SN74LVC1G17DCKR Single Schmitt-Trigger Buffer: Schematic, Pinout, and Datasheet

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Published: 22 March 2022 | Last Updated: 22 March 2022

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SN74LVC1G17DCKR

SN74LVC1G17DCKR

Texas Instruments

DUAL Buffer, Non-Inverting 1.65V~5.5V Push-Pull Buffers 74LVC Series 74LVC1G17 5 Pins 5-TSSOP, SC-70-5, SOT-353

Purchase Guide

DUAL Buffer, Non-Inverting 1.65V~5.5V Push-Pull Buffers 74LVC Series 74LVC1G17 5 Pins 5-TSSOP, SC-70-5, SOT-353

This single Schmitt-trigger buffer is meant to operate between 1.65 and 5.5 V VCC. The SN74LVC1G17 is a single-buffer device that performs the Boolean operation Y = A. This article mainly introduces Schematic, Pinout, Datasheet and other detailed information about Texas Instruments SN74LVC1G17DCKR.

This video will show you what is Schmitt Trigger and how it works.

What Is Schmitt Trigger and How It Works

SN74LVC1G17DCKR Description

This single Schmitt-trigger buffer is meant to operate between 1.65 and 5.5 V VCC.

The SN74LVC1G17DCKR is a single-buffer device that performs the Boolean operation Y = A.

Over a wide Vcc operating range, the CMOS device has a high output drive while maintaining low static power dissipation.

The SN74LVC1G17DCKR comes in a variety of packages, including the ultra-compact DPW packaging, which has a body size of 0.8 mm.

The device works as a standalone buffer, but due to Schmitt action, it has differing input threshold values for positive (VT+) and negative (VT-) signals.

The DPW package technology is a significant advancement in IC packaging. Its compact 0.64 mm square footprint saves a lot of room on the board compared to other package options while keeping the typical 0.5 mm lead pitch.

This device is completely qualified for Ioff-based partial-power-down applications. When the device is turned off, the Ioff circuitry disables the outputs, preventing dangerous current backflow through the device.


SN74LVC1G17DCKR Pinout

The following figure is SN74LVC1G17DCKR Pinout.

pinout.jpg

Pinout

Pin NumberPin NameDescription
1NCNot connected
2AInput
3GNDGround
4YOutput
5VCCPower terminal


SN74LVC1G17DCKR CAD Model

The folllowings show SN74LVC1G17DCKR Symbol, Footprint and 3D Model.

symbol.png

Symbol

footprint.png

Footprint

3d model.jpg

3D Model


SN74LVC1G17DCKR Features

• Available in Ultra Small 0.64-mm2 

Package (DPW) With 0.5-mm Pitch

• Supports 5-V VCC Operation

• Inputs Accept Voltages to 5.5 V

• Max tpd of 4.6 ns at 3.3 V

• Low Power Consumption, 10-μA Max ICC

• ±24-mA Output Drive at 3.3 V

• Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection

• Latch-Up  Performance Exceeds 100 mA Per JESD 78, Class II

• ESD Protection Exceeds JESD 22

– 2000-V  Human-Body Model  (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V  Charged-Device Model  (C101)


Specifications

Texas Instruments SN74LVC1G17DCKR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments SN74LVC1G17DCKR.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 3 days ago)
  • Factory Lead Time
    6 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Gold
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    5-TSSOP, SC-70-5, SOT-353
  • Number of Pins
    5
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~125°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape (CT)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    74LVC
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    5
  • Termination

    Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

    SMD/SMT
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Packing Method

    The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

    TR
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.65V~5.5V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3.3V
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    74LVC1G17
  • Pin Count

    a count of all of the component leads (or pins)

    5
  • Output Type

    The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.

    Push-Pull
  • Polarity

    In electronic components, polarity refers to the orientation or direction in which the component must be connected in a circuit to function properly. Components such as diodes, capacitors, and LEDs have polarity markings to indicate which terminal should be connected to the positive or negative side of the circuit. Connecting a component with incorrect polarity can lead to malfunction or damage. It is important to pay attention to polarity markings and follow the manufacturer's instructions to ensure proper operation of electronic components.

    Non-Inverting
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    3.3V
  • Number of Channels
    1
  • Nominal Supply Current

    Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.

    500nA
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    11 ns
  • Quiescent Current

    The quiescent current is defined as the current level in the amplifier when it is producing an output of zero.

    1.5μA
  • Input Type

    Input type in electronic components refers to the classification of the signal or data that a component can accept for processing or conversion. It indicates whether the input is analog, digital, or a specific format such as TTL or CMOS. Understanding input type is crucial for ensuring compatibility between different electronic devices and circuits, as it determines how signals are interpreted and interacted with.

    Schmitt Trigger
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    11 ns
  • Family

    In electronic components, the parameter "Family" typically refers to a categorization or classification system used to group similar components together based on their characteristics, functions, or applications. This classification helps users easily identify and select components that meet their specific requirements. The "Family" parameter can include various subcategories such as resistors, capacitors, diodes, transistors, integrated circuits, and more. Understanding the "Family" of an electronic component can provide valuable information about its compatibility, performance specifications, and potential uses within a circuit or system. It is important to consider the "Family" parameter when designing or troubleshooting electronic circuits to ensure proper functionality and compatibility with other components.

    LVC/LCX/Z
  • Logic Function

    In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.

    Buffer, Schmitt Trigger
  • Number of Inputs
    1
  • Logic Type

    Logic Type in electronic components refers to the classification of circuits based on the logical operations they perform. It includes types such as AND, OR, NOT, NAND, NOR, XOR, and XNOR, each defining the relationship between binary inputs and outputs. The logic type determines how the inputs affect the output state based on specific rules of Boolean algebra. This classification is crucial for designing digital circuits and systems, enabling engineers to select appropriate components for desired functionalities.

    Buffer, Non-Inverting
  • Max I(ol)

    Max I(ol) refers to the maximum output current that a specific electronic component, such as a transistor or integrated circuit, can sink or source. This parameter is crucial in determining the capability of the component to drive external loads without being damaged. It is typically specified in the component's datasheet and is important for ensuring proper operation and reliability of the circuit in which the component is used. Designers must ensure that the output current requirements of the circuit do not exceed the specified "Max I(ol)" value to prevent overloading and potential failure of the component.

    0.024 A
  • Schmitt Trigger

    A Schmitt Trigger is a type of comparator circuit commonly used in electronics to convert an analog input signal into a digital output signal. It has hysteresis, which means that the output switches at different voltage levels depending on whether the input is rising or falling. This hysteresis helps to eliminate noise and provide a more stable output signal. Schmitt Triggers are often used in applications where noise immunity and signal conditioning are important, such as in signal processing, waveform shaping, and digital logic circuits.

    YES
  • Ambient Temperature Range High

    This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.

    125°C
  • Height
    1.1mm
  • Length
    2mm
  • Width
    1.25mm
  • Thickness

    Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

    900μm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Parts with Similar Specs

The three parts on the right have similar specifications to Texas Instruments & SN74LVC1G17DCKR.

SN74LVC1G17DCKR Functional Block Diagram

The following shows SN74LVC1G17DCKR Functional Block Diagram.

Functional Block Diagram.png

Functional Block Diagram


SN74LVC1G17DCKR Simplified Schematic

The SN74LVC1G17DCKR Simplified Schematic is shown as follows.

Simplified Schematic.png

Simplified Schematic


SN74LVC1G17DCKR Typical Application

This device features a balanced output drive and is based on CMOS technology.

Typical Application.png

Typical Application

Bus congestion should be avoided at all costs because it can cause currents to exceed permissible limits. To avoid ringing, the high drive will cause quick edges into mild loads, hence routing and load circumstances should be considered.


SN74LVC1G17DCKR Layout

Inputs should never float when using multiple-bit logic devices. When just two inputs of a triple-input AND gate are used, or only three of the four buffer gates are used, many functions or parts of the functions of digital logic devices are unused. The undefined voltages at the outside connections result in undefined operating states, hence such input terminals should not be left disconnected. The rules that must be followed in all instances are listed below. To prevent floating, all unused inputs of digital logic devices must be connected to a high or low bias. The logic level that should be applied to any given unused input is determined by the device's function. They'll usually be connected to GND or Vcc, depending on which makes more sense or is more convenient.

layout.png

Layout


SN74LVC1G17DCKR Alternatives

Part NumberDescriptionManufacturer
74LVC1G17SE-7LOGICBuffer, LVC/LCX/Z Series, 1-Func, 1-Input, CMOS, PDSO5, SOT-353, 5 PINDiodes Incorporated
TC7SZ17FULOGICIC LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5, 0.65 MM PITCH, PLASTIC, SSOP-5, GateToshiba America Electronic Components
74LVC1G17GWLOGICBuffer, CMOS, PDSO5Philips Semiconductors
SN74LVC1G17DCK3LOGICSingle 1.65-V to 5.5-V buffer with Schmitt-Trigger inputs 5-SC70 -40 to 85Texas Instruments


SN74LVC1G17DCKR Applications

• AV Receiver

• Audio Dock: Portable

• Blu-ray Player and Home Theater

• MP3 Player/Recorder

• Personal Digital Assistant (PDA)

• Power: Telecom/Server AC/DC Supply: Single Controller: Analog and Digital

•  Solid State Drive  (SSD): Client and Enterprise

• TV: LCD/Digital and  High-Definition  (HDTV)

• Tablet: Enterprise

• Video Analytics: Server

• Wireless Headset, Keyboard, and Mouse


SN74LVC1G17DCKR Package

The following figure is SN74LVC1G17DCKR Package.

package.png

Package


SN74LVC1G17DCKR Manufacturer

Texas Instruments Incorporated (TI) is a Texas-based technology company that designs and manufactures semiconductors and integrated circuits for electronic designers and manufacturers all over the world. Texas Instruments was founded in 1951 after a reorganization of Geophysical Service Incorporated, a firm founded in 1930 that developed seismic and defense electronics equipment.


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Frequently Asked Questions

What does the Schmitt trigger do?

Schmitt trigger devices are typically used in signal conditioning applications to remove noise from signals used in digital circuits, particularly mechanical contact bounce in switches.

What does the Schmitt-trigger buffer operate between?

1.65 and 5.5 V VCC.

What is the Boolean operation of the SN74LVC1G17DCKR?

Y = A.

What does the CMOS device have over a wide Vcc operating range?

High output drive.

What is the body size of the ultra-compact DPW packaging?

0.8 mm 0.8 mm.

Why does the SN74LVC1G17DCKR work as a standalone buffer?

Schmitt action.

What is the DPW package technology a significant advancement in?

IC packaging.

What is the compact size of the DPW package?

0.64 mm square footprint.

What type of applications is the SN74LVC1G17DCKR completely qualified for?

Partial-power-down.

What disables the outputs of the SN74LVC1G17DCKR?

The Ioff circuitry.
SN74LVC1G17DCKR

Texas Instruments

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