Xilinx XC2C512-10FT256I CPLD: Ultra-Low Power Design Solutions for Battery-Operated Embedded Systems

UTMEL

Published: 05 June 2025 | Last Updated: 07 June 2025

204

XC2C512-10FT256I

XC2C512-10FT256I

Xilinx Inc.

1mm PMIC CoolRunner II Series XC2C512 256 Pin 1.8V 256-LBGA

Purchase Guide

1mm PMIC CoolRunner II Series XC2C512 256 Pin 1.8V 256-LBGA

Learn how XC2C512-10FT256I enhances low power applications with Fast Zero Power technology, multi-voltage I/O, and efficient clock management for energy savings.

Product Introduction

When designing battery-operated devices, power efficiency becomes a top priority. The XC2C512-10FT256I stands out as a solution tailored for low power applications. Operating at a voltage as low as 1.8V, this device minimizes energy consumption without compromising performance. It draws a quiescent current of just 14 μA, which makes it perfect for handheld gadgets and communication systems. With support for mixed I/O voltages, it adapts seamlessly to various designs. These features ensure low power use, extending battery life in portable devices and reducing operational costs.

Understanding the XC2C512-10FT256I

Overview of the XC2C512-10FT256I

The XC2C512-10FT256I is a high-performance chip designed for embedded systems. It belongs to the CoolRunner-II family of CPLDs (Complex Programmable Logic Devices). This chip offers a balance of speed, power efficiency, and flexibility, making it ideal for modern applications. Its architecture is based on a 0.18-micron CMOS process, which ensures reliable performance and low power consumption. You can program it in-system using the IEEE 1532 (JTAG) interface, allowing quick and seamless updates.

This chip supports up to 512 macrocells and 212 I/O pins, providing ample resources for complex designs. Its multi-voltage I/O operation (1.5V to 3.3V) ensures compatibility with various systems. Additionally, the XC2C512-10FT256I includes advanced features like On-The-Fly Reconfiguration (OTF) and flexible clocking modes, which enhance its adaptability.

Relevance to Low Power Applications

If you’re working on battery-powered devices, the XC2C512-10FT256I is an excellent choice. Its low power design ensures minimal energy consumption, extending the battery life of portable devices. The chip operates at an internal voltage range of 1.7V to 1.9V, making it suitable for energy-sensitive applications. Its Fast Zero Power (FZP) technology further reduces standby power consumption, which is critical for devices that spend significant time in idle states.

The XC2C512-10FT256I also supports multiple I/O banks, allowing you to optimize power usage across different sections of your design. This feature is particularly useful in embedded systems where power efficiency is a priority.

Key Technical Specifications

Here’s a quick look at the technical specifications of the XC2C512-10FT256I:

SpecificationValue
Programmable TypeIn System Programmable
Delay Time tpd(1) Max9.2ns
Voltage Supply - Internal1.7V ~ 1.9V
Number of Logic Elements/Blocks32
Number of Macrocells512
Number of Gates12000
Number of I/O212
Operating Temperature-40℃ ~ 85℃ (TA)
Mounting TypeSurface Mount
Package / Case256-LBGA
Supplier Device Package256-FTBGA (17x17)

These specifications highlight the chip’s versatility and suitability for a wide range of applications. Whether you’re designing IoT devices, wearable technology, or industrial automation systems, the XC2C512-10FT256I provides the performance and efficiency you need.

Features That Enable Low Power Usage

Fast Zero Power (FZP) Technology

Fast Zero Power (FZP) technology is one of the standout features of the XC2C512-10FT256I. This innovation minimizes power consumption during idle states, making it ideal for devices that spend significant time in standby mode. You’ll find this especially useful in battery-operated gadgets, where every microamp of current saved translates to extended battery life.

  • Key Benefits of FZP Technology:

    • Ultra-low standby power consumption, with currents as low as 14 µA.

    • Enhanced power efficiency for portable and battery-powered devices.

By leveraging FZP technology, you can design systems that remain energy-efficient without sacrificing performance. This feature ensures that your device stays ready to operate while consuming minimal power in standby mode.

Low Standby Power Consumption

The XC2C512-10FT256I excels in reducing standby power consumption, a critical factor for low power applications. Its architecture supports low voltage operation, which further reduces energy usage. This makes the chip an excellent choice for applications where power efficiency is a priority.

When your device enters standby mode, the programmable logic within the chip ensures that unnecessary operations are halted. This reduces energy waste and optimizes the overall power profile of your system. With in-system programmability, you can fine-tune the chip’s behavior to match your specific power-saving requirements.

Advanced Clocking Techniques

Efficient clock management plays a vital role in reducing power consumption, and the XC2C512-10FT256I incorporates advanced clocking techniques to achieve this. Resonant clocking, for example, reduces clocking power but struggles with frequency scaling. To overcome this, quasi-resonant clocking (QRC) offers a scalable solution, making it suitable for systems requiring voltage-frequency adjustments.

TechniquePower SavingsPerformance Drop
GALS~30%10%

Globally Asynchronous Locally Synchronous (GALS) designs allow you to adjust frequency and voltage levels independently for each module. This flexibility enables dynamic voltage scaling (DVS), which can reduce energy consumption by up to 30%. Although there is a slight performance trade-off, the overall efficiency gains make it worthwhile for many low power applications.

By implementing these clocking techniques, you can optimize the logic operations within your system, ensuring that power is used only where it’s needed. This approach not only enhances efficiency but also extends the lifespan of your battery-powered devices.

Support for multiple I/O standards

The XC2C512-10FT256I offers robust support for multiple I/O standards, making it an adaptable choice for diverse applications. This feature allows you to integrate the chip into systems with varying voltage requirements and communication protocols. By supporting a wide range of I/O standards, the XC2C512-10FT256I ensures compatibility and flexibility in your designs.

Why Multiple I/O Standards Matter

When designing low power applications, you often need to connect components that operate at different voltage levels. For example, a microcontroller might use 3.3V logic, while a sensor operates at 1.8V. Without support for multiple I/O standards, you would need additional components like level shifters, which increase complexity and power consumption.

Tip: Using a chip with built-in support for multiple I/O standards simplifies your design and reduces energy usage.

The XC2C512-10FT256I eliminates the need for external level shifters by supporting I/O voltages ranging from 1.5V to 3.3V. This capability not only saves power but also reduces the overall size and cost of your system.

Key Benefits of Multi-Standard I/O Support

Here’s how this feature enhances your low power applications:

  • Seamless Integration: You can connect the chip to various components without worrying about voltage mismatches.

  • Reduced Power Consumption: Eliminating external level shifters minimizes energy loss.

  • Simplified Design: Fewer components mean a cleaner and more efficient circuit layout.

  • Enhanced Flexibility: The chip adapts to different systems, making it suitable for a wide range of applications.

Practical Example

Imagine you’re designing a wearable fitness tracker. The tracker includes a microcontroller, a heart rate sensor, and a Bluetooth module. Each component operates at a different voltage level. With the XC2C512-10FT256I, you can connect all these components directly to the chip. Its multi-standard I/O support ensures smooth communication between the components, reducing power consumption and extending battery life.

Technical Highlights

The XC2C512-10FT256I’s I/O banks allow you to configure different voltage levels for specific groups of pins. This feature is particularly useful in complex designs where multiple subsystems need to operate independently.

FeatureBenefit
Multi-Voltage I/O BanksSupports 1.5V, 1.8V, 2.5V, 3.3V
Configurable I/O PinsOptimizes power usage
High-Speed OperationMaintains performance

By leveraging these capabilities, you can create efficient and reliable systems that meet the demands of modern low power applications.

Note: Always refer to the chip’s datasheet for detailed configuration options and guidelines.

The XC2C512-10FT256I’s support for multiple I/O standards is a game-changer for low power designs. It simplifies your work, reduces energy consumption, and ensures compatibility across various components. Whether you’re building IoT devices, portable electronics, or industrial systems, this feature provides the flexibility and efficiency you need.

Strategies for Optimizing Low Power Applications

Configuring Power-Saving Modes

Configuring power-saving modes is one of the most effective ways to reduce energy consumption in embedded systems. By transitioning your device between different power states, you can optimize its energy usage based on activity levels. The XC2C512-10FT256I supports multiple power modes, allowing you to tailor its behavior to your application's needs.

Power Mode Transitions

The chip enables smooth transitions between power modes, ensuring minimal disruption to system performance. Here’s a breakdown of common transitions:

Power Mode TransitionDescription
Active to SleepReduces power consumption while keeping the system responsive.
Active to Deep SleepFurther reduces power usage, suitable for longer idle periods.
Active to HibernateLowest power state, ideal for extended periods of inactivity.

These transitions allow you to balance energy efficiency with responsiveness. For example, switching to "Deep Sleep" during idle periods can significantly extend battery life without compromising functionality.

Practical Applications

You can configure power-saving modes for various devices, such as IoT sensors or wearable technology. For instance, a fitness tracker can enter "Sleep" mode when not in use and wake up instantly when a button is pressed. This approach minimizes energy waste while maintaining user convenience.

Case Studies

Here’s a table summarizing energy savings achieved by configuring power-saving modes in different applications:

Control StrategyAverage Energy SavingsPayback Period
Schedule Timer48%< 8 years
Kitchen AppliancesN/A0.7 years
Printer RoomsN/A1.1 years
Miscellaneous DevicesN/A4.1 years
WorkstationsN/A7.8 years

These examples highlight the potential of power-saving modes to reduce energy consumption across diverse systems.

Tip: Use in-system programmability to fine-tune power modes for your specific application.


Efficient Clock Management

Clock management plays a crucial role in optimizing low power use. By controlling the clock signals within your system, you can reduce unnecessary logic operations and improve overall efficiency. The XC2C512-10FT256I incorporates advanced clocking techniques to help you achieve this.

Techniques for Clock Management

Here are some strategies you can implement:

  • Globally Asynchronous Locally Synchronous (GALS): Adjust frequency and voltage levels independently for each module. This technique reduces energy consumption by up to 30%.

  • Dynamic Voltage Scaling (DVS): Lower voltage levels during periods of reduced activity to save power.

TechniquePower SavingsPerformance Drop
GALS~30%10%

These methods ensure that clock signals are used efficiently, minimizing energy waste while maintaining high performance.

Practical Example

Imagine you’re designing a smart thermostat. By implementing DVS, you can reduce the clock frequency during idle periods, saving energy without affecting the device’s responsiveness.

Note: Efficient clock management not only reduces power consumption but also extends the lifespan of your chip.


Leveraging Sleep and Standby States

Sleep and standby states are essential for low power applications. These states allow your device to conserve energy during idle periods while remaining ready to resume operation. The XC2C512-10FT256I supports multiple sleep modes, giving you flexibility in power management.

Types of Sleep States

The chip offers several sleep states, each tailored to different scenarios:

Power ModeDescription
Low-Power (LP)Reduces power consumption while maintaining performance.
Ultra-Low-Power (ULP)Further reduces power consumption, ideal for battery-operated devices.
Deep SleepMinimizes power usage while allowing for quick wake-up.
HibernateLowest power state, requires a full restart to resume operation.
ActiveNormal operation mode with full performance.
SleepLow power state with some functionality still available.
Deep Sleep RAMRetains RAM contents while in a low power state.

Implementation Tips

  • Transition to "Ultra-Low-Power" mode during extended idle periods.

  • Use user buttons to wake the system from "Sleep" or "Deep Sleep" states.

  • Retain RAM contents in "Deep Sleep RAM" mode for faster recovery.

Real-World Benefits

Leveraging sleep states can significantly extend battery life in portable devices. For example, a wearable heart rate monitor can enter "Deep Sleep" mode when not actively measuring, conserving energy while remaining ready to wake up instantly.

Tip: Combine sleep states with efficient clock management for maximum energy savings.

Reducing unnecessary logic operations

Reducing unnecessary logic operations is a key strategy for optimizing low power applications. When your system performs fewer redundant tasks, it consumes less energy and operates more efficiently. By streamlining the logic within your design, you can achieve significant power savings without compromising functionality.

Why Reducing Logic Operations Matters

Every logic operation in your system requires power. Even small inefficiencies can add up, especially in devices that run continuously or rely on battery power. By minimizing unnecessary operations, you reduce the workload on the chip, which leads to lower energy consumption and improved performance.

For example, consider a wearable device that processes sensor data. If the device performs redundant calculations or checks, it wastes valuable energy. By optimizing the logic, you ensure that only essential operations are executed, extending the device's battery life.

Practical Techniques for Optimization

Here are some practical ways to reduce unnecessary logic operations in your designs:

  1. Simplify Boolean Expressions
    Simplifying Boolean expressions in your code can eliminate redundant logic gates. For instance, using Karnaugh maps or other simplification techniques can help you identify and remove unnecessary terms.

  2. Use Conditional Execution
    Implement conditional execution to bypass operations that are not needed. For example, instead of running a calculation every cycle, you can set conditions to execute it only when required.

  3. Optimize Data Paths
    Streamline data paths to reduce the number of logic gates involved in processing. This can be achieved by reordering operations or combining multiple steps into one.

  4. Leverage Built-in Features
    The XC2C512-10FT256I includes features like On-The-Fly Reconfiguration (OTF), which allows you to dynamically adjust the logic based on current needs. By using this feature, you can deactivate unused sections of the chip, saving power.

Evidence of Efficiency Gains

Studies have shown that reducing unnecessary logic operations can lead to measurable improvements in power efficiency. The table below highlights the impact of optimization on logical errors and relative error reduction:

Code TypeLogical Error per Cycle (%)Relative Error Reduction (%)
Distance-52.914 ± 0.0164%
Distance-3 Avg3.028 ± 0.023N/A
Distance-5 (faster decoder)3.056 ± 0.0152%
Distance-3 (faster decoder)3.118 ± 0.025N/A

This data demonstrates how optimizing logic operations can reduce errors and improve overall system performance. While the percentage reductions may seem small, they translate to significant energy savings in large-scale or long-term applications.

Real-World Example

Imagine you are designing an IoT sensor that monitors temperature. The sensor collects data every second, but the environment changes slowly. Instead of processing every data point, you can implement logic to analyze only significant changes. This approach reduces the number of operations, conserving energy while maintaining accuracy.

Tip: Regularly review your design to identify and eliminate redundant logic operations. Small adjustments can lead to big improvements in power efficiency.

By focusing on reducing unnecessary logic operations, you can create systems that are not only energy-efficient but also more reliable and cost-effective. This strategy is essential for modern low power applications, where every microamp of current saved makes a difference.

Real-World Applications of XC2C512-10FT256I

IoT Devices and Sensors

The XC2C512-10FT256I is a perfect fit for IoT devices and sensors. Its low power design ensures efficient energy use, which is critical for devices that operate continuously or rely on batteries. You can use this chip in smart home systems, environmental monitoring sensors, and industrial IoT setups. Its ability to handle multiple I/O standards allows seamless integration with various components, making it versatile for different applications.

For example, in a smart home, the chip can manage communication between temperature sensors, motion detectors, and control hubs. Its low standby power consumption ensures that these devices remain operational for extended periods without frequent battery replacements. Additionally, the chip’s compact design makes it suitable for space-constrained IoT devices, such as wireless sensors or compact gateways.

Wearable Technology

Wearable devices like fitness trackers and smartwatches demand compact, energy-efficient components. The XC2C512-10FT256I meets these requirements with its small 256-ball LBGA package and low power consumption. You can rely on this chip to manage control logic and sensor interfacing, which are essential for wearable technology.

For instance, in a smartwatch, the chip can process data from accelerometers, heart rate monitors, and GPS modules. Its ability to operate at low voltages reduces overall power consumption, extending the device’s battery life. The chip’s reprogrammable nature also allows you to update features or fix bugs without replacing hardware, ensuring long-term usability.

Battery-Powered Portable Electronics

Portable electronics, such as barcode scanners and GPS units, benefit greatly from the XC2C512-10FT256I’s features. Its high macrocell count supports complex logic designs, while its low voltage operation minimizes energy use. These characteristics make it an excellent choice for devices that prioritize efficiency and reliability.

For example, in a barcode scanner, the chip can handle signal processing and communication with minimal power draw. Its reliable performance across a wide temperature range ensures consistent operation in various environments. Additionally, the chip’s compact design saves space, allowing you to create smaller, more portable devices.

Tip: By using the XC2C512-10FT256I in your designs, you can achieve a balance between performance and energy efficiency, making it ideal for modern low power applications.

Industrial automation systems

Industrial automation systems rely on efficient and reliable components to ensure smooth operations. The XC2C512-10FT256I offers features that make it an excellent choice for these systems. Its low power consumption, high performance, and flexibility allow you to design automation solutions that are both cost-effective and energy-efficient.

Why Choose XC2C512-10FT256I for Automation?

You can use the XC2C512-10FT256I to manage complex control logic in industrial environments. Its ability to operate at low voltages reduces energy costs, which is critical for systems running 24/7. The chip’s support for multiple I/O standards ensures compatibility with various sensors, actuators, and communication protocols.

Tip: Use the chip’s in-system programmability to update control logic without halting operations. This feature minimizes downtime and boosts productivity.

Practical Applications in Automation

Here are some ways you can integrate the XC2C512-10FT256I into industrial automation:

  • Robotic Arms: Control precise movements with minimal power usage.

  • Conveyor Systems: Manage speed and direction efficiently.

  • Monitoring Equipment: Process sensor data in real-time for better decision-making.

Key Benefits for Industrial Use

FeatureBenefit
Low Power ConsumptionReduces operational costs
High Macrocell CountHandles complex logic designs
Wide Temperature RangeOperates reliably in harsh environments

By leveraging these features, you can create robust automation systems that meet modern industry demands. The XC2C512-10FT256I ensures your designs are efficient, reliable, and future-proof.

Note: Always test your designs in real-world conditions to ensure optimal performance.

Benefits and Challenges in Low Power Scenarios

Advantages of using XC2C512-10FT256I

The XC2C512-10FT256I offers several advantages for low power applications. Its Fast Zero Power (FZP) technology ensures minimal energy consumption during idle states. This feature is especially useful for devices that spend significant time in standby mode. The chip’s low standby power consumption extends battery life, making it ideal for portable electronics and IoT devices.

You can also benefit from its support for multiple I/O standards. This flexibility allows seamless integration into systems with varying voltage requirements. Additionally, the chip’s programmable nature enables you to customize its logic to meet specific application needs. Its compact design and high macrocell count make it suitable for space-constrained designs that require complex control logic.

Potential limitations and considerations

While the XC2C512-10FT256I excels in many areas, you should consider a few limitations. Its commercial temperature range may not perform well in harsh environments. If your application requires extreme temperature tolerance, this chip might not be the best choice.

The high pin count can also pose challenges during the design phase. You may need extra effort to manage the connections effectively. Furthermore, the XC2C512-10FT256I is not as widely adopted as larger FPGAs. This could mean fewer tools and limited support compared to more popular programmable logic devices.

Comparison with alternative CPLD solutions

When compared to other CPLD solutions, the XC2C512-10FT256I stands out for its low power consumption and advanced features. Many CPLDs lack the Fast Zero Power (FZP) technology, which gives this chip an edge in energy efficiency. Its ability to support multiple I/O standards also sets it apart, as not all CPLDs offer this level of flexibility.

However, larger FPGAs may provide more resources for highly complex systems. If your application requires extensive logic or operates in extreme conditions, an FPGA might be a better fit. Despite this, the XC2C512-10FT256I remains a strong contender for low power applications that prioritize efficiency and compact design.


The XC2C512-10FT256I offers a powerful solution for low power applications. Its optimized 1.8V operation, Fast Zero Power (FZP) technology, and multi-voltage I/O compatibility make it ideal for energy-efficient designs. You can enhance performance by leveraging features like advanced clocking and power-saving modes.

FeatureDescription
Operating VoltageOptimized for 1.8V systems
Power EfficiencyIndustry’s fastest low power CPLD
Macrocell DensityDensities from 32 to 512 macrocells
CMOS TechnologyIndustry’s best 0.18 micron CMOS CPLD

Explore its potential to create innovative, low power designs that maximize efficiency and reliability.

FAQ

1. What makes the XC2C512-10FT256I ideal for low power applications?

The XC2C512-10FT256I uses Fast Zero Power (FZP) technology, which minimizes power consumption during idle states. Its low standby power and support for multiple I/O standards make it perfect for energy-efficient designs like IoT devices and portable electronics.


2. Can you program the XC2C512-10FT256I in-system?

Yes, you can program it in-system using the IEEE 1532 (JTAG) interface. This feature allows you to update or reconfigure the chip without removing it from the device, saving time and effort.


3. How does the chip handle multiple voltage levels?

The XC2C512-10FT256I supports multi-voltage I/O banks, allowing you to connect components with different voltage requirements. This eliminates the need for external level shifters, simplifying your design and reducing power consumption.


4. Is the XC2C512-10FT256I suitable for wearable devices?

Absolutely! Its compact size, low power consumption, and ability to operate at low voltages make it an excellent choice for wearable technology like fitness trackers and smartwatches.


5. What are the temperature limits for the XC2C512-10FT256I?

The chip operates reliably within a temperature range of -40°C to 85°C. This makes it suitable for most consumer and industrial applications, though it may not perform well in extreme environments.

Tip: Always check the datasheet for detailed specifications before integrating the chip into your design.

Specifications

Xilinx Inc. XC2C512-10FT256I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2C512-10FT256I.
  • Type
    Parameter
  • Factory Lead Time
    10 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    256-LBGA
  • Number of Pins
    256
  • Number of I/Os
    212
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    CoolRunner II
  • Published
    1997
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e0
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    no
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A991.D
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Lead (Sn63Pb37)
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    YES
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    240
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.8V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    XC2C512
  • Pin Count

    a count of all of the component leads (or pins)

    256
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.8V
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    1.9V
  • Programmable Type

    These include Field Programmable Logic Devices (FPGAs), Complex Programmable Logic Devices (CPLD) and Programmable Logic Devices (PLD, PLA, PAL, GAL). There are also devices that are the analog equivalent of these called field programmable analog arrays.

    In System Programmable
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    10 ns
  • Number of Logic Elements/Cells
    32
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    12000
  • Max Frequency

    Max Frequency refers to the highest frequency at which an electronic component can operate effectively without degradation of performance. It is a critical parameter for devices such as transistors, capacitors, and oscillators, indicating their limitations in speed and response time. Exceeding the max frequency can lead to issues like signal distortion, heat generation, and potential failure of the component. Understanding this parameter is essential for designing circuits to ensure reliable and efficient operation.

    128MHz
  • Speed Grade

    Speed grade is a specification in electronic components that indicates the maximum operating speed at which the component can reliably function. It is commonly used for integrated circuits, particularly in digital logic devices and programmable logic devices. The speed grade is typically denoted by a number or letter code that correlates to the maximum frequency or propagation delay of the device, influencing its performance in high-speed applications. Components with higher speed grades are capable of faster processing and lower signal delay compared to those with lower grades.

    10
  • Output Function

    An output function is a function that an optimization function calls at each iteration of its algorithm. Typically, you use an output function to generate graphical output, record the history of the data the algorithm generates, or halt the algorithm based on the data at the current iteration.

    MACROCELL
  • Number of Macro Cells
    512
  • JTAG BST

    JTAG BST stands for Joint Test Action Group Boundary Scan Test. It is a testing technique used in electronic components to verify the functionality of integrated circuits on a printed circuit board. The JTAG BST method allows for testing of individual components without the need for physical access to the pins of the component, making it a valuable tool for debugging and testing complex electronic systems. By using a standardized test access port and a set of test logic, JTAG BST can help identify faults, shorts, and other issues in electronic components quickly and efficiently.

    YES
  • Voltage Supply - Internal

    Voltage Supply - Internal is a parameter in electronic components that refers to the internal voltage supply required for the proper functioning of the component. This voltage supply is typically generated within the component itself and is used to power its internal circuitry. It is important for the component to receive the correct internal voltage supply to ensure reliable operation and performance. The specified voltage supply range for a component must be adhered to in order to prevent damage or malfunction. Manufacturers provide this information in the component's datasheet to guide users in proper integration and usage.

    1.7V~1.9V
  • Delay Time tpd(1) Max

    The parameter "Delay Time tpd(1) Max" in electronic components refers to the maximum time delay between the input signal changing and the output signal responding. It represents the longest time it takes for the output to change after a change in the input signal. This parameter is crucial in determining the speed and performance of the component in various electronic circuits. A longer delay time can result in slower response times and potentially impact the overall functionality of the circuit. It is important to consider this parameter when designing or selecting electronic components to ensure proper operation and timing requirements are met.

    9.2ns
  • Length
    17mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    1.55mm
  • Width
    17mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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XC2C512-10FT256I

Xilinx Inc.

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