STM32F107VCT6 Microcontroller: Features, Applications and Datasheet
256KB 256K x 8 FLASH ARM® Cortex®-M3 32-Bit Microcontroller STM32F1 Series STM32F107 100 Pin 72MHz 3.3V 100-LQFP









256KB 256K x 8 FLASH ARM® Cortex®-M3 32-Bit Microcontroller STM32F1 Series STM32F107 100 Pin 72MHz 3.3V 100-LQFP
The STMicroelectronics STM32F107VCT6 is a microcontroller chip that belongs to the STM32F1 series of mainstream connectivity line devices. This article will introduce its features, applications and datasheet.
STM32F107VCT6 Discription
The STMicroelectronics STM32F107VCT6 is a microcontroller chip that belongs to the STM32F1 series of mainstream connectivity line devices. It is based on the ARM Cortex-M3 32-bit RISC core operating at a maximum frequency of 72 MHz. It has 256 Kbytes of Flash memory and 64 Kbytes of SRAM, as well as various enhanced I/Os and peripherals such as Ethernet MAC, CAN, and USB 2.0 OTG. It is suitable for a wide range of applications such as motor drives, medical equipment, industrial applications, and home audio equipment.
STM32F107VCT6 Features
It has a 32-bit ARM Cortex-M3 core operating at a maximum frequency of 72 MHz.
It has 256 Kbytes of Flash memory and 64 Kbytes of SRAM.
It has various enhanced I/Os and peripherals such as Ethernet MAC, CAN, and USB 2.0 OTG.
It supports two 12-bit ADCs, four general-purpose 16-bit timers plus a PWM timer, as well as standard and advanced communication interfaces: up to two I2Cs, three SPIs, two I2Ss, five USARTs, an USB OTG FS and two CANs.
It operates in the –40 to +105 °C temperature range, from a 2.0 to 3.6 V power supply.
It has a comprehensive set of power-saving modes such as Sleep, Stop and Standby.
It is available in three different package types: from 64 pins to 100 pins.
Specifications
- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 6 months ago) - Factory Lead Time10 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
100-LQFP - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of Pins100
- Data ConvertersA/D 16x12b; D/A 2x12b
- Number of I/Os80
- Watchdog TimersYes
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C TA - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
STM32F1 - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e4 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Number of Terminations100
- Termination
Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.
SMD/SMT - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Nickel/Palladium/Gold (Ni/Pd/Au) - Max Power Dissipation
The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.
434mW - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
QUAD - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
3.3V - Terminal Pitch
The center distance from one pole to the next.
0.5mm - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
72MHz - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
30 - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
STM32F107 - Pin Count
a count of all of the component leads (or pins)
100 - Supply Voltage-Min (Vsup)
The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.
2V - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
CAN, Ethernet, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
256kB - Oscillator Type
Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.
Internal - RAM Size
RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.
64K x 8 - Voltage - Supply (Vcc/Vdd)
Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.
2V~3.6V - uPs/uCs/Peripheral ICs Type
The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.
MICROCONTROLLER, RISC - Core Processor
The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.
ARM® Cortex®-M3 - Peripherals
In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.
DMA, POR, PWM, Voltage Detect, WDT - Program Memory Type
Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.
FLASH - Core Size
Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.
32-Bit - Program Memory Size
Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.
256KB 256K x 8 - Connectivity
In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.
CANbus, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG - Supply Current-Max
Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.
68mA - Bit Size
In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.
32 - Has ADC
Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.
YES - DMA Channels
DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.
YES - Data Bus Width
The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.
32b - PWM Channels
PWM Channels, or Pulse Width Modulation Channels, refer to the number of independent PWM outputs available in an electronic component, such as a microcontroller or a motor driver. PWM is a technique used to generate analog-like signals by varying the duty cycle of a square wave signal. Each PWM channel can control the output of a specific device or component by adjusting the pulse width of the signal. Having multiple PWM channels allows for precise control of multiple devices simultaneously, making it a valuable feature in applications such as motor control, LED dimming, and audio signal generation. The number of PWM channels available in a component determines the flexibility and complexity of the system it can control.
YES - Number of Timers/Counters7
- Address Bus Width
A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.
32b - Density
In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.
2 Mb - Core Architecture
In electronic components, the term "Core Architecture" refers to the fundamental design and structure of the component's internal circuitry. It encompasses the arrangement of key components, such as processors, memory units, and input/output interfaces, within the device. The core architecture plays a crucial role in determining the component's performance, power efficiency, and overall capabilities. Different core architectures are optimized for specific applications and requirements, such as high-speed processing, low power consumption, or specialized functions. Understanding the core architecture of electronic components is essential for engineers and designers to select the most suitable components for their projects.
ARM - Number of ADC Channels16
- Number of SPI Channels3
- Number of Ethernet Channels1
- Height1.45mm
- Length14mm
- Width14.2mm
- REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
No SVHC - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
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STM32F107VCT6 Alternatives
Part Number | Description | Manufacturer |
STM32F107VCT6TR | Mainstream Connectivity line, Arm Cortex-M3 MCU with 256 Kbytes of Flash memory, 72 MHz CPU, Ethernet MAC, CAN and USB 2.0 OTG | STMicroelectronics |
STM32F107VCT7XXXTR | RISC MICROCONTROLLER | STMicroelectronics |
STM32F107VCT7 | Mainstream Connectivity line, Arm Cortex-M3 MCU with 256 Kbytes of Flash memory, 72 MHz CPU, Ethernet MAC, CAN and USB 2.0 OTG | STMicroelectronics |
STM32F107VCT7TR | 32-BIT, FLASH, 72MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-100 | STMicroelectronics |
STM32F107VCT6XXXTR | RISC MICROCONTROLLER | STMicroelectronics |
STM32F107VCT6XXX | 32-BIT, FLASH, 72MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-100 | STMicroelectronics |
STM32F107VCT6 Applications
Motor Drive & Control: The chip can be used to control the speed, torque, and direction of various types of motors such as DC, BLDC, PMSM, and stepper motors. It can also implement advanced algorithms such as field-oriented control (FOC), sensorless control, and vector control. The chip has various peripherals such as PWM, ADC, DAC, CAN, and USB that can interface with the motor driver, sensors, and communication devices.
Medical and Handheld Equipment: The chip can be used to design portable and battery-powered devices that require low power consumption and high performance. It can also implement various medical applications such as blood pressure monitors, glucose meters, pulse oximeters, and electrocardiograms. The chip has various peripherals such as ADC, DAC, USB, and CAN that can interface with the sensors, displays, and communication devices.
Industrial Applications: The chip can be used to design robust and reliable systems that operate in harsh environments and require high-speed communication and data processing. It can also implement various industrial applications such as PLCs, inverters, power meters, and industrial networking. The chip has various peripherals such as Ethernet, CAN, USB, and SPI that can interface with the actuators, sensors, and communication devices.
STM32F107VCT6 Manufacturer
STMicroelectronics is a global leader in creating products and solutions for smart mobility, extreme versatility, power and energy, and IoT and connectivity. It is a multinational corporation and technology company of French-Italian origin headquartered in Switzerland and listed on the New York Stock Exchange, on the Euronext Paris in Paris and on the Borsa Italiana in Milan. It was founded in 1987 by the merger of two semiconductor companies, SGS Microelettronica of Italy and Thomson Semiconducteurs of France. It has one of the industry’s broadest technology portfolios and its products are found in today’s most innovative electronics solutions. Some of its product categories include microcontrollers, sensors, power devices, analog and mixed-signal ICs, wireless and wired connectivity, automotive and industrial electronics, and security and biometrics.
Parts with Similar Specs
- ImagePart NumberManufacturerPackage / CaseNumber of PinsCore ArchitectureData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltageView Compare
STM32F107VCT6
100-LQFP
100
ARM
32 b
80
CAN, Ethernet, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB
256 kB
3.3 V
100-LQFP
100
ARM
32 b
80
CAN, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB
256 kB
3.3 V
100-LQFP
100
ARM
32 b
80
CAN, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB
256 kB
3.3 V
100-LQFP
100
ARM
32 b
80
CAN, I2C, I2S, IrDA, LIN, SDIO, SPI, UART, USART, USB
256 kB
3.3 V
100-LQFP
-
-
-
70
-
-
3.3 V
Datasheet PDF
- Datasheets :
How can I program the STM32F107VCT6 chip?
You can program the STM32F107VCT6 chip using various tools and methods, such as the ST-LINK/V2 debugger/programmer, the STM32CubeProgrammer software, the STM32CubeIDE integrated development environment, or the USB device firmware upgrade (DFU) mode. You can find more information about these tools and methods in the [application note] or on the STMicroelectronics website.
Why is my STM32F107VCT6 chip not recognized as a USB device?
There could be several reasons why your STM32F107VCT6 chip is not recognized as a USB device, such as incorrect wiring, faulty hardware, wrong configuration, or software issues. You can try the following steps to troubleshoot the problem: Confirm the device is recognized as a USB DFU device when BOOT0 is strapped HIGH Make sure the HSE is starting, and clocking at the correct speed. Export via MCO (PA8) Make sure the software configuring the PLL, and the HSE_VALUE, reflect the 25 MHz source, and the USB peripheral is getting a 48 MHz clock.
Why is my STM32F107VCT6 core locked-up after programming?
One possible reason why your STM32F107VCT6 core is locked-up after programming is that you have enabled the read protection (RDP) level 1 or 2, which prevents any access to the Flash memory by the debugger. To unlock the core, you need to perform a mass erase of the Flash memory, which will also reset the RDP level to 0.
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