of the electronic system.
32 - Length5mm
- Height Seated (Max)
Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.
0.95mm - Width5mm
- RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
Non-RoHS Compliant
Parts with Similar Specs
nRF52810 Features
• Bluetooth 5 ready multi-protocol radio
• Bluetooth 5 datarate support 2Mbps, 1Mbps
• Supports Bluetooth 5 Advertising Extensions
• ARM® Cortex-M4 @ 64MHz
• 192kB flash and 24kB RAM
• Software stacks available as download
• Programmable output power +4dBm to -20dBm
• -96dBm sensitivity for Bluetooth low energy (1Mbps)
• -93dBm sensitivity for Bluetooth 5 (2Mbps)
• On-air compatible with nRF52, nRF51 and nRF24 SoCs
• Supply voltage range
• Programmable Peripheral Interconnect - PPI
• Full range of interfaces SPI/2-wire/UARTE
• High speed SPI 8MHz
• Easy DMA for all digital interfaces
• 12 bit/200ksps ADC
• On-chip DC-DC buck converter
• Quadrature demodulator
• On-chip balun with 50Ω single-ended output
nRF52810 Block Diagram

nRF52810 Block Diagram
nRF52810 Application
• Network connectivity processor
• Smart RF remote controls
• PC peripherals
• Medical sensors
• Fitness sensors
• Toys
• Smart home sensors and actuators
• Logistics and tagging
• Airfuel wireless charging
nRF52810 Schematic

nrf52810 Schematic-QCAA QFN32 with internal LDO regulator setup

nrf52810 Schematic-QCAA QFN32 with DC/DC regulator setup
nRF52810 vs. Nrf52832
The main differences between the nRF52810 and the nRF52832 are the following:
NFC peripheral has been removed on the nRF52810
Flash reduced from 256kB to 192kB and RAM reduced from 32kB to 24kB
Number of SPI/TWI Master peripherals reduced from 3 to 2 ( 1 x SPI Master or Slave + 1 x TWI Master or Slave)
The number of PWM channels reduced from 12 to 4
Low Power Comparator has been removed
The number of 32-bit 16MHz Timers reduced from 5 to 3
The number of 32.768kHz RTCs reduced from 3 to 2
The number of GPIOTE channels reduced from 8 to 4
FPU (Floating Point Unit) removed.
Cache removed
nRF52810 Package

nrf52810 Package
nRF52810 Manufacturer
Nordic Semiconductor is a Norwegian company listed on the Oslo stock exchange (OSX: NOD). Our headquarters are in Trondheim, Norway. Click below for share performance, reports, stock exchange notices, investor news and events.
Datasheet PDF
- Datasheets :
- PCN Packaging :
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What is nRF52810?
The nRF52810 is the third member of the nRF52 Series SoCs. It features a powerful CPU (ARM Cortex-M4), and together with the nRF52840 and nRF52832, it completes a lineup of Nordic’s Bluetooth 5 ready devices that together offer the full spectrum of possibilities when designing Bluetooth® 5 into your products.
What difference is between nRF52810 and nRF52832?
The main differences between the nRF52810 and the nRF52832 are the following • NFC peripheral has been removed on the nRF52810 • Flash reduced from 256kB to 192kB and RAM reduced from 32kB to 24kB. • Number of SPI/TWI Master peripherals reduced from 3 to 2 ( 1 x SPI Master or Slave + 1 x TWI Master or Slave) • Number of PWM channels reduced from 12 to 4. • I2S Peripheral has been removed. • Low Power Comparator has been removed • Number of 32-bit 16MHz Timers reduced from 5 to 3 • Number of 32.768kHz RTCs reduced from 3 to 2. • The number of GPIOTE channels reduced from 8 to 4. • FPU (Floating Point Unit) removed. • Cache removed
What kind of package does the Nrf52810 have?
Its package is variants: • QFN48 package, 6 x 6 mm • QFN32 package, 5 x 5 mm • WLCSP package, 2.482 x 2.464 mm
What is nRF52 Series SoCs?
Nordic Semiconductor nRF52 Series SoCs run at 64MHz with a 215 EEMBC Coremark® score, 90 Coremark®/mA, 39µA/MHz (flash) and 30µA/MHz (RAM). The nRF52 Series are built for speed to carry out increasingly complex tasks in the shortest possible time and return to sleep, conserving precious battery power. They have a Cortex-M4F processor and are the most capable Bluetooth Smart SoCs on the market.
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