STM32F446RET6 Microcontroller: 180MHz,64-LQFP, Pinout and Features

Sophie

Published: 10 February 2022 | Last Updated: 10 February 2022

5628

STM32F446RET6

STM32F446RET6

STMicroelectronics

512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller STM32F4 Series STM32F446 64 Pin 180MHz 64-LQFP

Purchase Guide

512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller STM32F4 Series STM32F446 64 Pin 180MHz 64-LQFP

STM32F446RET6 is a 32-bit ARM® Cortex®-M4 series Microcontroller. This article will go into more detail about STM32F446RET6, including pinout, CAD model, block diagram, features, and so on.

This short video introduces how to configure the core Board 64 STM32F446RET6 with the Arduino IDE, test three sensors to verify its correct operation.

Let's see how to configure the core Board 64 STM32F446RET6 with the Arduino IDE - LCSC Electronics

STM32F446RET6 Description

The STM32F446RET6 is based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 180 MHz. The Cortex-M4 core features a floating-point unit (FPU) single precision supporting all Arm® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) that enhances application security.

The STM32F446RET6 incorporates high-speed embedded memories (Flash memory up to 512 Kbytes, up to 128 Kbytes of SRAM), up to 4 Kbytes of backup SRAM, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, and a 32-bit multi-AHB bus matrix.

The STM32F446RET6 offers three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers. It also features standard and advanced communication interfaces.

• Up to four I2Cs

• Four SPIs, three I2Ss full simplexes: to achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL or via an external clock to allow synchronization.

• Four USARTs plus two UARTs

• An USB OTG full-speed and a USB OTG high-speed with full-speed capability (with the ALPI), both with dedicated power rails allowing to use them throughout the whole power range.

• Two CANs

• Two SAIs serial audio interfaces: to achieve audio class accuracy, the SAIs can be clocked via a dedicated internal audio PLL.

SDIO/MMC interface

• Camera interface

• HDMI-CEC

• SPDIF receiver (SPDIFRx)

• QuadSPI

Advanced peripherals include an SDIO, a flexible memory control (FMC) interface, a camera interface for CMOS sensors. Refer to Table 2 for the list of peripherals available on each part number.


STM32F446RET6 Pinout

STM32F446RET6 Pinout.jpg


STM32F446RET6 Pinout


STM32F446RET6 CAD Model

STM32F446RET6 Symbol.png


STM32F446RET6 Symbol


STM32F446RET6 Footprint.png


STM32F446RET6 Footprint


STM32F446RET6 3D Model.png


STM32F446RET6 3D Model


STM32F446RET6 Block Diagram

STM32F446RET6 Block Diagram.png


STM32F446RET6 Block Diagram


STM32F446RET6 Power Supply Scheme

STM32F446RET6 Power supply scheme.png


STM32F446RET6 Power Supply Scheme


Specifications

STMicroelectronics STM32F446RET6 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics STM32F446RET6.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 7 months ago)
  • Factory Lead Time
    12 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    64-LQFP
  • Number of Pins
    64
  • Data Converters
    A/D 16x12b; D/A 2x12b
  • Number of I/Os
    50
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    STM32F4
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    64
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    345mW
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    180MHz
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    STM32F446
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    CAN, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    512kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    128K x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    1.7V~3.6V
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    ARM® Cortex®-M4
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    32-Bit
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    512KB 512K x 8
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    CANbus, EBI/EMI, I2C, IrDA, LINbus, SAI, SD, SPDIF-Rx, SPI, UART/USART, USB, USB OTG
  • Supply Current-Max

    Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.

    115mA
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    32
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    32b
  • Number of Timers/Counters
    14
  • Core Architecture

    In electronic components, the term "Core Architecture" refers to the fundamental design and structure of the component's internal circuitry. It encompasses the arrangement of key components, such as processors, memory units, and input/output interfaces, within the device. The core architecture plays a crucial role in determining the component's performance, power efficiency, and overall capabilities. Different core architectures are optimized for specific applications and requirements, such as high-speed processing, low power consumption, or specialized functions. Understanding the core architecture of electronic components is essential for engineers and designers to select the most suitable components for their projects.

    ARM
  • On Chip Program ROM Width

    The parameter "On Chip Program ROM Width" refers to the data width of the read-only memory (ROM) implemented on a semiconductor chip. It indicates the number of bits that can be accessed simultaneously in each ROM read operation. A wider ROM width allows for faster data retrieval and processing, as more information can be transferred at once. This parameter is crucial in determining the overall performance and efficiency of electronic devices that utilize programmable ROM for storing firmware or application logic.

    8
  • Number of A/D Converters
    3
  • Number of ADC Channels
    16
  • Max Junction Temperature (Tj)

    Max Junction Temperature (Tj) refers to the maximum allowable temperature at the junction of a semiconductor device, such as a transistor or integrated circuit. It is a critical parameter that influences the performance, reliability, and lifespan of the component. Exceeding this temperature can lead to thermal runaway, breakdown, or permanent damage to the device. Proper thermal management is essential to ensure the junction temperature remains within safe operating limits during device operation.

    105°C
  • Ambient Temperature Range High

    This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.

    85°C
  • Number of SPI Channels
    4
  • Number of USB Channels
    2
  • Height
    1.6mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
0 Similar Products Remaining

STM32F446RET6 Features

• Core: Arm® 32-bit Cortex®-M4 CPU with FPU,

Adaptive real-time accelerator (ART

Accelerator) allowing 0-wait state execution

from Flash memory, frequency up to 180 MHz,

MPU, 225 DMIPS/1.25 DMIPS/MHz

(Dhrystone 2.1), and DSP instructions

• Memories

512 Kbytes of Flash memory

128 Kbytes of SRAM

– Flexible external memory controller with up

to 16-bit data bus: SRAM, PSRAM,

SDRAM/LPSDR SDRAM, NOR/NAND

Flash memories

– Dual-mode QuadSPI interface

• LCD parallel interface, 8080/6800 modes

• Clock, reset and supply management

 1.7 V to 3.6 V application supply and I/Os

– POR, PDR, PVD, and BOR

4 to 26 MHz crystal oscillator

– Internal 16 MHz factory-trimmed RC (1%

accuracy)

32 kHz oscillator for RTC with calibration

– Internal 32 kHz RC with calibration

• Low power

– Sleep, Stop and Standby modes

– VBAT supply for RTC, 20×32 bit backup

registers plus optional 4 KB backup SRAM

3×12-bit, 2.4 MSPS ADC: up to 24 channels

and 7.2 MSPS in triple interleaved mode

2×12-bit D/A converters

• General-purpose DMA: 16-stream DMA

controller with FIFOs and burst support

• Up to 17 timers: 2x watchdog, 1x SysTick timer

and up to twelve 16-bit and two 32-bit timers up

to 180 MHz, each with up to four IC/OC/PWM

or pulse counter

• Debug mode

SWD and JTAG interfaces

– Cortex®-M4 Trace Macrocell™


STM32F446RET6 Package Dimension

STM32F446RET6 Package.png



STM32F446RET6 Package Dimension


STM32F446RET6 Manufacturer

STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio, and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology, and its products play a key role in enabling today's convergence trends.


Parts with Similar Specs

The three parts on the right have similar specifications to STMicroelectronics & STM32F446RET6.

Trend Analysis

Datasheet PDF

Frequently Asked Questions

What type of technology is STMicroelectronics at the forefront of?

 System-on-Chip

What company is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications?

STMicroelectronics

What does the STM32F446RET6 feature?

Standard and advanced communication interfaces and a Floating point unit (FPU) single precision supports all Arm single-precision data-processing instructions and data types.
STM32F446RET6

STMicroelectronics

In Stock: 29057

United States

China

Canada

Japan

Russia

Germany

United Kingdom

Singapore

Italy

Hong Kong(China)

Taiwan(China)

France

Korea

Mexico

Netherlands

Malaysia

Austria

Spain

Switzerland

Poland

Thailand

Vietnam

India

United Arab Emirates

Afghanistan

Åland Islands

Albania

Algeria

American Samoa

Andorra

Angola

Anguilla

Antigua & Barbuda

Argentina

Armenia

Aruba

Australia

Azerbaijan

Bahamas

Bahrain

Bangladesh

Barbados

Belarus

Belgium

Belize

Benin

Bermuda

Bhutan

Bolivia

Bonaire, Sint Eustatius and Saba

Bosnia & Herzegovina

Botswana

Brazil

British Indian Ocean Territory

British Virgin Islands

Brunei

Bulgaria

Burkina Faso

Burundi

Cabo Verde

Cambodia

Cameroon

Cayman Islands

Central African Republic

Chad

Chile

Christmas Island

Cocos (Keeling) Islands

Colombia

Comoros

Congo

Congo (DRC)

Cook Islands

Costa Rica

Côte d’Ivoire

Croatia

Cuba

Curaçao

Cyprus

Czechia

Denmark

Djibouti

Dominica

Dominican Republic

Ecuador

Egypt

El Salvador

Equatorial Guinea

Eritrea

Estonia

Eswatini

Ethiopia

Falkland Islands

Faroe Islands

Fiji

Finland

French Guiana

French Polynesia

Gabon

Gambia

Georgia

Ghana

Gibraltar

Greece

Greenland

Grenada

Guadeloupe

Guam

Guatemala

Guernsey

Guinea

Guinea-Bissau

Guyana

Haiti

Honduras

Hungary

Iceland

Indonesia

Iran

Iraq

Ireland

Isle of Man

Israel

Jamaica

Jersey

Jordan

Kazakhstan

Kenya

Kiribati

Kosovo

Kuwait

Kyrgyzstan

Laos

Latvia

Lebanon

Lesotho

Liberia

Libya

Liechtenstein

Lithuania

Luxembourg

Macao(China)

Madagascar

Malawi

Maldives

Mali

Malta

Marshall Islands

Martinique

Mauritania

Mauritius

Mayotte

Micronesia

Moldova

Monaco

Mongolia

Montenegro

Montserrat

Morocco

Mozambique

Myanmar

Namibia

Nauru

Nepal

New Caledonia

New Zealand

Nicaragua

Niger

Nigeria

Niue

Norfolk Island

North Korea

North Macedonia

Northern Mariana Islands

Norway

Oman

Pakistan

Palau

Palestinian Authority

Panama

Papua New Guinea

Paraguay

Peru

Philippines

Pitcairn Islands

Portugal

Puerto Rico

Qatar

Réunion

Romania

Rwanda

Samoa

San Marino

São Tomé & Príncipe

Saudi Arabia

Senegal

Serbia

Seychelles

Sierra Leone

Sint Maarten

Slovakia

Slovenia

Solomon Islands

Somalia

South Africa

South Sudan

Sri Lanka

St Helena, Ascension, Tristan da Cunha

St. Barthélemy

St. Kitts & Nevis

St. Lucia

St. Martin

St. Pierre & Miquelon

St. Vincent & Grenadines

Sudan

Suriname

Svalbard & Jan Mayen

Sweden

Syria

Tajikistan

Tanzania

Timor-Leste

Togo

Tokelau

Tonga

Trinidad & Tobago

Tunisia

Turkey

Turkmenistan

Turks & Caicos Islands

Tuvalu

U.S. Outlying Islands

U.S. Virgin Islands

Uganda

Ukraine

Uruguay

Uzbekistan

Vanuatu

Vatican City

Venezuela

Wallis & Futuna

Yemen

Zambia

Zimbabwe

Related Parts More