MAC97A6 Triac: Circuit, Pinout, and Datasheet [Video&FAQ]

Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

Voltage - Rated DC is a parameter that specifies the maximum direct current (DC) voltage that an electronic component can safely handle without being damaged. This rating is crucial for ensuring the proper functioning and longevity of the component in a circuit. Exceeding the rated DC voltage can lead to overheating, breakdown, or even permanent damage to the component. It is important to carefully consider this parameter when designing or selecting components for a circuit to prevent any potential issues related to voltage overload.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

a count of all of the component leads (or pins)

The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

The Max Repetitive Reverse Voltage (Vrrm) is a crucial parameter in electronic components, particularly in diodes and transistors. It refers to the maximum voltage that can be applied across the component in the reverse direction without causing damage. This parameter is important for ensuring the proper functioning and longevity of the component in circuits where reverse voltage may be present. Exceeding the Vrrm rating can lead to breakdown and failure of the component, so it is essential to carefully consider this specification when designing or selecting components for a circuit.

RMS Current (Irms) refers to the Root Mean Square value of the alternating current flowing through an electronic component or circuit. It is a measure of the effective current that produces the same heating effect as the equivalent DC current. In AC circuits, the current continuously changes direction, so using the RMS value helps in calculating power dissipation and determining the component's capability to handle the current without overheating. RMS Current is crucial in selecting components like resistors, capacitors, and inductors to ensure they can safely operate within their specified current ratings.

In electronic components, the parameter "Channel Type" refers to the type of channel through which electrical signals or current flow within the component. This parameter is commonly associated with field-effect transistors (FETs) and other semiconductor devices. The channel type can be categorized as either N-channel or P-channel, depending on the polarity of the majority charge carriers (electrons or holes) that carry the current within the channel. N-channel devices have an electron-conducting channel, while P-channel devices have a hole-conducting channel. Understanding the channel type is crucial for proper circuit design and component selection to ensure compatibility and optimal performance.

the minimum current which must pass through a circuit in order for it to remain in the 'ON' state.

Trigger Device Type is a parameter in electronic components that refers to the type of device or mechanism used to initiate a specific action or function within the component. This parameter specifies the specific trigger device, such as a sensor, switch, or signal input, that is required to activate or control the operation of the component. Understanding the trigger device type is crucial for proper integration and operation of the electronic component within a larger system or circuit. By specifying the appropriate trigger device type, engineers and designers can ensure that the component functions correctly and responds to the intended input signals or conditions.

Voltage - Gate Trigger (Vgt) (Max) refers to the maximum voltage level required to trigger the gate of a semiconductor device, such as a thyristor or triac, into the conductive state. When the gate receives this voltage, it initiates the device's conduction, allowing current to flow between its anode and cathode. Exceeding this voltage can lead to unwanted behavior or damage to the component, making it a critical parameter in designing circuits that utilize these devices. Understanding Vgt is essential for ensuring proper operation and reliability in electronic applications.

The parameter "Current - Non Rep. Surge 50, 60Hz (Itsm)" in electronic components refers to the maximum non-repetitive surge current that a component can withstand without damage during a single surge event at frequencies of 50Hz or 60Hz. This parameter is important for assessing the robustness and reliability of the component in handling sudden spikes or surges in current that may occur in the electrical system. It helps in determining the level of protection needed for the component to ensure its longevity and proper functioning in various operating conditions. Manufacturers provide this specification to guide engineers and designers in selecting the appropriate components for their applications based on the expected surge current levels.

Current - Gate Trigger (Igt) (Max) refers to the maximum gate trigger current required to activate a semiconductor device, such as a thyristor or triac. It is the minimum current that must flow into the gate terminal to ensure that the device turns on and conducts current between its anode and cathode. Exceeding this value can lead to unnecessary power consumption, while insufficient current may prevent the device from turning on effectively. This parameter is crucial for circuit design, as it influences the selection of gate driving circuits.

Leakage Current (Max) is a parameter that specifies the maximum amount of current that can flow through an electronic component when it is in an off state. It represents the amount of current that leaks through the component due to imperfections in its insulation or semiconductor materials. Excessive leakage current can lead to power loss, reduced efficiency, and potential reliability issues in electronic circuits. Manufacturers provide this specification to help designers ensure that the leakage current does not exceed acceptable limits for the intended application. It is typically measured in microamps (μA) or nanoamps (nA) and is an important consideration in low-power and high-precision electronic designs.

Triac Type refers to the classification of triacs based on their electrical characteristics and applications. Triacs are semiconductor devices that can control current flow in both directions and are commonly used in AC power control. Different types of triacs may have variations in parameters such as voltage rating, current rating, triggering method, and switching speed, making them suitable for specific applications like light dimmers, motor speed controls, and heating regulation. Understanding the triac type is crucial for selecting the appropriate component for a given circuit design.

The parameter "RMS On-state Current-Max" in electronic components refers to the maximum root mean square (RMS) current that the component can handle when it is in the on-state or conducting state. This specification is important for devices such as thyristors, triacs, and other semiconductor switches that are used to control power in various applications. Exceeding the maximum RMS on-state current rating can lead to overheating and potentially damaging the component. Designers must carefully consider this parameter to ensure the component operates within its specified limits for safe and reliable performance.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.