TPS2H160BQPWPRQ1 High-Side Switch: Layout, Pinout, and Datasheet

The TPS2H160BQPWPRQ1  is a smart high-side switch with a built-in charge pump and dual-channel NMOS power   FETs . The load may be intelligently controlled thanks to full diagnostics and high-accuracy current-sense features. The configurable current-limit mechanism considerably improves the system's overall reliability. The open-drain digital output (version A) and the current-sense analog output (version B) have different diagnostic reporting (version B).

The gadget uses an open-drain structure to implement the digital fault report in version A. The device pulls STx down to GND when a failure occurs. To match the microcontroller supply level, a 3.3- or 5-V external pullup is necessary. Each channel's digital status can be reported individually or collectively by connecting the STx pins together.

For version B, high-accuracy current sense improves diagnostic accuracy without requiring further calibration. 1 / K(CS) of the load current can be provided by a single integrated current mirror. The mirrored current enters the CS-pin resistor and transforms into a voltage signal. K(CS) is a constant value that remains constant regardless of temperature or supply voltage. A large linear range of 0 to 4 V provides for more accurate real-time load-current monitoring. With VCS pullup voltage, the CS pin can also notify a fault (H).

Applications can set the current-limit value using the external high-accuracy current limit. When there is an overcurrent, the device increases system reliability by effectively clamping the inrush current. By lowering the size of PCB traces and connectors, as well as the capacity of the previous power stage, the device can reduce system costs. In addition, the device has an inbuilt current restriction with a preset setting.

To protect itself from inductive loads (relays, solenoids, and valves), the gadget uses an active clamp between drain and source. On the high-side switch, both the energy of the power supply and the load is dissipated during the inductive switching-off cycle. When the clamp is active, the device also optimizes the switching-off slew rate, which aids system design by reducing the effects of transient power and EMI.

The TPS2H160BQPWPRQ1 is a smart high-side switch for low-wattage bulbs, LEDs, relays, solenoids, heaters, and sub-modules, among other resistive, inductive, and capacitive loads.

The following figure is TPS2H160BQPWPRQ1 Pinout.

Pinout

The following figures are TPS2H160BQPWPRQ1 Symbol, Footprint and 3D Model.

Symbol

Footprint

3D Model

• Qualified for Automotive Applications

• AEC-Q100 Qualified With the Following Results:

– Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range 

– Device HBM ESD Classification Level H2

– Device CDM ESD Classification Level C4B

• Functional safety capable

– Documentation available to aid functional safety system design 

• Dual-Channel 160-mΩ Smart High-Side Switch With Full Diagnostics

– Version A: Open-Drain Status Output 

– Version B: Current-Sense Analog Output

• Wide Operating Voltage 3.4 to 40 V

• Ultralow Standby Current, < 500 nA

• High-Accuracy Current Sense:

– ±17% Under >25-mA Load

• Adjustable Current Limit With External Resistor ±15% Under >500-mA Load

• Protection:

– Short-to-GND Protection by Current Limit (Internal or External)

– Thermal Shutdown With Latch-Off Option and Thermal Swing

– Inductive Load Negative Voltage Clamp With Optimized Slew Rate

– Loss of GND and Loss of Battery Protection 

• Diagnostic:

–  Overcurrent  and Short to Ground Detection

– Open-Load and Short-to-Battery Detection

– Global Fault for Fast Interrupt

• 16-Pin Thermally-Enhanced PWP Package

The TPS2H160BQPWPRQ1 Functional Block Diagram is shown as follows.

Functional Block Diagram

The following figure shows an example of the external circuitry connections based on the version-B device.

Typical Application Schematic

Typical Application Diagram

• VVS range from 9 V to 16 V

• Load range is from 0.1 A to 1 A for each channel

• Current sense for fault monitoring

• Expected current-limit value of 2.5 A

• Automatic recovery mode when thermal shutdown occurs

• Full diagnostics with 5-V MCU

• Reverse-voltage protection with a blocking diode in the power-supply line

TJ must be less than 150°C to avoid thermal shutdown. The thermal impedance of the HTSSOP package is excellent. The  PCB  layout, on the other hand, is critical. A good PCB design can improve heat transfer, which is critical for the device's long-term durability.

• Maximize the copper coverage on the PCB to increase the thermal conductivity of the board. The major heat flow path from the package to the ambient is through the copper on the PCB. Maximum copper is extremely important when there are not any heat sinks attached to the PCB on the other side of the package.

• Add as many thermal vias as possible directly under the package ground pad to optimize the thermal conductivity of the board.

• All thermal vias should either be plated shut or plugged and capped on both sides of the board to prevent solder voids,  To ensure reliability and performance, the solder coverage should be at least 85%.

Without a GND Network

Without a GND network, tie the thermal pad directly to the board GND copper for better thermal performance.

Layout Example Without a GND Network

With a GND Network

With a GND network, tie the thermal pad as one trace to the board GND copper.

Layout Example With a GND Network

• Dual-Channel LED Drivers, Bulb Drivers

• Dual-Channel High-Side Switches for SubModules

• Dual-Channel High-Side Relay, Solenoid Drivers

The TPS2H160BQPWPRQ1 Package is shown as follows.

Package

Texas Instruments Incorporated (TI) is an American technology corporation based in Dallas, Texas, that creates and manufactures semiconductors and integrated circuits for electronic designers and manufacturers around the world. Based on sales volume, it is one among the top ten semiconductor businesses in the world. Analog chips and embedded processors, which account for more than 80% of the company's revenue, are the company's main focus.