TBD62083AFG:Gate Driver ,Datasheet, Pinout, and Package

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Published: 04 March 2022 | Last Updated: 04 March 2022

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TBD62083AFG

TBD62083AFG

Toshiba Semiconductor and Storage

N-Channel 1.27mm PMIC 5V 18-SOIC (0.276, 7.00mm Width)

Purchase Guide

N-Channel 1.27mm PMIC 5V 18-SOIC (0.276, 7.00mm Width)

TBD62083AFG is a kind of low-side gate driver. This passage covers the TBD62083AFG datasheet, description, pinout, and package.

TBD62083AFG Description

TBD62083AFG is a DMOS transistor array with 8 circuits. It has a clamp diode for switching inductive loads built-in in each output. Please be careful about thermal conditions during use.


TBD62083AFG Application

 1.Home appliances

 2.Air conditioners

 3.White goods

 4.Water heaters

5. Office equipment

6. Industrial equipment

7. Vending machines

 8.Measuring instruments

 9.Amusement equipment

 10.High-voltage motors


TBD62083AFG equivalent circuit

equivalent circuit.jpg

CAD Modals

Symbol

symbols.jpg

Footprint

footprint.jpg

3D Models

QQ截图20220304150056.jpg  QQ截图20220304150119.jpg  QQ截图20220304150155.jpg

TBD62083AFG Features:

• 8 circuits built-in

• High voltage : VOUT = 50 V (MAX)

• High current : IOUT = 500 mA/ch (MAX)

• Input voltage(output on) :  TBD62083A series 2.5 V (MIN)

                                              TBD62084A series 7.0 V (MIN)

• Input voltage(output off) :  TBD62083A series 0.6 V (MAX)

                                               TBD62084A series 1.0 V (MAX)

• Package :  PG type P-DIP18-300-2.54-001

                    FG type SOP18-P-375-1.27

                   FNG type SSOP18-P-225-0.65

                   FWG type P-SOP18-0812-1.27-001

 

Precautions for Using TBD62083AFG

This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or over-voltage, it may be destroyed. Hence, the utmost care must be taken when systems that incorporate this IC are designed. Utmost care is necessary for the design of the output line, COMMON, and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.


TBD62083AFG Manufacturer

Toshiba Corporation (Kabushikigaisha Toshiba) is a Japanese multinational conglomerate headquartered in Minato, Tokyo. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography. It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.


TBD62083AFG Package:

DIP18-300-2.54-001

P-DIP18-300-2.54-001.jpg

P-DIP18-300-2.54-001.jpg2.jpg


SOP18-P-375-1.27

P-SOP18-0812-1.27-001.jpg

SSOP18-P-225-0.65

SSOP18-P-225-0.65.jpg

SOP18-0812-1.27-001

P-SOP18-0812-1.27-001.jpg

Specifications

Toshiba Semiconductor and Storage TBD62083AFG technical specifications, attributes, parameters and parts with similar specifications to Toshiba Semiconductor and Storage TBD62083AFG.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    18-SOIC (0.276, 7.00mm Width)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Published
    2016
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    18
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Number of Outputs
    8
  • Output Type

    The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.

    N-Channel
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    25V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    2.5V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    On/Off
  • Output Configuration

    Output Configuration in electronic components refers to the arrangement or setup of the output pins or terminals of a device. It defines how the output signals are structured and how they interact with external circuits or devices. The output configuration can determine the functionality and compatibility of the component in a circuit design. Common types of output configurations include single-ended, differential, open-drain, and push-pull configurations, each serving different purposes and applications in electronic systems. Understanding the output configuration of a component is crucial for proper integration and operation within a circuit.

    Low Side
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    Not Required
  • Input Type

    Input type in electronic components refers to the classification of the signal or data that a component can accept for processing or conversion. It indicates whether the input is analog, digital, or a specific format such as TTL or CMOS. Understanding input type is crucial for ensuring compatibility between different electronic devices and circuits, as it determines how signals are interpreted and interacted with.

    Inverting
  • Switch Type

    Based on their characteristics, there are basically three types of switches: Linear switches, tactile switches and clicky switches.

    General Purpose
  • Ratio - Input:Output

    The parameter "Ratio - Input:Output" in electronic components refers to the relationship between the input and output quantities of a device or system. It is a measure of how the input signal or energy is transformed or converted into the output signal or energy. This ratio is often expressed as a numerical value or percentage, indicating the efficiency or effectiveness of the component in converting the input to the desired output. A higher ratio typically signifies better performance or higher efficiency, while a lower ratio may indicate losses or inefficiencies in the conversion process. Understanding and optimizing the input-output ratio is crucial in designing and evaluating electronic components for various applications.

    1:1
  • Voltage - Load

    Voltage - Load refers to the voltage across a load component in an electronic circuit when it is connected and operational. It represents the electrical potential difference that drives current through the load, which can be a resistor, motor, or other devices that consume electrical power. The voltage - load relationship is crucial for determining how much power the load will utilize and how it will affect the overall circuit performance. Properly managing voltage - load is essential for ensuring devices operate efficiently and safely within their specified limits.

    50V Max
  • Output Peak Current Limit-Nom

    Output Peak Current Limit-Nom is a parameter in electronic components that specifies the maximum current that can be delivered by the output under normal operating conditions. This limit is typically set to protect the component from damage due to excessive current flow. It ensures that the component operates within its safe operating limits and prevents overheating or other potential issues. Designers and engineers use this parameter to ensure proper functioning and reliability of the electronic system in which the component is used.

    0.4A
  • Built-in Protections

    Built-in protections in electronic components refer to the safety features and mechanisms that are integrated into the component to prevent damage or malfunction in various situations. These protections are designed to safeguard the component from overvoltage, overcurrent, overheating, short circuits, and other potential hazards that could occur during operation. By having built-in protections, electronic components can operate more reliably and safely, extending their lifespan and reducing the risk of failure. These protections are essential for ensuring the overall performance and longevity of electronic devices and systems.

    TRANSIENT
  • Output Current Flow Direction

    Output Current Flow Direction refers to the orientation of current flowing out of a component or circuit. It indicates whether the current is being sourced from the component or sent to another component in the circuit. This parameter is crucial for understanding how electronic components interact within a circuit and ensures correct connectivity and functionality in circuit design. The direction can affect the operation and performance of the overall system.

    SINK
  • Length
    12.5mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    2.45mm
  • Width
    7mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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Frequently Asked Questions

What is TBD62083AFG?

1.TBD62083AFG is a DMOS transistor array with 8 circuits.

2.Where does TBD62083AFG can be used?

It can be used in many places in our daily life., such as home appliances, air conditioners, white goods, water heaters, and so on.

How many kinds of packages does TBD62083AFG have?

They are 4:P-DIP18-300-2.54-001,SOP18-P-375-1.27 ,SSOP18-P-225-0.65 ,P-SOP18-0812-1.27-001 .

4.How to safely long run in a circuit?

To increase the durability and performance of this device the user must follow the guidelines and should not increase the values as described below. Do not drive the driver above 50V, always make sure to place its pins right in the circuit, and always use a suitable resistor at the base of the driver to provide it required current. 

What is a driver?

In a broad sense, a driver refers to the hardware that drives a certain type of device.  In the computer world, a drive is a disk drive.
TBD62083AFG

Toshiba Semiconductor and Storage

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