CC2640R2FRGZR:Wireless Microcontroller, Bluetooth® 5.1 Low Energy, CC2640R2F VS. CC2640R2L
TxRx + MCU 2.4GHz 1.8V~3.8V I2C, I2S, SPI, UART 2Mbps 5.9mA - Receiving 9.1mA - Transmitting GFSK 128kB Flash 20kB RAM 31 48-VFQFN Exposed Pad









TxRx + MCU 2.4GHz 1.8V~3.8V I2C, I2S, SPI, UART 2Mbps 5.9mA - Receiving 9.1mA - Transmitting GFSK 128kB Flash 20kB RAM 31 48-VFQFN Exposed Pad
The CC2640R2FRGZR is a 2.4 GHz wireless microcontroller (MCU) that supports Bluetooth® 5.1 Low Energy as well as proprietary 2.4 GHz applications. The article followed will show the basic information about the microcontroller.

Texas Instruments CC2640R2F/CC2640R2F-Q1 - Featured Product Spotlight
- CC2640R2FRGZR Description
- CC2640R2FRGZR Pinout
- CC2640R2FRGZR CAD Model
- CC2640R2FRGZR Features
- CC2640R2FRGZR Functional Block Diagram
- CC2640R2FRGZR Recommended Operating Conditions
- CC2640R2FRGZR Advantages
- CC2640R2FRGZR Equivalents
- Specifications
- CC2640R2FRGZR Applications
- CC2640R2F VS. CC2640R2L
- CC2640R2FRGZR Package
- CC2640R2FRGZR Manufacturer
- Trend Analysis
- Datasheet PDF
CC2640R2FRGZR Description
The CC2640R2FRGZR is a 2.4 GHz wireless microcontroller (MCU) that supports Bluetooth® 5.1 Low Energy as well as proprietary 2.4 GHz applications. The gadget is designed for low-power wireless communication and enhanced sensing in building security systems, HVAC, asset tracking, and medical industries, as well as applications requiring industrial performance.
CC2640R2FRGZR Pinout

CC2640R2FRGZR CAD Model
Symbol

Footprint

3D Model

CC2640R2FRGZR Features
• Microcontroller
– Powerful Arm® Cortex®-M3
– EEMBC CoreMark® score: 142
– Up to 48-MHz clock speed
– 275KB of nonvolatile memory including 128KB
of in-system Programmable Flash
– Up to 28KB of system SRAM, of which 20KB is
ultra-low leakage SRAM
– 8KB of SRAM for cache or system RAM use
– 2-Pin cJTAG and JTAG debugging
– Supports over-the-air upgrade (OTA)
• Ultra-low power sensor controller
– Can run autonomous from the rest of the
system
– 16-bit architecture
– 2KB of ultra-low leakage SRAM for code and
data
• Efficient code size architecture, placing drivers,
TI-RTOS, and Bluetooth® software in ROM to
make more Flash available for the application
• RoHS-compliant packages
– 2.7-mm × 2.7-mm YFV DSBGA34 (14 GPIOs)
– 4-mm × 4-mm RSM VQFN32 (10 GPIOs)
– 5-mm × 5-mm RHB VQFN32 (15 GPIOs)
– 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
• Peripherals
– All digital peripheral pins can be routed to any
GPIO
– Four general-purpose timer modules
(eight 16-bit or four 32-bit timers, PWM each)
– 12-bit ADC, 200-ksamples/s, 8-channel analog
MUX
– Continuous time comparator
– Ultra-low power analog comparator
– Programmable current source
– UART, I2C, and I2S
– 2× SSI (SPI, MICROWIRE, TI)
– Real-Time Clock (RTC)
– AES-128 security module
– True Random Number Generator (TRNG)
– Support for eight capacitive-sensing buttons
– Integrated temperature sensor
• External system
– On-chip internal DC/DC converter
– Seamless integration with CC2590 and
CC2592 range extenders
– Very few external components
– Pin compatible with the SimpleLink™ CC2640
and CC2650 devices in all VQFN packages
– Pin compatible with the SimpleLink™ CC2642R
and CC2652R devices in 7-mm x 7-mm VQFN
packages
– Pin compatible with the SimpleLink™ CC1350
device in 4-mm × 4-mm and 5-mm × 5-mm
VQFN packages
• Low power
– Wide supply voltage range
• Normal operation: 1.8 to 3.8 V
• External regulator mode: 1.7 to 1.95 V
– Active-Mode RX: 5.9 mA
– Active-Mode TX at 0 dBm: 6.1 mA
– Active-Mode TX at +5 dBm: 9.1 mA
– Active-Mode MCU: 61 µA/MHz
– Active-Mode MCU: 48.5 CoreMark/mA
– Active-Mode sensor controller:
0.4mA + 8.2 µA/MHz
– Standby: 1.1 µA (RTC running and RAM/CPU
retention)
– Shutdown: 100 nA (wake up on external
events)
• RF section
– 2.4-GHz RF transceiver compatible with
Bluetooth® Low Energy 5.1 and earlier LE
specifications
– Excellent receiver sensitivity (–97 dBm for
BLE), selectivity, and blocking performance
– Link budget of 102 dB for BLE
– Programmable output power up to +5 dBm
– Single-ended or differential RF interface
– Suitable for systems targeting compliance with
worldwide radio frequency regulations
• ETSI EN 300 328 (Europe)
• EN 300 440 Class 2 (Europe)
• FCC CFR47 Part 15 (US)
• ARIB STD-T66 (Japan)
• Development Tools and Software
– Full-feature development kits
– Multiple reference designs
– SmartRF™ Studio
– Sensor Controller Studio
– IAR Embedded Workbench® for Arm®
– Code Composer Studio™ Integrated
Development Environment (IDE)
– Code Composer Studio™ Cloud IDE
CC2640R2FRGZR Functional Block Diagram

CC2640R2FRGZR Recommended Operating Conditions
| MIN | MAX | UNIT | |||
| Ambient temperature | -40 | 85 | °C | ||
| Operating supply voltage (VDDS and VDDR). external regulator mode | For operation in 1.8-V systems (VDDS and VDDR pins connected on PCB. internal DC/DC cannot be used) | 1.7 | 1.95 | V | |
| Operating supply voltage VDDS | 1.8 | 3.8 | V | ||
| Operating supply voltages VDDS2 and VDDS3 | For operation in battery-powered and 3.3-V systems (internal DC/DC can be used to minimize power consumption) | VDDS v 2.7 V | 1.8 | 3.8 | V |
| Operating supply voltages VDDS2 and VDDS3 | VDDS 2 2.7 V | 1.9 | 3.8 | V | |
CC2640R2FRGZR Advantages
• Support for Bluetooth ® 5.1 technologies such as LE Coded PHYs (Long Range), LE 2-Mbit PHY (High Speed), Advertising Extensions, Multiple Advertisement Sets, as well as backwards compatibility and support for important Bluetooth ® 5.0 and older Low Energy requirements.
• The SimpleLinkTM CC2640R2F Software Development Kit (SDK) includes a fully approved Bluetooth ® 5.1 software protocol stack for developing applications on the powerful Arm® Cortex®-M3 processor.
• Wireless applications with a lower standby current of 1.1 A and full RAM retention have a longer battery life.
• Advanced sensing using a configurable, self-contained ultra-low power Sensor Controller CPU with quick wakeup capability. The sensor controller, for example, is capable of 1-Hz ADC sampling at 1 A system current.
• Dedicated software-controlled radio controller (Arm® Cortex®-M0) with low-power RF transceiver capability to support numerous physical layers and RF standards, such as real-time localization (RTLS) technologies.
• Bluetooth ® Low Energy has excellent radio sensitivity and robustness (selectivity and blocking) performance (-103 dBm for 125-kbps LE Coded PHY).
CC2640R2FRGZR Equivalents
| Part Number | Description | Manufacturer |
| CC2640R2FRSMTTELECOMMUNICATION CIRCUITS | SimpleLink™ 32-bit Arm® Cortex®-M3 Bluetooth® 5.1 Low Energy wireless MCU with 128-kB flash 32-VQFN -40 to 85 | Texas Instruments |
| XCC2640R2FTWRGZTQ1TELECOMMUNICATION CIRCUITS | Automotive Qualified SimpleLink™ Bluetooth® low energy Wireless MCU 48-VQFN -40 to 105 | Texas Instruments |
| CC2640R2FTWRGZRQ1TELECOMMUNICATION CIRCUITS | SimpleLink™ automotive qualified 32-bit Arm Cortex-M3 Bluetooth® Low Energy wireless MCU 48-VQFN -40 to 105 | Texas Instruments |
| CC2640R2FRHBTTELECOMMUNICATION CIRCUITS | SimpleLink™ 32-bit Arm® Cortex®-M3 Bluetooth® 5.1 Low Energy wireless MCU with 128-kB flash 32-VQFN -40 to 85 | Texas Instruments |
| CC2640R2FTWRGZQ1TELECOMMUNICATION CIRCUITS | Telecom Circuit | Texas Instruments |
| CC2640R2FYFVTTELECOMMUNICATION CIRCUITS | SimpleLink™ 32-bit Arm® Cortex®-M3 Bluetooth® 5.1 Low Energy wireless MCU with 128-kB flash 34-DSBGA -40 to 85 | Texas Instruments |
Specifications
- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 3 days ago) - Factory Lead Time6 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
48-VFQFN Exposed Pad - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of Pins48
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
SimpleLink™ - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e4 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Number of Terminations48
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
5A992C - TypeTxRx + MCU
- Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
1.8V~3.8V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
QUAD - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
NO LEAD - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Number of Functions1
- Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
3V - Terminal Pitch
The center distance from one pole to the next.
0.5mm - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
2.4GHz - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
NOT SPECIFIED - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
CC2640 - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
I2C, I2S, SPI, UART - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
128kB Flash 20kB RAM - Nominal Supply Current
Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.
1.45mA - Protocol
In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.
Bluetooth v5.0 - Power - Output
Power Output in electronic components refers to the amount of electrical power that a device can deliver to a load. It is typically measured in watts and indicates the effectiveness of the component in converting electrical energy into usable work or signal. Power Output can vary based on the component's design, operating conditions, and intended application, making it a critical factor in the performance of amplifiers, power supplies, and other electronic devices. Understanding the Power Output helps in selecting appropriate components for specific applications to ensure efficiency and reliability.
5dBm - RF Family/Standard
The parameter "RF Family/Standard" in electronic components refers to the specific radio frequency (RF) technology or standard that the component complies with or is designed for. RF technology encompasses a wide range of frequencies used for wireless communication, such as Wi-Fi, Bluetooth, cellular networks, and more. Different RF standards dictate the frequency bands, modulation techniques, data rates, and other specifications for communication systems. Understanding the RF family/standard of a component is crucial for ensuring compatibility and optimal performance in RF applications.
Bluetooth - Sensitivity
Sensitivity in electronic components refers to the degree to which the output of a device responds to changes in input. It indicates how effectively a component translates a specific input signal into an observable output. High sensitivity means that even small variations in input can produce significant changes in output, making the device more responsive to signals. Sensitivity is crucial in applications where precise measurements or signal detection are required.
-97dBm - Data Rate (Max)
Data Rate (Max) refers to the maximum rate at which data can be transferred or processed within an electronic component or device. It is typically measured in bits per second (bps) or megabits per second (Mbps). This parameter is important for determining the speed and efficiency of data transmission or processing in various electronic applications such as computer systems, networking devices, and memory modules. A higher data rate indicates that the component is capable of handling larger volumes of data at a faster pace, leading to improved performance and responsiveness in electronic systems. It is crucial to consider the Data Rate (Max) specification when selecting electronic components to ensure compatibility and optimal functionality for specific applications.
2Mbps - Number of ADC Channels8
- Serial Interfaces
A serial interface is a communication interface between two digital systems that transmits data as a series of voltage pulses down a wire. Essentially, the serial interface encodes the bits of a binary number by their "temporal" location on a wire rather than their "spatial" location within a set of wires.
I2C, I2S, SPI, UART - Current - Receiving
Current - Receiving refers to the amount of electrical current that an electronic component or device is capable of accepting from a power source or another component in a circuit. It indicates the maximum current that can be safely received without causing damage or malfunction. This parameter is crucial for ensuring compatibility and reliability in electronic designs, as exceeding the rated receiving current can lead to overheating or failure of the component.
5.9mA - Current - Transmitting
Current - Transmitting is a parameter used to describe the maximum amount of electrical current that an electronic component can handle while in the transmitting mode. This parameter is crucial for components such as transistors, diodes, and integrated circuits that are involved in transmitting signals or power within a circuit. Exceeding the specified current transmitting rating can lead to overheating, component failure, or even damage to the entire circuit. Designers and engineers must carefully consider this parameter when selecting components to ensure the reliability and performance of the electronic system.
9.1mA - Modulation
In electronic components, modulation refers to the process of varying one or more properties of a periodic waveform, known as the carrier signal, in order to encode information. This modulation technique is commonly used in communication systems to transmit data efficiently over long distances. By modulating the carrier signal, information such as audio, video, or data can be embedded onto the signal for transmission and then demodulated at the receiving end to retrieve the original information. There are various types of modulation techniques, including amplitude modulation (AM), frequency modulation (FM), and phase modulation (PM), each with its own advantages and applications in different communication systems.
GFSK - Ambient Temperature Range High
This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.
85°C - GPIO
GPIO stands for General Purpose Input/Output. It is a type of electronic pin found on microcontrollers, microprocessors, and other integrated circuits that can be configured to either input or output digital signals. GPIO pins can be used to connect and communicate with external devices such as sensors, LEDs, motors, and more. They provide a flexible way to interact with the physical world by allowing the device to both receive and send digital signals. GPIO pins can be programmed and controlled by software to perform various functions based on the specific requirements of the electronic system.
31 - Height1mm
- Length7mm
- Width7mm
- Thickness
Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.
900μm - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant
CC2640R2FRGZR Applications
• Home and Building Automation
– Connected appliances
– Lighting
– Smart locks
– Gateways
– Security Systems
• Industrial
– Factory automation
– Asset tracking and management
– HMI
– Access control
• Electronic Point Of Sale (EPOS)
– Electronic Shelf Label (ESL)
• Health and Medical
– Electronic thermometers
– SpO2
– Blood glucose monitors and blood pressure monitors
– Weigh scales
– Hearing aids
• Sports and Fitness
– Wearable fitness and activity monitors
– Smart trackers
– Patient monitors
– Fitness machines
• HID
– Gaming
– Pointing devices (wireless keyboard and mouse)
CC2640R2F VS. CC2640R2L
The two microcontrollers both use a single-cor software development kit (SDK). They are low-power wireless microcontrollers, and can transmit and receive radio frequency signals at a greater distance.
The two devices have lots in common, but they are different in some aspects. For instance, CC2640R2F supports BLE 5.0 protocol, while CC2640R2L supports BLE 5.1 protocol. CC2640R2L doesn’t have a sensor controller engine, which makes it cheaper than CC2640R2F but more suitable in the basic transparent transmission application. From that, we can say that CC2640R2L is a lower-cost version of CC2640R2F.
CC2640R2FRGZR Package

CC2640R2FRGZR Manufacturer
Texas Instruments Incorporated (TI) is an American technology company based in Dallas, Texas, that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globally. It is one of the top 10 semiconductor companies worldwide based on sales volume. The company's focus is on developing analog chips and embedded processors, which account for more than 80% of its revenue. TI also produces TI digital light processing technology and education technology products including calculators, micro-controllers, and multi-core processors. The company boasts 45,000 patents around the globe as of 2016.
Trend Analysis
Parts with Similar Specs
Datasheet PDF
- Datasheets :
- PCN Assembly/Origin :
- PCN Design/Specification :
What is CC2640R2FRGZR ?
The CC2640R2FRGZR is a 2.4 GHz wireless microcontroller (MCU) that supports Bluetooth® 5.1 Low Energy as well as proprietary 2.4 GHz applications. The gadget is designed for low-power wireless communication and enhanced sensing in building security systems, HVAC, asset tracking, and medical industries, as well as applications requiring industrial performance.
What is the recommended operating temperature of the component?
-40°C~85°C.
What is the package of the device?
48-VFQFN Exposed Pad.
What is the component’s number of terminations?
48.
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